Intel Processor 300 vs Qualcomm Snapdragon X2E-78-100 Comparison

Intel
INTEL

Intel Processor 300

CORE STATE Raptor Lake-S
CORE SPECS 2 Cores / 4 Threads
CLOCK SPEED 3.9 Base
CACHE 6 MB (shared)
MAX TDP 46W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X2E-78-100

CORE STATE Glymur
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 4 Base
CACHE
MAX TDP
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Processor 300 vs Qualcomm Snapdragon X2E-78-100

Intel Processor 300 and Qualcomm Snapdragon X2E-78-100 occupy opposite ends of the computing spectrum, one a low-cost desktop part, the other a premium mobile SoC. The recorded data shows two processors with different core counts, process nodes, memory paths, and market targets. No direct head-to-head benchmark scores exist in the database, and neither processor has an average benchmark score recorded. The analysis below relies entirely on the specification fields and the percentile ranking shared by both parts.

Where Each One Wins

The Intel Processor 300 is built for desktop systems using Intel Socket 1700. It is a 2-core, 4-thread processor based on Raptor Lake, with a base clock of 3.90 GHz and no boost clock listed. Its market segment is Desktop, and it uses a 46 W TDP. This part suits single-socket desktop builds where the user requires a basic CPU with integrated graphics and PCIe Gen 5 connectivity. The processor supports DDR4 and DDR5 memory, giving system builders flexibility in platform choice. Its production status is Active, and it was released on 2024-01-07. The launch MSRP is $82.

The Qualcomm Snapdragon X2E-78-100 targets the Mobile segment. It has 12 cores and 12 threads, meaning no hyper-threading or equivalent SMT implementation. The base clock is 4.00 GHz, slightly higher than the Intel part, but there is no boost clock listed. The Snapdragon uses Qualcomm BGA 2343 socket, a 3 nm process from TSMC, and a 220 mm² die size. It supports LPDDR5X memory with a recorded memory bandwidth of 152.4 GB/s, a substantial figure compared to the Intel part which has no memory bandwidth value in the database. The integrated graphics are Adreno X2-85, while the Intel part uses UHD Graphics 710. The Snapdragon has 12 PCIe Gen 5 lanes (CPU only), compared to 16 lanes on the Intel processor.

The data indicates the Intel Processor 300 wins in scenarios requiring a low-cost desktop CPU with dual-channel DDR4 or DDR5 support and a standard socket. The Snapdragon X2E-78-100 wins in mobile environments where 12 cores, a 3 nm node, and high memory bandwidth matter. The Intel part has a higher lane count for PCIe Gen 5 (16 vs 12), which could benefit desktop configurations with multiple expansion devices. The Snapdragon has no TDP value recorded, so thermal comparison is not possible from the database.

Architecture Differences

The two processors come from different manufacturers and use completely different architectures. Intel Processor 300 uses Raptor Lake, specifically Raptor Lake-S, built on a 10 nm process at Intel's foundry. The die size is 163 mm². The Snapdragon X2E-78-100 uses the Glymur codename, part of the Snapdragon X2 (Elite) generation, built on a 3 nm process at TSMC. The die size is 220 mm². The process node difference is significant: 10 nm versus 3 nm, which indicates a generational gap in manufacturing technology.

Cache hierarchies differ sharply. The Intel Processor 300 has 80 KB L1 per core, 1.25 MB L2 per core, and 6 MB shared L3 cache. The Snapdragon X2E-78-100 has 288 KB L1 per core and 16 MB shared L2 cache, with no L3 cache listed. The Snapdragon's per-core L1 is 3.6 times larger than the Intel's per-core L1 (288 KB vs 80 KB). The L2 cache arrangement is also different: Intel uses per-core L2, while Qualcomm uses a 16 MB shared L2 pool. The Intel part has a dedicated L3 cache, while the Snapdragon has no L3 recorded.

The foundry and process node affect power and transistor density, though no transistor counts are recorded for either part. The Intel processor has a 46 W TDP, while the Snapdragon has no TDP value in the database. The Snapdragon's 3 nm node from TSMC likely allows more cores (12) within a 220 mm² die, while Intel's 10 nm node fits 2 cores in 163 mm². The memory support differs: Intel supports DDR4 and DDR5, while Qualcomm supports LPDDR5X only. The Snapdragon records a memory bandwidth of 152.4 GB/s; the Intel part has no bandwidth figure recorded.

