CPU Comparison
AMD
AMD Ryzen 9 9850HX
CORE STATE
Fire Range
CORE SPECS
12 Cores / 24 Threads
CLOCK SPEED
3 Base / 5.2 GHz Turbo
CACHE
64 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 5
PROCESS
4 nm
LAUNCH DATE
2025
VS
INTEL
Core Ultra 9 386H
CORE STATE
Panther Lake
CORE SPECS
16 Cores / 16 Threads
CLOCK SPEED
2.1 Base / 4.9 GHz Turbo
CACHE
18 MB (shared)
MAX TDP
45W
ARCHITECTURE
Panther Lake
PROCESS
3 nm
LAUNCH DATE
2026
DETAILED SPECIFICATIONS
SPECIFICATION
9 9850HX
Ultra 9 386H
Core Specs
Cores
12
16
+33.3%
Threads
24
16
-33.3%
Base Clock (GHz)
3
2.1
-30.0%
Boost Clock (GHz)
5.2
4.9
-5.8%
Frequency (GHz)
3
2.1
-30.0%
Turbo Clock (GHz)
5.2
4.9
-5.8%
Multiplier
30
21
-30.0%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
80 KB (per core)
192 KB (per core)
L2 Cache
1 MB (per core)
2.5 MB (per core)
L3 Cache
64 MB (shared)
18 MB (shared)
Power
TDP (W)
55
45
-18.2%
PPT
61-101 W
โ
Configurable TDP
45-75 W
โ
Architecture
Architecture
Zen 5
Panther Lake
Codename
Fire Range
Panther Lake
Generation
Ryzen 9
(Zen 5 (Fire Range))
Ultra 9 (Panther Lake-H)
Process Size
4 nm
3 nm
Transistors
16,630 million
โ
Die Size
2x 70.6 mmยฒ
โ
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR5, LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
115.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FL1
Intel BGA 2540
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 5, 12 Lanes (CPU only)
Intel Hybrid
Hybrid Cores
โ
P-Cores: 4 E-Cores: 12
E-Core Frequency
โ
1600 MHz up to 3.7 GHz
AMD Multi-Die
IO Process Size
6 nm
โ
AI/NPU
NPU
โ
Yes /50 TOPS
Graphics
Integrated Graphics
Radeon 610M
Intel Xe3 Graphics
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001366
SA4R5 Q9EH
Package
ยตFC-BGAFL1
FC-BGA
Tj Max
100ยฐC
100ยฐC
Bundled Cooler
None
โ