Intel Core 5 211E vs Intel Core Ultra 5 236V Comparison

Intel
INTEL

Intel Core 5 211E

CORE STATE Bartlett Lake
CORE SPECS 10 Cores / 16 Threads
CLOCK SPEED 2.7 Base / 4.9 GHz Turbo
CACHE 20 MB (shared)
MAX TDP 65W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Core Ultra 5 236V

CORE STATE Lunar Lake
CORE SPECS 8 Cores / 8 Threads
CLOCK SPEED 2.1 Base / 4.7 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 17W
ARCHITECTURE Lunar Lake
nm
PROCESS 3 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,055
1,575
cinebench_cinebench_r15_singlecore
289
222
cinebench_cinebench_r20_multicore
8,563
6,563
cinebench_cinebench_r20_singlecore
1,208
926
cinebench_cinebench_r23_multicore
20,389
15,628
cinebench_cinebench_r23_singlecore
2,878
2,206
passmark_data_compression
346,757
176,554
passmark_data_encryption
17,938
13,049
passmark_extended_instructions
21,592
15,451
passmark_find_prime_numbers
43
171
passmark_floating_point_math
66,402
52,774
passmark_integer_math
88,117
38,765
passmark_multithread
23,833
18,375
passmark_physics
702
1,503
passmark_random_string_sorting
34,308
21,628
passmark_single_thread
4,006
3,893
passmark_singlethread
4,006
3,893

Analysis: Intel Core 5 211E vs Intel Core Ultra 5 236V

Architecture Differences

The Intel Core 5 211E and Intel Core Ultra 5 236V represent two distinct design philosophies from the same manufacturer. The Core 5 211E uses the Bartlett Lake codename and is built on Intel's 10 nm process node at Intel's own foundry. The Core Ultra 5 236V belongs to the Core Ultra Series 2, uses the Lunar Lake architecture, and is fabricated on TSMC's 3 nm process node. This process difference is significant: the 10 nm node is an older, more mature production line, while the 3 nm node represents a much denser, more power-efficient transistor design.

The die size for the Core 5 211E is recorded at 257 mm², while the Core Ultra 5 236V has no recorded die size in the database. The Core 5 211E uses Intel Socket 1700, a desktop platform with a 65 TDP. The Core Ultra 5 236V uses Intel BGA 2833, a mobile socket with a 17 TDP. The 17 TDP figure is less than a third of the desktop part's 65 TDP, which directly explains the mobile chip's lower clock ceiling and reduced sustained performance envelope.

Cache architecture diverges sharply. The Core 5 211E has 80 KB L1 per core, 2 MB L2 per core, and 20 MB shared L3. The Core Ultra 5 236V has 192 KB L1 per core, 2.5 MB L2 per core, and only 8 MB shared L3. The Lunar Lake chip compensates for the smaller L3 with larger per-core L1 and L2 caches, a design choice that favors latency-sensitive single-thread workloads but limits shared data capacity for heavily threaded applications.

Integrated graphics differ as well. The Core 5 211E carries UHD Graphics 730, while the Core Ultra 5 236V carries Arc 130V. The Arc 130V is the more modern GPU solution, consistent with the mobile chip's emphasis on integrated graphics performance for thin-and-light systems.

The Core 5 211E supports ECC memory; the Core Ultra 5 236V does not. The desktop part also offers more PCIe connectivity: Gen 5 with 16 lanes from the CPU, versus Gen 5 with only 4 lanes on the mobile part.

Specification Differences

| Specification | Intel Core 5 211E | Intel Core Ultra 5 236V |

|---|---|---|

| Cores | 10 | 8 |

| Threads | 16 | 8 |

| Base clock | 2.70 GHz | 2.10 GHz |

| Boost clock | 4.90 GHz | 4.70 GHz |

| TDP | 65 W | 17 W |

| Process node | 10 nm | 3 nm |

| Foundry | Intel | TSMC |

| L1 cache | 80 KB per core | 192 KB per core |

| L2 cache | 2 MB per core | 2.5 MB per core |

| L3 cache | 20 MB shared | 8 MB shared |

| ECC support | Yes | No |

| PCIe (CPU) | Gen 5, 16 lanes | Gen 5, 4 lanes |

| Integrated GPU | UHD Graphics 730 | Arc 130V |

| Socket | Intel Socket 1700 | Intel BGA 2833 |

| Market segment | Desktop | Mobile |

| Release date | 2025-01-12 | 2024-09-23 |

| Launch MSRP | $221 | Not recorded |

The thread count difference is the most consequential specification gap. The Core 5 211E has 10 cores and 16 threads, meaning it supports Hyper-Threading on some cores. The Core Ultra 5 236V has 8 cores and 8 threads, no simultaneous multithreading. This explains the massive multicore performance disparity seen in benchmarks.

