Intel Core 3 305 vs Qualcomm Snapdragon X1E-80-100 Comparison

Intel
INTEL

Intel Core 3 305

CORE STATE Wildcat Lake
CORE SPECS 6 Cores / 6 Threads
CLOCK SPEED 1.5 Base / 4.3 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 15W
ARCHITECTURE Wildcat Lake
nm
PROCESS 3 nm
LAUNCH DATE 2026
VS
Unknown
CPU

Snapdragon X1E-80-100

CORE STATE Oryon
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 3.4 Base / 4 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,322
N/A
cinebench_cinebench_r15_singlecore
186
N/A
cinebench_cinebench_r20_multicore
5,511
N/A
cinebench_cinebench_r20_singlecore
777
N/A
cinebench_cinebench_r23_multicore
13,123
N/A
cinebench_cinebench_r23_singlecore
1,852
N/A
passmark_data_compression
146,857
N/A
passmark_data_encryption
11,019
N/A
passmark_extended_instructions
13,543
N/A
passmark_find_prime_numbers
115
N/A
passmark_floating_point_math
42,284
N/A
passmark_integer_math
32,295
N/A
passmark_multithread
15,439
N/A
passmark_physics
1,233
N/A
passmark_random_string_sorting
17,623
N/A
passmark_single_thread
3,977
N/A
passmark_singlethread
3,977
N/A

Analysis: Intel Core 3 305 vs Qualcomm Snapdragon X1E-80-100

The Verdict

The Intel Core 3 305 and Qualcomm Snapdragon X1E-80-100 serve entirely different segments of the mobile market, and the recorded data confirms this split. The Intel part is a 6-core, 6-thread processor built on Intel's 3 nm process with a 15 W TDP, while the Snapdragon is a 12-core, 12-thread Oryon design on TSMC's 4 nm node with a 35 W TDP.

The Core 3 305 has a complete benchmark profile in the database, with an average benchmark score of 18302 and a 72nd percentile ranking across all CPUs. The Snapdragon X1E-80-100, by contrast, has no recorded benchmark scores and sits at the 50th percentile with an average score of zero. This lack of data means the Snapdragon cannot be positioned as a performance alternative based on measurements; it is only a specification comparison.

From the available data, the Core 3 305 is the only chip with verified performance numbers. Its nearest rivals show it trading blows with the Intel Core i3-14100 (0.1% behind), Intel Core 5 330 (0.2% behind), Intel Core 7 360 (0.4% behind), and AMD Ryzen 5 2600E (0.4% ahead). These margins are negligible, placing the Core 3 305 in a tightly clustered performance band.

For users who need a mobile processor with measured, competitive single-thread and multi-thread results, the Core 3 305 is the defensible choice. The Snapdragon X1E-80-100 offers more cores, higher base clock, and wider memory bandwidth on paper, but without benchmark data, its real-world performance cannot be quantified. The database shows no wins for either chip in head-to-head testing, as no such tests exist.

FAQ

Q: Which processor has more cores and threads?

A: The Snapdragon X1E-80-100 has 12 cores and 12 threads, double the Core 3 305's 6 cores and 6 threads.

Q: What are the clock speed differences?

A: The Snapdragon has a higher base clock at 3.40 GHz versus 1.50 GHz, but the Intel chip boosts higher at 4.30 GHz versus 4.00 GHz.

Q: Which chip has a smaller manufacturing process?

A: The Intel Core 3 305 uses a 3 nm process from Intel, while the Snapdragon uses TSMC's 4 nm process. The 3 nm node is smaller.

Q: How do their memory bandwidths compare?

A: The Snapdragon X1E-80-100 delivers 135.2 GB/s over dual-channel LPDDR5X, while the Core 3 305 provides 59.7 GB/s over single-channel DDR5/LPDDR5X. The Snapdragon has more than double the bandwidth.

Q: Do both processors have the same power envelope?

A: No. The Core 3 305 has a 15 W TDP, while the Snapdragon X1E-80-100 has a 35 W TDP. The Snapdragon draws over twice the power.

Q: Which chip has measured benchmark scores?

A: Only the Intel Core 3 305 has benchmark results in the database. The Snapdragon X1E-80-100 has no recorded scores, giving it a 50th percentile ranking and an average score of zero.

Architecture Differences

The two processors come from fundamentally different design lineages. The Intel Core 3 305 uses the Wildcat Lake codename and belongs to the Core 3 generation, built on a 3 nm process at Intel's own foundry. It integrates Intel Xe3 Graphics with one Xe unit. The Snapdragon X1E-80-100 uses the Oryon codename under the Snapdragon X Elite generation, fabricated on a 4 nm process by TSMC, with Adreno X1-85 integrated graphics.

Cache hierarchies diverge sharply. The Intel chip has a 192 KB L1 cache, 2.5 MB L2, and 6 MB shared L3. The Snapdragon lists 288 KB L1 per core, 12 MB L2 per module, and 6 MB shared L3. Both have 6 MB of shared L3, but the Snapdragon's per-core and per-module caches are configured for a larger, more distributed topology.

Memory architecture also differs. Intel supports both DDR5 and LPDDR5X over a single-channel bus, yielding 59.7 GB/s. Qualcomm supports only LPDDR5X over a dual-channel bus, yielding 135.2 GB/s. Neither chip supports ECC memory.

PCIe connectivity shows a lane advantage for Qualcomm: the Snapdragon provides 12 Gen 4 lanes from the CPU, while Intel provides 6 Gen 4 lanes. Both are locked multipliers, neither is unlocked for overclocking.

