Intel Core 9 270H vs Qualcomm Snapdragon X2E-88-100 Comparison

Intel
INTEL

Intel Core 9 270H

CORE STATE Raptor Lake-H
CORE SPECS 14 Cores / 20 Threads
CLOCK SPEED 2.7 Base / 5.8 GHz Turbo
CACHE 24 MB (shared)
MAX TDP 45W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X2E-88-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4 Base / 4.7 GHz Turbo
CACHE —
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,464
N/A
cinebench_cinebench_r15_singlecore
347
N/A
cinebench_cinebench_r20_multicore
10,268
N/A
cinebench_cinebench_r20_singlecore
1,449
N/A
cinebench_cinebench_r23_multicore
18,000
N/A
cinebench_cinebench_r23_singlecore
2,040
N/A
passmark_data_compression
333,785
N/A
passmark_data_encryption
19,369
N/A
passmark_extended_instructions
20,079
N/A
passmark_find_prime_numbers
112
N/A
passmark_floating_point_math
70,640
N/A
passmark_integer_math
97,654
N/A
passmark_multithread
28,764
N/A
passmark_physics
1,966
N/A
passmark_random_string_sorting
36,867
N/A
passmark_single_thread
3,944
N/A
passmark_singlethread
3,944
N/A

Analysis: Intel Core 9 270H vs Qualcomm Snapdragon X2E-88-100

Where Each One Wins

The recorded data splits sharply between these two mobile processors. The Intel Core 9 270H arrives with a full suite of 17 benchmark results across Cinebench R15, R20, R23, and Passmark workloads. The Qualcomm Snapdragon X2E-88-100 has no recorded benchmark scores in the database, which means every measured performance comparison currently favors Intel by default.

The Intel part wins on raw throughput in every category where numbers exist. Its Cinebench R23 multicore score of 18000 and single-core score of 2040 establish a baseline for heavy threaded and light threaded work. The Passmark suite reinforces this: integer math at 97654, floating point math at 70640, and multithread at 28764. The Qualcomm chip cannot be positioned against these figures because the database contains no corresponding measurements.

The Snapdragon X2E-88-100 wins on process technology and platform features. It uses a 3 nm node from TSMC with a die size of 220 mm², while the Intel processor uses Intel's 10 nm node. The Qualcomm part also supports 12 PCIe Gen 5 lanes (CPU only) versus 8 lanes on the Intel chip, and its memory bandwidth is listed at 152.4 GB/s whereas the Intel chip has no bandwidth figure recorded. These are specification wins, not benchmark wins.

For use-case separation, the Intel chip is the only one with demonstrated performance data. Its percentile ranking of 86 against all CPUs places it well above the Qualcomm part's 50th percentile. The average benchmark score of 38335 for Intel stands against a null average for Qualcomm. The nearest rivals for Intel include the Intel Core Ultra 9 285H at 38312 average score (0.1% behind), the Intel Xeon w3-2525 at 38392 (0.1% ahead), the Intel Core i5-13600HX at 38261 (0.2% behind), and the AMD Ryzen 7 250 at 38221 (0.3% behind). These deltas show the Intel part sits in a tight cluster, with no rival more than 0.3% away.

Architecture Differences

The two chips come from fundamentally different design schools. The Intel Core 9 270H uses the Raptor Lake architecture, specifically Raptor Lake-H, and belongs to the Core 9 (Raptor Lake Refresh) generation. It packs 14 cores and 20 threads, built on Intel's 10 nm process at Intel's own foundry. The cache hierarchy uses 80 KB of L1 per core, 2 MB of L2 per core, and 24 MB of shared L3 cache.

The Qualcomm Snapdragon X2E-88-100 uses the Glymur codename and belongs to the Snapdragon X2 (Elite) generation. It has 18 cores and 18 threads, which means no simultaneous multithreading: each core corresponds to exactly one thread. The process node is 3 nm, fabricated by TSMC, with a die size of 220 mm². Its cache structure is organized differently: 288 KB of L1 per core and 16 MB of L2 per module, with no L3 cache listed.

The Intel chip runs at a base clock of 2.70 GHz and boosts to 5.80 GHz. The Qualcomm part starts at 4.00 GHz base and boosts to 4.70 GHz. The Intel chip has a 45 W TDP; the Qualcomm chip has no TDP recorded in the database.