The base clock difference of 0.60 GHz and boost difference of 0.20 GHz both favor the desktop part. The Core 5 211E's higher clocks combine with more threads to produce a consistent advantage across nearly every measured workload.

FAQ

Q: Which processor has more cores and threads?

A: The Intel Core 5 211E has 10 cores and 16 threads. The Intel Core Ultra 5 236V has 8 cores and 8 threads. The desktop chip provides 2 more cores and double the thread count of the mobile chip.

Q: How do the cache sizes compare?

A: The Core Ultra 5 236V has larger per-core caches: 192 KB L1 and 2.5 MB L2 per core, versus 80 KB L1 and 2 MB L2 per core on the Core 5 211E. The Core 5 211E has the larger shared L3 at 20 MB, versus 8 MB on the Core Ultra 5 236V.

Q: Does the Core 5 211E support ECC memory?

A: Yes, the Core 5 211E has ECC memory support. The Core Ultra 5 236V does not support ECC memory.

Q: What is the difference in PCIe connectivity?

A: The Core 5 211E provides Gen 5 with 16 CPU lanes. The Core Ultra 5 236V provides Gen 5 with only 4 CPU lanes. The desktop part supports substantially more direct PCIe expansion.

Q: Which chip has the higher clock speeds?

A: The Core 5 211E has a base clock of 2.70 GHz and a boost clock of 4.90 GHz. The Core Ultra 5 236V has a base clock of 2.10 GHz and a boost clock of 4.70 GHz. The desktop part is faster in both metrics.

Q: What are the power envelopes of these two processors?

A: The Core 5 211E has a TDP of 65 W. The Core Ultra 5 236V has a TDP of 17 W. The mobile chip consumes less than a third of the power of the desktop chip.

The Verdict

The data supports a clear split by use case. The Intel Core 5 211E is the stronger processor for compute-heavy desktop workloads. It wins 15 of 17 head-to-head benchmarks, with the largest margin at 127.3% in integer math. Its 16 threads, higher clocks, and 20 MB shared L3 give it a decisive edge in rendering, compression, encryption, and multithreaded productivity. The launch MSRP of $221 positions it as a mainstream desktop option, although the database records no price for the Core Ultra 5 236V.

The Intel Core Ultra 5 236V wins only 2 of 17 benchmarks, but those wins are telling. It dominates in prime number finding with a 74.9% advantage and in physics simulation with a 53.3% advantage. These results, combined with its 17 TDP, 3 nm process, and larger per-core caches, indicate a chip optimized for efficiency and specific single-thread or latency-sensitive tasks in a mobile form factor. The mobile chip's 8 MB L3 is small, but the 192 KB L1 and 2.5 MB L2 per core keep frequently accessed data closer to the execution units.

For a desktop builder assembling a workstation or a high-throughput system, the Core 5 211E is the obvious choice. Its nearest rival, the AMD Ryzen AI 9 HX 370, scores nearly identically at a 0.2% delta, confirming the Core 5 211E sits at the top of its performance tier. For a laptop buyer prioritizing battery life, low heat output, and integrated graphics, the Core Ultra 5 236V makes sense despite its lower absolute performance. The Core Ultra 5 236V's nearest rival, the Intel Core Ultra 5 238V, is essentially a wash at a 0.1% delta, showing the mobile chip is competitive within its own efficiency-focused segment.

Head-to-Head Benchmarks

The Core 5 211E dominates the Cinebench suite with remarkable consistency. In Cinebench R15 multicore, it scores 2055 versus 1575, a 30.5% advantage. The single-core R15 result shows 289 versus 222, also 30.2% ahead. Cinebench R20 multicore delivers 8563 against 6563, again 30.5%. The R20 single-core result is 1208 versus 926, a 30.5% margin. Cinebench R23 multicore shows 20389 versus 15628, and R23 single-core shows 2878 versus 2206, both at 30.5%. This uniformity across the Cinebench versions indicates the performance ratio is stable regardless of the test iteration.