Integrated graphics also differ: Intel uses UHD Graphics 710, while Qualcomm uses Adreno X2-85. Both parts have no boost clock listed, so maximum frequency behavior is not recorded. Neither processor has an unlocked multiplier, as both have multiplierUnlocked set to false.

Head-to-Head Benchmarks

The database contains no head-to-head benchmark entries for these two processors. The headToHeadBenchmarks field is empty, and both processors have an avgBenchmarkScore of 0 with no individual benchmark results. The percentileVsAllCpus field is 50 for both, indicating they sit at the median of all CPUs in the database, but this value is identical and does not reveal relative performance between the two.

Without recorded benchmark scores, the comparison must rely on architectural and specification data. The Snapdragon X2E-78-100 has 12 cores versus 2 cores on the Intel Processor 300. In multi-threaded workloads, the core count difference suggests the Snapdragon would process more parallel tasks, but no measurement confirms this. The Intel part has 4 threads via hyper-threading, giving a 2:1 thread-to-core ratio, while the Snapdragon has 12 threads across 12 cores, a 1:1 ratio.

Base clock speeds are close: 3.90 GHz for Intel, 4.00 GHz for Qualcomm. The Snapdragon has a 0.10 GHz higher base clock. Neither part has a boost clock listed, so peak single-core frequency cannot be compared. The Intel part has a larger PCIe Gen 5 lane allocation (16 lanes) versus the Snapdragon's 12 lanes, which may favor the Intel part in systems with multiple PCIe devices.

Memory bandwidth is a clear differentiator: the Snapdragon records 152.4 GB/s, while the Intel part has no bandwidth figure. The Snapdragon's LPDDR5X support and 152.4 GB/s figure indicate a high-bandwidth memory subsystem, likely beneficial for integrated graphics and memory-intensive tasks. The Intel part supports DDR4 and DDR5 but has no bandwidth measurement recorded.

The die size difference (163 mm² vs 220 mm²) and process node difference (10 nm vs 3 nm) suggest the Snapdragon uses a more advanced manufacturing process, but no performance numbers quantify the impact. The cache hierarchy shows the Snapdragon has 16 MB shared L2 versus the Intel's 1.25 MB per core L2 and 6 MB shared L3. In total cache, the Intel part has 1.25 MB per core for two cores (2.5 MB L2 total) plus 6 MB L3, while the Snapdragon has 16 MB shared L2 and no L3. The Snapdragon's cache configuration is larger in L2 capacity.

Specification Differences

The two processors differ in nearly every major specification field.

  • Manufacturer: Intel for the Processor 300; the Snapdragon X2E-78-100 lists manufacturer as Unknown in the database.
  • Cores: 2 (Intel) vs 12 (Qualcomm).
  • Threads: 4 (Intel) vs 12 (Qualcomm).
  • Base clock: 3.90 GHz (Intel) vs 4.00 GHz (Qualcomm).
  • Boost clock: not listed for either.
  • TDP: 46 W (Intel); no value for Qualcomm.
  • Socket: Intel Socket 1700 vs Qualcomm BGA 2343.
  • Architecture: Raptor Lake (Intel) vs not listed (Qualcomm).
  • Codename: Raptor Lake-S (Intel) vs Glymur (Qualcomm).
  • Generation: Intel Processor (Raptor Lake) vs Snapdragon X2 (Elite).
  • Process node: 10 nm (Intel) vs 3 nm (Qualcomm).
  • Foundry: Intel vs TSMC.
  • Die size: 163 mm² (Intel) vs 220 mm² (Qualcomm).
  • L1 cache: 80 KB per core (Intel) vs 288 KB per core (Qualcomm).
  • L2 cache: 1.25 MB per core (Intel) vs 16 MB shared (Qualcomm).
  • L3 cache: 6 MB shared (Intel) vs none listed (Qualcomm).
  • Memory support: DDR4, DDR5 (Intel) vs LPDDR5X (Qualcomm).
  • Memory bus: Dual-channel for both.
  • Memory bandwidth: not listed (Intel) vs 152.4 GB/s (Qualcomm).
  • ECC memory: false for both.
  • PCIe: Gen 5, 16 Lanes CPU only (Intel) vs Gen 5, 12 Lanes CPU only (Qualcomm).
  • Integrated graphics: UHD Graphics 710 (Intel) vs Adreno X2-85 (Qualcomm).
  • Market segment: Desktop (Intel) vs Mobile (Qualcomm).
  • Production status: Active for both.
  • Release date: 2024-01-07 (Intel) vs 2026-04-05 (Qualcomm).
  • Launch MSRP: $82 (Intel); none for Qualcomm.
  • Multiplier unlocked: false for both.
  • Part number: SRN3J (Intel) vs X2E78100 (Qualcomm).

