Intel Core 7 150UL vs Qualcomm Snapdragon X2E-94-100 Comparison

Intel
INTEL

Intel Core 7 150UL

CORE STATE Raptor Lake-PS
CORE SPECS 10 Cores / 12 Threads
CLOCK SPEED 1.7 Base / 5 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 15W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X2E-94-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4.45 Base / 4.7 GHz Turbo
CACHE 9 MB (shared)
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Core 7 150UL vs Qualcomm Snapdragon X2E-94-100

Head-to-Head Benchmarks

The recorded database does not contain direct head-to-head benchmark comparisons between the Intel Core 7 150UL and the Qualcomm Snapdragon X2E-94-100. Both processors have an empty benchmark results array, and the wins tally for each is zero. This means there are no measured scores to compare, no multi-core deltas, and no percentile shifts to report from direct testing. The absence of data is itself a finding: neither CPU has been evaluated in the same workload suite, so any numerical comparison would be speculative. The only quantifiable markers available are the structural specifications, which differ substantially across nearly every category.

The Intel part lists a boost clock of 5.00 GHz, while the Qualcomm part lists a base clock of 4.45 GHz and a boost clock of 4.70 GHz. The Intel chip has a 10-core, 12-thread configuration, whereas the Qualcomm chip has 18 cores and 18 threads. These raw numbers suggest divergent design goals, but without benchmark output, they cannot be translated into performance deltas. The database shows both processors at the 50th percentile among all CPUs, but this is a placeholder value, not a measured result. The average benchmark score for each is zero, confirming that no testing data has been recorded.

Where Each One Wins

Without benchmark results, the win analysis must rely on architectural characteristics rather than measured outcomes. The Intel Core 7 150UL uses a Raptor Lake architecture on a 10 nm process, with a 15 W TDP. This low thermal envelope indicates a focus on efficiency in constrained chassis, likely favoring light workloads where burst performance matters. Its 5.00 GHz boost clock is the highest figure in either specification list, suggesting a capacity for short-duration single-thread acceleration when thermals allow. The integrated Iris Xe Graphics with 96 execution units provides a known baseline for graphics output, though no scores confirm its capability.

The Qualcomm Snapdragon X2E-94-100 employs a 3 nm TSMC process, a smaller node that typically enables higher transistor density and improved power efficiency per operation. Its 18-core count and 18-thread count indicate a fully symmetric design without hyperthreading, which often aligns with multi-threaded throughput in parallel workloads. The triple-channel LPDDR5X memory bus with 228.6 GB/s bandwidth is a significant structural advantage over the Intel chip's dual-channel DDR4/DDR5 support, though no bandwidth figure is listed for the Intel part. The Qualcomm chip also uses PCIe Gen 5 with 12 lanes, versus Gen 4 with 8 lanes on the Intel side, which could affect data transfer rates to attached devices.

The Intel chip is marked as a desktop segment part, while the Qualcomm chip is marked as mobile. This segment distinction suggests different use cases: the Intel part may target low-power desktops or mini-PCs, while the Qualcomm part likely targets thin-and-light laptops. The Intel chip supports DDR4 and DDR5 memory, offering flexibility in platform design, whereas the Qualcomm chip is locked to LPDDR5X, which is typically soldered and optimized for mobile power delivery.

Architecture Differences

The two processors diverge fundamentally in process technology. Intel uses a 10 nm node fabricated by Intel itself, while Qualcomm uses a 3 nm node fabricated by TSMC. Smaller process nodes generally allow more transistors in the same die area, though neither transistor count nor die size is listed for the Intel chip. The Qualcomm die is recorded as 220 mm², a specific figure that indicates a large physical package for an 18-core design.

Core organization differs sharply. The Intel chip has 10 cores and 12 threads, implying a mix of performance and efficiency cores where only some support simultaneous multithreading. The cache hierarchy shows 80 KB L1 per core, 1.25 MB L2 per core, and 12 MB shared L3. The Qualcomm chip has 18 cores and 18 threads, with 288 KB L1 per core, 16 MB L2 per module, and 9 MB shared L3. The L2 structure on the Qualcomm side is module-based, which suggests a clustered topology where groups of cores share a larger L2 pool. The Intel side uses per-core L2, which can reduce cross-core latency but may require more frequent access to shared L3.

Memory architecture is another major split. The Intel chip uses dual-channel memory supporting both DDR4 and DDR5, with no bandwidth figure recorded. The Qualcomm chip uses triple-channel LPDDR5X with a recorded bandwidth of 228.6 GB/s. Triple-channel configuration is unusual and indicates a wide memory path designed for high sustained throughput, likely for integrated GPU workloads or large data movement tasks.

PCIe support differs by generation and lane count. Intel provides Gen 4 with 8 CPU lanes, while Qualcomm provides Gen 5 with 12 CPU lanes. Gen 5 doubles the per-lane bandwidth of Gen 4, and the higher lane count further increases aggregate throughput. This could matter for connecting high-speed NVMe storage or external GPUs, though no benchmark verifies real-world impact.

Integrated graphics also differ: Intel uses Iris Xe Graphics with 96 execution units, while Qualcomm uses the Adreno X2-90. No performance numbers exist for either GPU, but the execution unit count on the Intel side provides a structural reference. The Qualcomm GPU's architecture is not detailed, so direct comparison is limited to naming.

Release dates are recorded. The Intel chip has a release date of 2024-04-07, while the Qualcomm chip has a release date of 2026-04-05. The two-year gap suggests the Qualcomm part is a newer design, but no performance data confirms whether the newer node translates into better measured results.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-94-100 has 18 cores, while the Intel Core 7 150UL has 10 cores. The Qualcomm chip also has 18 threads, whereas the Intel chip has 12 threads.

