CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900X

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.8 Base / 4.6 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Core i7-9850H

CORE STATE Coffee Lake-HR

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 2.6 Base / 4.6 GHz Turbo

CACHE 12 MB (shared)

MAX TDP 45W

ARCHITECTURE Coffee Lake

nm

PROCESS 14 nm

LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,788

936

cinebench_cinebench_r15_singlecore

393

132

cinebench_cinebench_r20_multicore

11,618

3,903

cinebench_cinebench_r20_singlecore

1,640

550

cinebench_cinebench_r23_multicore

27,662

9,293

cinebench_cinebench_r23_singlecore

3,905

1,311

geekbench_multicore

9,924

5,052

geekbench_singlecore

1,708

1,387

passmark_data_compression

448,906

N/A

passmark_data_encryption

28,586

N/A

passmark_extended_instructions

29,221

N/A

passmark_find_prime_numbers

214

N/A

passmark_floating_point_math

58,434

N/A

passmark_integer_math

99,628

N/A

passmark_multithread

32,544

N/A

passmark_physics

1,794

N/A

passmark_random_string_sorting

48,300

N/A

passmark_single_thread

2,703

N/A

passmark_singlethread

2,703

N/A

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900X

i7-9850H

Core Specs

Cores

12

6 -50.0%

Threads

24

12 -50.0%

Base Clock (GHz)

3.8

2.6 -31.6%

Boost Clock (GHz)

4.6

4.6 0.0%

Frequency (GHz)

3.8

2.6 -31.6%

Turbo Clock (GHz)

4.6

4.6 0.0%

Multiplier

38

26 -31.6%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

256 KB (per core)

L3 Cache

64 MB

12 MB (shared)

Power

TDP (W)

105

45 -57.1%

PPT

142 W

—

Architecture

Architecture

Zen 2

Coffee Lake

Codename

Matisse

Coffee Lake-HR

Generation

Ryzen 9 (Zen 2 (Matisse))

Core i7 (Coffee Lake-HR)

Process Size

7 nm

14 nm

Transistors

7,600 million

—

Die Size

2x 74 mm²

149 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

42.7 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

Intel BGA 1440

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 3

AMD Multi-Die

IO Process Size

12 nm

—

Graphics

Integrated Graphics

—

UHD Graphics 630

Other

Market

Desktop

Mobile

Production Status

Active

End-of-life

Launch Price

$499

—

Part Number

100-000000023100-100000023BOX100-100000023MPK

SRFCN

Package

µOPGA-1331

FC-BGA1440

Tj Max

—

100°C

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