Intel Processor 300 vs Qualcomm Snapdragon X1P-46-100 Comparison

Intel
INTEL

Intel Processor 300

CORE STATE Raptor Lake-S
CORE SPECS 2 Cores / 4 Threads
CLOCK SPEED 3.9 Base
CACHE 6 MB (shared)
MAX TDP 46W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X1P-46-100

CORE STATE Oryon
CORE SPECS 8 Cores / 8 Threads
CLOCK SPEED 3.4 Base / 4 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 30W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

Analysis: Intel Processor 300 vs Qualcomm Snapdragon X1P-46-100

FAQ

Q: What are the core and thread counts of these two processors?

A: The Intel Processor 300 has 2 cores and 4 threads, while the Qualcomm Snapdragon X1P-46-100 has 8 cores and 8 threads.

Q: What is the base clock speed for each chip?

A: The Intel Processor 300 runs at a base clock of 3.90 GHz, and the Qualcomm Snapdragon X1P-46-100 runs at 3.40 GHz. The Qualcomm part also has a boost clock of 4.00 GHz, while the Intel processor does not list a boost clock.

Q: Which processor has a smaller manufacturing process?

A: The Qualcomm Snapdragon X1P-46-100 is built on a 4 nm process by TSMC, whereas the Intel Processor 300 uses a 10 nm process from Intel.

Q: What memory types does each processor support?

A: The Intel Processor 300 supports DDR4 and DDR5 memory in a dual-channel configuration. The Qualcomm Snapdragon X1P-46-100 supports LPDDR5X memory, also dual-channel, and has a listed memory bandwidth of 135.2 GB/s.

Q: What are the market segments for these two chips?

A: The Intel Processor 300 is classified as a Desktop processor, while the Qualcomm Snapdragon X1P-46-100 is classified as a Mobile processor.

Q: When were these processors released?

A: The Intel Processor 300 was released on 2024-01-07, and the Qualcomm Snapdragon X1P-46-100 was released later, on 2024-09-02.

Architecture Differences

The Intel Processor 300 and the Qualcomm Snapdragon X1P-46-100 represent two fundamentally different design philosophies. The Intel chip uses the Raptor Lake architecture, specifically the Raptor Lake-S die, and is manufactured on a 10 nm process at Intel's own foundry. The Qualcomm part uses the Oryon codename architecture, is built on a 4 nm process by TSMC, and belongs to the Snapdragon X (Plus) generation.

Core organization differs substantially. The Intel Processor 300 has 2 physical cores with 4 threads via Hyper-Threading, while the Qualcomm Snapdragon X1P-46-100 has 8 physical cores and 8 threads, meaning no simultaneous multithreading on the latter. The cache hierarchy is also distinct. The Intel chip provides 80 KB of L1 cache per core, 1.25 MB of L2 per core, and 6 MB of shared L3 cache. The Qualcomm part has a much larger L1 at 288 KB per core and 12 MB of L2 per module, but it shares the same 6 MB of L3 cache as the Intel part.

The process node difference is significant. A 4 nm process typically allows for higher transistor density and better power efficiency compared to a 10 nm process. This is reflected in the power envelopes: the Intel Processor 300 has a TDP of 46, while the Qualcomm Snapdragon X1P-46-100 has a TDP of 30. Despite having four times the cores, the Qualcomm chip draws less thermal power according to the recorded specifications.

Memory support further separates the two. The Intel processor supports DDR4 and DDR5, giving desktop builders flexibility across older and newer memory standards. The Qualcomm chip is limited to LPDDR5X, a mobile-focused memory type, and has a rated memory bandwidth of 135.2 GB/s. The Intel chip's memory bandwidth is not listed in the database.

PCIe connectivity differs as well. The Intel Processor 300 provides Gen 5 with 16 lanes (CPU only), while the Qualcomm Snapdragon X1P-46-100 offers Gen 4 with 12 lanes (CPU only). Integrated graphics also vary: the Intel chip includes UHD Graphics 710, whereas the Qualcomm part has Adreno X1-45.

The Intel processor uses Intel Socket 1700, and the Qualcomm chip uses Qualcomm BGA 2073. The die size for the Intel part is 163 mm², while the Qualcomm die size is not recorded. Neither chip has an unlocked multiplier. The Intel Processor 300 has a launch MSRP of $82, and the Qualcomm part has no listed launch MSRP.