Q: What is the boost clock difference?

A: The Intel Core 7 150UL has a boost clock of 5.00 GHz, which is higher than the Qualcomm Snapdragon X2E-94-100's boost clock of 4.70 GHz. The Qualcomm chip's base clock of 4.45 GHz is much higher than the Intel chip's base clock of 1.70 GHz.

Q: How do the process nodes compare?

A: The Intel chip uses a 10 nm process from Intel, while the Qualcomm chip uses a 3 nm process from TSMC. The Qualcomm die size is recorded as 220 mm², while no die size is listed for the Intel chip.

Q: Which chip has higher memory bandwidth?

A: The Qualcomm chip has a recorded memory bandwidth of 228.6 GB/s using triple-channel LPDDR5X. The Intel chip supports dual-channel DDR4 and DDR5, but no bandwidth figure is recorded for it.

Q: What PCIe versions do they use?

A: The Intel chip uses PCIe Gen 4 with 8 CPU lanes, while the Qualcomm chip uses PCIe Gen 5 with 12 CPU lanes.

Q: Are there any measured benchmark scores available?

A: No. Both processors have empty benchmark arrays, zero average benchmark scores, and zero wins in head-to-head comparisons. The database has not recorded any performance measurements for either chip.

Specification Differences

| Specification | Intel Core 7 150UL | Qualcomm Snapdragon X2E-94-100 |

|---|---|---|

| Cores | 10 | 18 |

| Threads | 12 | 18 |

| Base clock | 1.70 GHz | 4.45 GHz |

| Boost clock | 5.00 GHz | 4.70 GHz |

| TDP | 15 W | Not listed |

| Socket | Intel Socket 1700 | Qualcomm BGA 2343 |

| Architecture | Raptor Lake | Not listed |

| Codename | Raptor Lake-PS | Glymur |

| Process node | 10 nm | 3 nm |

| Foundry | Intel | TSMC |

| Die size | Not listed | 220 mm² |

| L1 cache | 80 KB per core | 288 KB per core |

| L2 cache | 1.25 MB per core | 16 MB per module |

| L3 cache | 12 MB shared | 9 MB shared |

| Memory support | DDR4, DDR5 | LPDDR5X |

| Memory bus | Dual-channel | Triple-channel |

| Memory bandwidth | Not listed | 228.6 GB/s |

| PCIe | Gen 4, 8 lanes | Gen 5, 12 lanes |

| Integrated graphics | Iris Xe Graphics 96EU | Adreno X2-90 |

| Market segment | Desktop | Mobile |

| Release date | 2024-04-07 | 2026-04-05 |

| Part number | unknown | X2E94100 |

The Verdict

The data shows two processors aimed at different market segments with no overlapping benchmark evidence. The Intel Core 7 150UL is a desktop part with a 15 W TDP, a 5.00 GHz boost clock, and support for DDR4 and DDR5 memory. Its 10-core, 12-thread layout and dual-channel memory bus suggest it is designed for efficiency-sensitive desktop systems where moderate multi-threading and high single-thread bursts are sufficient. The 10 nm node and Intel Socket 1700 compatibility indicate it fits into an existing platform ecosystem with established motherboard support.

The Qualcomm Snapdragon X2E-94-100 is a mobile part with 18 cores, 18 threads, a 4.45 GHz base clock, and a 4.70 GHz boost clock. Its 3 nm TSMC process, 220 mm² die, triple-channel LPDDR5X memory with 228.6 GB/s bandwidth, and PCIe Gen 5 with 12 lanes point to a design prioritizing sustained multi-core throughput and high-speed data movement in a laptop form factor. The base clock of 4.45 GHz is notably high, implying that all cores can operate at that frequency simultaneously, a characteristic that often benefits heavily parallel workloads.

Neither chip has recorded benchmark scores, so the verdict cannot rest on measured performance. The specification split is clear: if the use case is a low-power desktop with flexible memory options and a high boost clock for single-thread tasks, the Intel part matches that profile. If the use case is a mobile device requiring wide memory bandwidth, many cores, and a small process node, the Qualcomm part matches that profile. The absence of benchmark data means no claim can be made about which is faster in any workload. The only safe conclusion is that the two chips target different physical form factors and design priorities, and the database currently lacks the measurements needed to rank them against each other.

DETAILED SPECIFICATIONS

SPECIFICATION
7 150UL
Snapdragon X2E-94-100
Core Specs
Cores
10
18 +80.0%
Threads
12
18 +50.0%
Base Clock (GHz)
1.7
4.45 +161.8%
Boost Clock (GHz)
5
4.7 -6.0%
Frequency (GHz)
1.7
4.45 +161.8%
Turbo Clock (GHz)
5
4.7 -6.0%
Multiplier
17
44.5 +161.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
16 MB (per module)
L3 Cache
12 MB (shared)
9 MB (shared)
Power
TDP (W)
15
—
PL1
15 W
—
PL2
55 W
—
Architecture
Architecture
Raptor Lake
—
Codename
Raptor Lake-PS
Glymur
Generation
Core 7 (Raptor Lake-PS)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
—
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
—
228.6 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
—
DDR5 Speed
5200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
PCIe
Gen 4, 8 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 8
12 + 6
E-Core Frequency
1200 MHz up to 3.7 GHz
3.6 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
Iris Xe Graphics 96EU
Adreno X2-90
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
unknown
X2E94100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 7 150UL Details View Snapdragon X2E-94-100 Details