The Intel part is a desktop processor with a 46 W TDP, DDR4/DDR5 support, and 16 PCIe Gen 5 lanes. The Qualcomm part is a mobile processor with 12 cores, LPDDR5X support, and 12 PCIe Gen 5 lanes. The Intel part has a recorded launch MSRP of $82, while the Qualcomm part has none.

FAQ

Q: How many cores does each processor have?

A: The Intel Processor 300 has 2 cores and 4 threads. The Qualcomm Snapdragon X2E-78-100 has 12 cores and 12 threads.

Q: What process nodes are used?

A: The Intel Processor 300 uses a 10 nm process from Intel. The Qualcomm Snapdragon X2E-78-100 uses a 3 nm process from TSMC.

Q: Which processor supports higher memory bandwidth?

A: The Qualcomm Snapdragon X2E-78-100 records a memory bandwidth of 152.4 GB/s with LPDDR5X support. The Intel Processor 300 supports DDR4 and DDR5 but has no memory bandwidth value in the database.

Q: What are the cache configurations?

A: The Intel Processor 300 has 80 KB L1 per core, 1.25 MB L2 per core, and 6 MB shared L3. The Qualcomm Snapdragon X2E-78-100 has 288 KB L1 per core and 16 MB shared L2, with no L3 cache listed.

Q: What is the release date for each?

A: The Intel Processor 300 was released on 2024-01-07. The Qualcomm Snapdragon X2E-78-100 was released on 2026-04-05.

Q: Do either support ECC memory?

A: No, both the Intel Processor 300 and the Qualcomm Snapdragon X2E-78-100 have ECC memory support set to false.

Q: What PCIe configurations are available?

A: The Intel Processor 300 provides PCIe Gen 5 with 16 lanes (CPU only). The Qualcomm Snapdragon X2E-78-100 provides PCIe Gen 5 with 12 lanes (CPU only).

Q: Are the multipliers unlocked?

A: No, both processors have multiplierUnlocked set to false.

Q: What integrated graphics are included?

A: The Intel Processor 300 includes UHD Graphics 710. The Qualcomm Snapdragon X2E-78-100 includes Adreno X2-85.

Q: What is the market segment for each?

A: The Intel Processor 300 is classified as Desktop. The Qualcomm Snapdragon X2E-78-100 is classified as Mobile.

DETAILED SPECIFICATIONS

SPECIFICATION
Processor 300
Snapdragon X2E-78-100
Core Specs
Cores
2
12 +500.0%
Threads
4
12 +200.0%
Base Clock (GHz)
3.9
4 +2.6%
Frequency (GHz)
3.9
4 +2.6%
Multiplier
39
40 +2.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
16 MB (shared)
L3 Cache
6 MB (shared)
Power
TDP (W)
46
PL1
46 W
PL2
46 W
Architecture
Architecture
Raptor Lake
Codename
Raptor Lake-S
Glymur
Generation
Intel Processor (Raptor Lake)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
163 mm²
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
152.4 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
DDR5 Speed
4800 MT/s
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
Chipsets
Intel 600 Series, Intel 700 Series
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
6 + 6
E-Core Frequency
3.4 GHz
AI/NPU
NPU
Yes / 80 TOPS
Graphics
Integrated Graphics
UHD Graphics 710
Adreno X2-85
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$82
Part Number
SRN3J
X2E78100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
Bundled Cooler
Laminar RM1
View Processor 300 Details View Snapdragon X2E-78-100 Details