CPU Comparison

A

AMD

AMD

AMD EPYC 7352

CORE STATE Rome

CORE SPECS 24 Cores / 48 Threads

CLOCK SPEED 2.3 Base / 3.2 GHz Turbo

CACHE 32 MB (per die)

MAX TDP 155W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Core Ultra 9 275HX

CORE STATE Arrow Lake-HX

CORE SPECS 24 Cores / 24 Threads

CLOCK SPEED 2.7 Base / 5.4 GHz Turbo

CACHE 36 MB (shared)

MAX TDP 55W

ARCHITECTURE Arrow Lake

nm

PROCESS 3 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

3,458

4,839

cinebench_cinebench_r15_singlecore

488

683

cinebench_cinebench_r20_multicore

14,411

20,163

cinebench_cinebench_r20_singlecore

2,034

2,846

cinebench_cinebench_r23_multicore

34,314

48,008

cinebench_cinebench_r23_singlecore

4,844

6,777

passmark_data_compression

660,712

618,338

passmark_data_encryption

44,426

48,016

passmark_extended_instructions

40,203

47,687

passmark_find_prime_numbers

301

457

passmark_floating_point_math

87,969

193,324

passmark_integer_math

148,605

156,314

passmark_multithread

40,370

56,415

passmark_physics

2,688

3,377

passmark_random_string_sorting

69,231

75,710

passmark_single_thread

1,979

4,727

passmark_singlethread

1,979

4,727

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 7352

Ultra 9 275HX

Core Specs

Cores

24

24 0.0%

Threads

48

24 -50.0%

Base Clock (GHz)

2.3

2.7 +17.4%

Boost Clock (GHz)

3.2

5.4 +68.8%

Frequency (GHz)

2.3

2.7 +17.4%

Turbo Clock (GHz)

3.2

5.4 +68.8%

Multiplier

23

27 +17.4%

SMP CPUs

2

1 -50.0%

Cache

L1 Cache

96 KB (per core)

192 KB (per core)

L2 Cache

512 KB (per core)

3 MB (per core)

L3 Cache

32 MB (per die)

36 MB (shared)

Total L3

128 MB

—

Power

TDP (W)

155

55 -64.5%

PL1

—

55 W

PL2

—

160 W

Configurable TDP

180 W

—

Architecture

Architecture

Zen 2

Arrow Lake

Codename

Rome

Arrow Lake-HX

Generation

EPYC (Zen 2 (Rome))

Ultra 9 (Arrow Lake-HX)

Process Size

7 nm

3 nm

Transistors

15,200 million

17,800 million

Die Size

4x 74 mm²

243 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5

Memory Bus

Eight-channel

Dual-channel

Memory Bandwidth

204.8 GB/s

102.4 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket SP3

Intel BGA 2114

Chipsets

—

WM880, HM870

PCIe

Gen 4, 128 Lanes(CPU only)

Gen 5, 20 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

P-Cores: 8 E-Cores: 16

E-Core Frequency

—

2.1 GHz up to 4.6 GHz

AMD Multi-Die

CCDs

4

—

Cores per CCD

6

—

IO Process Size

14 nm

—

AI/NPU

NPU

—

Yes / 13 TOPS

Graphics

Integrated Graphics

—

Arc Xe-LPG Graphics 64EU

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$1350

—

Part Number

100-000000077

SRVFK

Package

FCLGA-4094

FC-BGA

Tj Max

—

105°C

View EPYC 7352 Details View Core Ultra 9 275HX Details