The Passmark suite reveals an even wider spread in certain workloads. Data compression shows the largest absolute gap: 346757 for the Core 5 211E versus 176554 for the Core Ultra 5 236V, a 96.4% advantage. Integer math is the biggest relative win at 127.3%, with scores of 88117 and 38765. Random string sorting also leans heavily toward the desktop chip: 34308 versus 21628, a 58.6% margin. Extended instructions favor the Core 5 211E by 39.7%, with 21592 versus 15451. Data encryption shows 17938 against 13049, a 37.5% edge. Floating point math gives 66402 versus 52774, a 25.8% win. The Passmark multithread score is 23833 versus 18375, a 29.7% advantage.

The single-thread Passmark result is much closer. The Core 5 211E scores 4006, the Core Ultra 5 236V scores 3893, a narrow 2.9% margin. This confirms that in purely single-threaded integer work, the mobile chip's high per-core clocks and larger L1/L2 caches nearly close the gap.

The Core Ultra 5 236V claims two victories. In prime number finding, it scores 171 against 43, a staggering 74.9% advantage for the mobile chip. This workload rewards the Lunar Lake architecture's larger per-core cache and efficient prime-number algorithms. In physics simulation, the Core Ultra 5 236V scores 1503 versus 702, a 53.3% lead. Physics workloads often benefit from specific instruction patterns and memory latency characteristics, where the mobile chip's cache hierarchy excels.

Where Each One Wins

The Core 5 211E wins in every Cinebench test, every Passmark compression, encryption, extended instruction, floating point, integer math, multithread, random string sorting, and single-thread benchmark. Its dominance spans both multicore and single-core rendering workloads. The 16 threads provide a 30.5% advantage across all Cinebench versions, making it the clear pick for video rendering, 3D modeling, and any CPU-bound creative application. The data compression result at 96.4% ahead indicates a strong showing for file archiving, backup software, and database workloads. Integer math at 127.3% ahead suggests the desktop chip handles general-purpose calculation, spreadsheet processing, and software compilation with far greater throughput.

The Core Ultra 5 236V wins only in prime number finding and physics simulation. These are specialized workloads that depend heavily on cache locality and single-thread efficiency. The 192 KB L1 and 2.5 MB L2 per core on the Lunar Lake part keep working sets close to the cores, which explains the 74.9% and 53.3% leads. Users running scientific simulations with prime-number sieving, certain cryptography-related workloads, or physics engines that fit within the larger per-core caches will see better results on the mobile chip.

For general productivity, the Core 5 211E is the superior choice. Its 65 W TDP and desktop socket allow sustained high performance without the thermal constraints of a 17 W mobile part. For battery-powered systems, the Core Ultra 5 236V offers a compelling efficiency profile, and its Arc 130V integrated graphics are a more modern solution than the UHD Graphics 730. The Core Ultra 5 236V also benefits from the 3 nm TSMC process, which enables the low power draw. The database shows the Core 5 211E at the 86th percentile of all CPUs, versus the 75th percentile for the Core Ultra 5 236V, a full 11 percentile points separating the two. The average benchmark score difference is stark: 37829 for the desktop chip versus 21952 for the mobile chip, a 72.3% overall performance gap.

DETAILED SPECIFICATIONS

SPECIFICATION
5 211E
Ultra 5 236V
Core Specs
Cores
10
8 -20.0%
Threads
16
8 -50.0%
Base Clock (GHz)
2.7
2.1 -22.2%
Boost Clock (GHz)
4.9
4.7 -4.1%
Frequency (GHz)
2.7
2.1 -22.2%
Turbo Clock (GHz)
4.9
4.7 -4.1%
Multiplier
27
21 -22.2%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
192 KB (per core)
L2 Cache
2 MB (per core)
2.5 MB (per core)
L3 Cache
20 MB (shared)
8 MB (shared)
Power
TDP (W)
65
17 -73.8%
PL1
65 W
PL2
148 W
Architecture
Architecture
Lunar Lake
Codename
Bartlett Lake
Lunar Lake
Generation
Core 5 (Bartlett Lake)
Ultra 5 (Lunar Lake)
Process Size
10 nm
3 nm
Die Size
257 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
unknown Depends on motherboard
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
Platform
Socket
Intel Socket 1700
Intel BGA 2833
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 5, 4 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 6 E-Cores: 4
P-Cores: 4 E-Cores: 4
E-Core Frequency
2000 MHz up to 3.7 GHz
2.1 GHz up to 3.5 GHz
AI/NPU
NPU
Yes / 40 TOPS
Graphics
Integrated Graphics
UHD Graphics 730
Arc 130V
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$221
Part Number
SRQERQ65F
SRPN2SRPN3
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
100°C
View Core 5 211E Details View Core Ultra 5 236V Details