The release timeline places the Snapdragon first, launching on April 23, 2024, while the Intel part launches on April 15, 2026. Both are marked as Active in production status.

Specification Differences

The specification table highlights where these two parts diverge:

  • Cores: Intel 6, Snapdragon 12
  • Threads: Intel 6, Snapdragon 12
  • Base clock: Intel 1.50 GHz, Snapdragon 3.40 GHz
  • Boost clock: Intel 4.30 GHz, Snapdragon 4.00 GHz
  • TDP: Intel 15 W, Snapdragon 35 W
  • Process node: Intel 3 nm, Snapdragon 4 nm
  • Foundry: Intel, TSMC
  • L1 cache: Intel 192 KB, Snapdragon 288 KB per core
  • L2 cache: Intel 2.5 MB, Snapdragon 12 MB per module
  • Memory support: Intel DDR5 and LPDDR5X, Snapdragon LPDDR5X only
  • Memory bus: Intel single-channel, Snapdragon dual-channel
  • Memory bandwidth: Intel 59.7 GB/s, Snapdragon 135.2 GB/s
  • PCIe lanes: Intel 6 Gen 4, Snapdragon 12 Gen 4
  • Integrated graphics: Intel Xe3 Graphics (1 Xe), Adreno X1-85
  • Socket: Intel BGA 1516, Qualcomm BGA 2073
  • Part number: SAE3L, X1E80100
  • Launch MSRP: $309 for Intel, none listed for Qualcomm
  • Release date: April 15, 2026 for Intel, April 23, 2024 for Qualcomm

Both chips are mobile segment parts, have no ECC support, no unlocked multiplier, and no v-cache option. Neither has a listed transistor count or die size.

Head-to-Head Benchmarks

Direct head-to-head benchmark data does not exist in the database for these two processors. The head-to-head benchmark list is empty, and neither chip records any wins against the other. The only measurable performance profile belongs to the Intel Core 3 305.

The Core 3 305's benchmark results span multiple Cinebench and Passmark tests. In Cinebench R23, it scores 13123 multi-core and 1852 single-core. Cinebench R20 shows 5511 multi-core and 777 single-core. Cinebench R15 records 1322 multi-core and 186 single-core.

Passmark results for the Intel chip include 146857 in data compression, 11019 in data encryption, 13543 in extended instructions, 115 in find prime numbers, 42284 in floating point math, 32295 in integer math, 15439 in multithread, 1233 in physics, 17623 in random string sorting, and 3977 in single-thread (recorded twice under slightly different test names).

The average benchmark score of 18302 places the Core 3 305 at the 72nd percentile of all CPUs. Its nearest rivals confirm tight competition: the Intel Core i3-14100 averages 18318 (0.1% ahead), the Intel Core 5 330 averages 18345 (0.2% ahead), the Intel Core 7 360 averages 18374 (0.4% ahead), and the AMD Ryzen 5 2600E averages 18230 (0.4% behind).

Since the Snapdragon X1E-80-100 has no scores, any comparative statement must rely on specifications alone. The Snapdragon's 12 Oryon cores, 3.40 GHz base clock, and 135.2 GB/s memory bandwidth suggest a higher theoretical ceiling, but the database provides no measurements to confirm it. The Intel part's 4.30 GHz boost clock and 15 W TDP indicate a lower-power design with a higher single-core clock ceiling.

The recorded data shows a clear asymmetry: one processor is fully characterized, the other is specification-only. For any performance ranking, the Core 3 305 stands as the sole data point, while the Snapdragon remains an unmeasured contender.

DETAILED SPECIFICATIONS

SPECIFICATION
3 305
Snapdragon X1E-80-100
Core Specs
Cores
6
12 +100.0%
Threads
6
12 +100.0%
Base Clock (GHz)
1.5
3.4 +126.7%
Boost Clock (GHz)
4.3
4 -7.0%
Frequency (GHz)
1.5
3.4 +126.7%
Turbo Clock (GHz)
4.3
4 -7.0%
Multiplier
15
34 +126.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
192 KB
288 KB (per core)
L2 Cache
2.5 MB
12 MB (per module)
L3 Cache
6 MB (shared)
6 MB (shared)
Power
TDP (W)
15
35 +133.3%
PL2
80 W
Architecture
Codename
Wildcat Lake
Oryon
Generation
Core 3 (Wildcat Lake)
Snapdragon X (Elite)
Process Size
3 nm
4 nm
Foundry
Intel
TSMC
Memory
Memory Support
DDR5, LPDDR5X
LPDDR5X
Memory Bus
Single-channel
Dual-channel
Memory Bandwidth
59.7 GB/s
135.2 GB/s
ECC Memory
No
No
DDR5 Speed
6400 MT/s
Platform
Socket
Intel BGA 1516
Qualcomm BGA 2073
PCIe
Gen 4, 6 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 4
E-Core Frequency
1400 MHz up to 3.3 GHz
AI/NPU
NPU
Yes / 45 TOPS
Graphics
Integrated Graphics
Intel Xe3 Graphics (1 Xe)
Adreno X1-85
Other
Market
Mobile
Mobile
Production Status
Active
Active
Launch Price
$309
Part Number
SAE3L
X1E80100
Package
FC-BGA
FC-BGA
Tj Max
100°C
View Core 3 305 Details View Snapdragon X1E-80-100 Details