Memory support differs as well. Intel supports DDR4 and DDR5 in a dual-channel configuration, with ECC not supported. Qualcomm supports LPDDR5X in dual-channel, also without ECC. The memory bus for both is dual-channel, but Qualcomm lists a specific bandwidth of 152.4 GB/s while Intel does not.

The integrated graphics also diverge. Intel uses Iris Xe Graphics with 96 execution units. Qualcomm uses the Adreno X2-90. Both are mobile parts, both are currently marked Active in production status, and neither has an unlocked multiplier.

The sockets are incompatible: Intel BGA 1744 for the Intel chip, Qualcomm BGA 2343 for the Snapdragon. The Intel part has a launch MSRP of $697 and a part number of SRQ6V, released on 2024-12-17. The Qualcomm part has no launch MSRP listed and part number X2E88100, released on 2026-04-05.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-88-100 has 18 cores, while the Intel Core 9 270H has 14 cores. However, the Intel chip supports 20 threads versus 18 threads for Qualcomm, because Intel uses simultaneous multithreading and Qualcomm does not.

Q: What is the difference in process node?

A: The Intel Core 9 270H is built on Intel's 10 nm process at Intel's foundry. The Qualcomm Snapdragon X2E-88-100 is built on TSMC's 3 nm process with a die size of 220 mm².

Q: How do the benchmark scores compare?

A: The database contains no benchmark scores for the Qualcomm Snapdragon X2E-88-100. The Intel Core 9 270H has 17 recorded results, including a Cinebench R23 multicore score of 18000 and a Passmark single-thread score of 3944.

Q: What memory types does each processor support?

A: The Intel Core 9 270H supports DDR4 and DDR5 in dual-channel mode. The Qualcomm Snapdragon X2E-88-100 supports LPDDR5X in dual-channel mode with a listed bandwidth of 152.4 GB/s.

Q: What is the Intel processor's percentile ranking?

A: The Intel Core 9 270H sits at the 86th percentile against all CPUs. The Qualcomm Snapdragon X2E-88-100 sits at the 50th percentile.

Q: Do both processors have integrated graphics?

A: Yes. The Intel Core 9 270H uses Iris Xe Graphics with 96 execution units. The Qualcomm Snapdragon X2E-88-100 uses the Adreno X2-90 GPU.

Specification Differences

The two processors differ across nearly every major specification in the database.

The Intel Core 9 270H uses 14 cores and 20 threads, while the Qualcomm Snapdragon X2E-88-100 uses 18 cores and 18 threads. Base clocks are 2.70 GHz for Intel and 4.00 GHz for Qualcomm. Boost clocks are 5.80 GHz for Intel and 4.70 GHz for Qualcomm. The Intel TDP is 45 W; the Qualcomm TDP is not recorded.

The socket is Intel BGA 1744 for Intel and Qualcomm BGA 2343 for Qualcomm. The Intel architecture is Raptor Lake with the Raptor Lake-H codename, while the Qualcomm architecture field is null but its codename is Glymur. The generation field reads Core 9 (Raptor Lake Refresh) for Intel and Snapdragon X2 (Elite) for Qualcomm.

Process node: 10 nm from Intel's foundry versus 3 nm from TSMC. The Qualcomm die size is 220 mm²; the Intel die size is not recorded. Transistor counts are absent for both.

Cache configurations diverge: Intel has 80 KB L1 per core, 2 MB L2 per core, and 24 MB shared L3. Qualcomm has 288 KB L1 per core and 16 MB L2 per module, with no L3 listed.

Memory support: DDR4 and DDR5 for Intel, LPDDR5X for Qualcomm. Both are dual-channel. Memory bandwidth is 152.4 GB/s for Qualcomm, not recorded for Intel. ECC is false for both.

PCIe: Intel has Gen 5 with 8 lanes (CPU only). Qualcomm has Gen 5 with 12 lanes (CPU only).

Integrated graphics: Iris Xe Graphics 96EU for Intel, Adreno X2-90 for Qualcomm.

Release dates: Intel on 2024-12-17, Qualcomm on 2026-04-05. The Intel launch MSRP is $697; the Qualcomm chip has no launch MSRP. Part numbers are SRQ6V for Intel and X2E88100 for Qualcomm.

