CPU Comparison

AMD
AMD

AMD Ryzen 9 9850HX

CORE STATE Fire Range
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3 Base / 5.2 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Core Ultra 9 275HX

CORE STATE Arrow Lake-HX
CORE SPECS 24 Cores / 24 Threads
CLOCK SPEED 2.7 Base / 5.4 GHz Turbo
CACHE 36 MB (shared)
MAX TDP 55W
ARCHITECTURE Arrow Lake
nm
PROCESS 3 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
N/A
4,839
cinebench_cinebench_r15_singlecore
N/A
683
cinebench_cinebench_r20_multicore
N/A
20,163
cinebench_cinebench_r20_singlecore
N/A
2,846
cinebench_cinebench_r23_multicore
N/A
48,008
cinebench_cinebench_r23_singlecore
N/A
6,777
passmark_data_compression
N/A
618,338
passmark_data_encryption
N/A
48,016
passmark_extended_instructions
N/A
47,687
passmark_find_prime_numbers
N/A
457
passmark_floating_point_math
N/A
193,324
passmark_integer_math
N/A
156,314
passmark_multithread
N/A
56,415
passmark_physics
N/A
3,377
passmark_random_string_sorting
N/A
75,710
passmark_single_thread
N/A
4,727
passmark_singlethread
N/A
4,727

DETAILED SPECIFICATIONS

SPECIFICATION
9 9850HX
Ultra 9 275HX
Core Specs
Cores
12
24 +100.0%
Threads
24
24 0.0%
Base Clock (GHz)
3
2.7 -10.0%
Boost Clock (GHz)
5.2
5.4 +3.8%
Frequency (GHz)
3
2.7 -10.0%
Turbo Clock (GHz)
5.2
5.4 +3.8%
Multiplier
30
27 -10.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
192 KB (per core)
L2 Cache
1 MB (per core)
3 MB (per core)
L3 Cache
64 MB (shared)
36 MB (shared)
Power
TDP (W)
55
55 0.0%
PL1
โ€”
55 W
PL2
โ€”
160 W
PPT
61-101 W
โ€”
Configurable TDP
45-75 W
โ€”
Architecture
Architecture
Zen 5
Arrow Lake
Codename
Fire Range
Arrow Lake-HX
Generation
Ryzen 9 (Zen 5 (Fire Range))
Ultra 9 (Arrow Lake-HX)
Process Size
4 nm
3 nm
Transistors
16,630 million
17,800 million
Die Size
2x 70.6 mmยฒ
243 mmยฒ
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
102.4 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FL1
Intel BGA 2114
Chipsets
โ€”
WM880, HM870
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 5, 20 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
โ€”
P-Cores: 8 E-Cores: 16
E-Core Frequency
โ€”
2.1 GHz up to 4.6 GHz
AMD Multi-Die
IO Process Size
6 nm
โ€”
AI/NPU
NPU
โ€”
Yes / 13 TOPS
Graphics
Integrated Graphics
Radeon 610M
Arc Xe-LPG Graphics 64EU
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001366
SRVFK
Package
ยตFC-BGAFL1
FC-BGA
Tj Max
100ยฐC
105ยฐC
Bundled Cooler
None
โ€”
View Ryzen 9 9850HX Details View Core Ultra 9 275HX Details