Head-to-Head Benchmarks

The database contains no recorded benchmark scores for either the Intel Processor 300 or the Qualcomm Snapdragon X1P-46-100. Both chips have an average benchmark score of 0, and both sit at the 50th percentile among all CPUs in the database. This means the measured performance data is not yet available to draw direct comparisons from.

Without recorded benchmark results, the comparison must rely on architectural specifications. The Qualcomm Snapdragon X1P-46-100 delivers 8 cores versus 2 cores on the Intel Processor 300. For multi-threaded workloads, the core count difference suggests a large advantage for the Qualcomm part, though no numeric score confirms it. The Intel chip's 4 threads versus the Qualcomm chip's 8 threads further underscores the gap in parallel processing capacity.

Clock speed favors the Intel chip at base frequency: 3.90 GHz versus 3.40 GHz. However, the Qualcomm processor has a boost clock of 4.00 GHz, which exceeds the Intel base clock. The Intel part has no listed boost clock, so its maximum frequency is not documented in the database.

The Qualcomm chip's L1 and L2 caches are substantially larger. At 288 KB per core for L1 and 12 MB per module for L2, the Qualcomm design provides more on-die storage for frequently accessed data. The Intel chip's 80 KB L1 and 1.25 MB L2 per core are smaller, but the shared 6 MB L3 is identical between the two chips.

Memory bandwidth is another differentiator. The Qualcomm Snapdragon X1P-46-100 is rated at 135.2 GB/s, while the Intel Processor 300 has no memory bandwidth figure in the database. For memory-intensive tasks, the Qualcomm part appears positioned to move data faster, but again, no benchmark confirms this.

The database records zero wins for either processor in head-to-head matchups, and no nearest rivals are listed for either chip. The percentile ranking of 50 for both indicates they sit at the median of all CPUs in the database, but with no scores behind that ranking, the percentile offers limited interpretive value.

The Verdict

The recorded data indicates two processors aimed at entirely different segments. The Intel Processor 300 is a desktop part with 2 cores and 4 threads, a 3.90 GHz base clock, and support for DDR4 and DDR5 memory. The Qualcomm Snapdragon X1P-46-100 is a mobile part with 8 cores and 8 threads, a 3.40 GHz base clock, a 4.00 GHz boost clock, and LPDDR5X memory support.

For workloads that scale with core count, the Qualcomm chip has a clear structural advantage. Eight cores versus two cores means the Qualcomm part can handle more concurrent threads, and its 8 threads versus 4 threads reinforces that capability. The larger L1 and L2 caches on the Qualcomm chip also suggest better performance for cache-sensitive applications.

For single-threaded performance, the Intel Processor 300 has a higher base clock at 3.90 GHz compared to 3.40 GHz on the Qualcomm part. However, the Qualcomm chip's boost clock of 4.00 GHz exceeds that base figure, implying that under single-core boost conditions, the Qualcomm part may reach higher frequencies. The Intel chip has no listed boost clock, so its maximum frequency remains unknown.

Power efficiency leans toward the Qualcomm chip. A TDP of 30 versus 46, combined with a 4 nm process versus 10 nm, indicates the Qualcomm part likely delivers more performance per watt. The Intel chip's higher TDP and larger process node suggest it consumes more power for its level of performance.

Desktop builders seeking a low-cost entry point for Intel Socket 1700 motherboards would find the Intel Processor 300's launch MSRP of $82 a relevant data point. Mobile device designers would look to the Qualcomm Snapdragon X1P-46-100 for its integrated Adreno X1-45 graphics and LPDDR5X memory support.

The database shows neither chip with recorded benchmark scores, so the verdict rests on specifications alone. The Qualcomm part appears better suited for multi-threaded, power-sensitive mobile workloads. The Intel part appears better suited for basic desktop tasks where dual-channel DDR4 or DDR5 memory and a simple 2-core design suffice.