The Intel processor has an average benchmark score of 38335 and a percentile rank of 86. The Qualcomm processor has an average benchmark score of 0 and a percentile rank of 50.

Head-to-Head Benchmarks

The head-to-head benchmark table in the database is empty, so no direct pairwise comparisons exist between the Intel Core 9 270H and the Qualcomm Snapdragon X2E-88-100. The analysis must rely on the Intel chip's standalone scores and the Qualcomm chip's absence of scores.

The Intel Core 9 270H delivers a Cinebench R23 multicore score of 18000 and a single-core score of 2040. In Cinebench R20, it scores 10268 multicore and 1449 single-core. In Cinebench R15, it scores 2464 multicore and 347 single-core. These results indicate strong scaling from the 14 cores and 20 threads, with the 5.80 GHz boost clock driving the single-core numbers.

The Passmark suite provides additional detail. The multithread score is 28764, the single-thread score is 3944, and the average benchmark score sits at 38335. Data compression reaches 333785, data encryption hits 19369, and extended instructions score 20079. Find prime numbers comes in at 112, floating point math at 70640, integer math at 97654, physics at 1966, and random string sorting at 36867.

The single-thread score appears twice in the database, once as passmark_single_thread and once as passmark_singlethread, both at 3944. This duplication does not change the interpretation: the Intel part sustains competitive single-thread performance.

The nearest rivals for the Intel chip show how tightly packed the field is. The Intel Core Ultra 9 285H averages 38312, which is 0.1% behind the Core 9 270H. The Intel Xeon w3-2525 averages 38392, 0.1% ahead. The Intel Core i5-13600HX averages 38261, 0.2% behind. The AMD Ryzen 7 250 averages 38221, 0.3% behind. These deltas are small enough that workload-specific behavior, not average score, would separate them in practice.

The Qualcomm Snapdragon X2E-88-100 has no benchmark entries, no average score, and no nearest rivals in the database. Its 50th percentile ranking suggests it sits near the median of all CPUs, but without measured scores the database cannot quantify its performance relative to the Intel part. The 18 cores and 4.00 GHz base clock imply a design aimed at sustained throughput, and the 152.4 GB/s memory bandwidth indicates a platform built for memory-heavy workloads, but these are specifications rather than verified results.

The Intel chip's 86th percentile versus the Qualcomm chip's 50th percentile is the only direct ranking comparison available. The 38335 average benchmark score for Intel, against a null value for Qualcomm, reinforces the same conclusion. Any head-to-head verdict must therefore rest on the Intel part's measured results and the Qualcomm part's lack of recorded data. The benchmark database currently supports only one side of this comparison.

DETAILED SPECIFICATIONS

SPECIFICATION
9 270H
Snapdragon X2E-88-100
Core Specs
Cores
14
18 +28.6%
Threads
20
18 -10.0%
Base Clock (GHz)
2.7
4 +48.1%
Boost Clock (GHz)
5.8
4.7 -19.0%
Frequency (GHz)
2.7
4 +48.1%
Turbo Clock (GHz)
5.8
4.7 -19.0%
Multiplier
27
40 +48.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
2 MB (per core)
16 MB (per module)
L3 Cache
24 MB (shared)
—
Power
TDP (W)
45
—
PL1
45 W
—
PL2
115 W
—
Architecture
Architecture
Raptor Lake
—
Codename
Raptor Lake-H
Glymur
Generation
Core 9 (Raptor Lake Refresh)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
—
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
—
152.4 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
—
DDR5 Speed
5200 MT/s
—
Platform
Socket
Intel BGA 1744
Qualcomm BGA 2343
Chipsets
WM790, HM770
—
PCIe
Gen 5, 8 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 6 E-Cores: 8
12 + 6
E-Core Frequency
2000 MHz up to 4.1 GHz
3.4 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
Iris Xe Graphics 96EU
Adreno X2-90
Other
Market
Mobile
Mobile
Production Status
Active
Active
Launch Price
$697
—
Part Number
SRQ6V
X2E88100
Package
FC-BGA16F
FC-BGA
Tj Max
100°C
—
View Core 9 270H Details View Snapdragon X2E-88-100 Details