Specification Differences

| Specification | Intel Processor 300 | Qualcomm Snapdragon X1P-46-100 |

| --- | --- | --- |

| Cores | 2 | 8 |

| Threads | 4 | 8 |

| Base Clock | 3.90 GHz | 3.40 GHz |

| Boost Clock | None listed | 4.00 GHz |

| TDP | 46 | 30 |

| Socket | Intel Socket 1700 | Qualcomm BGA 2073 |

| Architecture | Raptor Lake | Oryon |

| Process Node | 10 nm | 4 nm |

| Foundry | Intel | TSMC |

| L1 Cache | 80 KB (per core) | 288 KB (per core) |

| L2 Cache | 1.25 MB (per core) | 12 MB (per module) |

| L3 Cache | 6 MB (shared) | 6 MB (shared) |

| Memory Support | DDR4, DDR5 | LPDDR5X |

| Memory Bandwidth | Not listed | 135.2 GB/s |

| PCIe | Gen 5, 16 Lanes (CPU only) | Gen 4, 12 Lanes (CPU only) |

| Integrated Graphics | UHD Graphics 710 | Adreno X1-45 |

| Market Segment | Desktop | Mobile |

| Release Date | 2024-01-07 | 2024-09-02 |

| Launch MSRP | $82 | None listed |

| Die Size | 163 mm² | Not listed |

| Part Number | SRN3J | X1P46100 |

Where Each One Wins

The Qualcomm Snapdragon X1P-46-100 wins on core count, offering 8 cores and 8 threads versus the Intel Processor 300's 2 cores and 4 threads. For multi-threaded applications, video encoding, compilation, or heavy multitasking, the Qualcomm part's parallel capacity is structurally superior. Its larger L1 cache at 288 KB per core and L2 cache at 12 MB per module also favor workloads that repeatedly access working sets.

The Qualcomm chip also wins on power efficiency based on TDP. At 30 watts versus 46 watts, the Qualcomm part delivers four times the core count with lower thermal design power. The 4 nm TSMC process, compared to Intel's 10 nm, supports this efficiency gap. Mobile devices require such low-power characteristics, and the Qualcomm chip's LPDDR5X memory and 135.2 GB/s bandwidth further align with mobile use cases.

The Intel Processor 300 wins on base clock speed. At 3.90 GHz, it outpaces the Qualcomm chip's 3.40 GHz base clock. For lightly threaded tasks, such as basic office work or legacy software that relies on a single thread, the Intel part may offer snappier responsiveness. Its support for DDR4 and DDR5 memory gives desktop builders more memory options, and its PCIe Gen 5 with 16 lanes exceeds the Qualcomm chip's Gen 4 with 12 lanes.

The Intel chip's desktop socket, Intel Socket 1700, makes it compatible with a wide range of desktop motherboards. Its launch MSRP of $82 positions it as an entry-level desktop option. The Qualcomm chip's BGA 2073 socket is soldered, typical for mobile designs, and it has no listed launch MSRP.

For integrated graphics, the Intel Processor 300 uses UHD Graphics 710, while the Qualcomm Snapdragon X1P-46-100 uses Adreno X1-45. The database does not provide performance scores for either GPU, so the comparison stops at naming the components.

The Intel chip's die size is recorded at 163 mm², while the Qualcomm die size is unknown. The Intel part's production status is Active, and the Qualcomm part's production status is also Active. Neither chip has an unlocked multiplier.

In summary, the data shows the Qualcomm Snapdragon X1P-46-100 winning for multi-core, mobile, and power-sensitive scenarios. The Intel Processor 300 wins for single-threaded base frequency, desktop compatibility, and memory flexibility. Both chips lack recorded benchmark scores, so these conclusions derive from the specification differences presented in the database.

DETAILED SPECIFICATIONS

SPECIFICATION
Processor 300
Snapdragon X1P-46-100
Core Specs
Cores
2
8 +300.0%
Threads
4
8 +100.0%
Base Clock (GHz)
3.9
3.4 -12.8%
Boost Clock (GHz)
4
Frequency (GHz)
3.9
3.4 -12.8%
Turbo Clock (GHz)
4
Multiplier
39
34 -12.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
12 MB (per module)
L3 Cache
6 MB (shared)
6 MB (shared)
Power
TDP (W)
46
30 -34.8%
PL1
46 W
PL2
46 W
35 W
Architecture
Architecture
Raptor Lake
Codename
Raptor Lake-S
Oryon
Generation
Intel Processor (Raptor Lake)
Snapdragon X (Plus)
Process Size
10 nm
4 nm
Die Size
163 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
135.2 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
DDR5 Speed
4800 MT/s
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2073
Chipsets
Intel 600 Series, Intel 700 Series
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
AI/NPU
NPU
Yes / 45 TOPS
Graphics
Integrated Graphics
UHD Graphics 710
Adreno X1-45
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$82
Part Number
SRN3J
X1P46100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
Bundled Cooler
Laminar RM1
View Processor 300 Details View Snapdragon X1P-46-100 Details