Intel Core 3 305 vs Qualcomm Snapdragon X1E-78-100 Comparison

Intel
INTEL

Intel Core 3 305

CORE STATE Wildcat Lake
CORE SPECS 6 Cores / 6 Threads
CLOCK SPEED 1.5 Base / 4.3 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 15W
ARCHITECTURE Wildcat Lake
nm
PROCESS 3 nm
LAUNCH DATE 2026
VS
Unknown
CPU

Snapdragon X1E-78-100

CORE STATE Oryon
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 3.4 Base
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,322
N/A
cinebench_cinebench_r15_singlecore
186
N/A
cinebench_cinebench_r20_multicore
5,511
N/A
cinebench_cinebench_r20_singlecore
777
N/A
cinebench_cinebench_r23_multicore
13,123
N/A
cinebench_cinebench_r23_singlecore
1,852
N/A
passmark_data_compression
146,857
N/A
passmark_data_encryption
11,019
N/A
passmark_extended_instructions
13,543
N/A
passmark_find_prime_numbers
115
N/A
passmark_floating_point_math
42,284
N/A
passmark_integer_math
32,295
N/A
passmark_multithread
15,439
N/A
passmark_physics
1,233
N/A
passmark_random_string_sorting
17,623
N/A
passmark_single_thread
3,977
N/A
passmark_singlethread
3,977
N/A

Analysis: Intel Core 3 305 vs Qualcomm Snapdragon X1E-78-100

Where Each One Wins

The Intel Core 3 305 and the Qualcomm Snapdragon X1E-78-100 occupy different positions in the mobile processor landscape. The recorded data shows that the Intel part has a complete set of benchmark results, while the Qualcomm part has no recorded benchmark scores in the database at this time. This means the comparison is heavily weighted toward the Intel processor for measurable performance, though the Qualcomm chip's specifications reveal its intended strengths.

The Intel Core 3 305 delivers its wins across every measured workload category because it is the only one of the two with recorded test results. Its Cinebench R23 multi-core score of 13123 and single-core score of 1852 place it in the 72nd percentile of all CPUs in the database. The Qualcomm Snapdragon X1E-78-100, by contrast, sits at the 50th percentile with an average benchmark score of zero due to missing test data.

The Qualcomm part wins on specification-driven advantages that do not appear in benchmark scores. It uses 12 cores and 12 threads compared to the Intel's 6 cores and 6 threads, which suggests stronger parallel throughput potential in heavily threaded workloads. Its memory bandwidth of 135.2 GB/s is more than double the Intel's 59.7 GB/s, indicating an advantage in memory-intensive tasks. The dual-channel memory bus versus the Intel's single-channel configuration reinforces this gap.

For single-threaded responsiveness, the Intel part has a boost clock of 4.30 GHz, while the Qualcomm's boost clock is not recorded. The Intel's base clock of 1.50 GHz is substantially lower than the Qualcomm's 3.40 GHz base clock, but the Intel's boost capability provides the headline frequency advantage.

Architecture Differences

The two processors come from different manufacturing and design lineages. The Intel Core 3 305 uses the Wildcat Lake codename and is built on a 3 nm process at Intel's own foundry. The Qualcomm Snapdragon X1E-78-100 uses the Oryon codename and is manufactured on a 4 nm process at TSMC. The Intel process node is one step smaller, which typically allows for higher transistor density and improved power efficiency per unit area.

The core configurations diverge sharply. The Intel part has 6 cores and 6 threads, meaning no hyper-threading or simultaneous multi-threading support. The Qualcomm part has 12 cores and 12 threads, also without SMT, but with double the physical core count. This structural difference is the primary driver of multi-threaded performance potential.

Cache hierarchies also differ. The Intel Core 3 305 has a 192 KB L1 cache, a 2.5 MB L2 cache, and a 6 MB shared L3 cache. The Qualcomm Snapdragon X1E-78-100 has a much larger L1 at 288 KB per core, a 12 MB L2 per module, and the same 6 MB shared L3. The Qualcomm's per-core L1 and per-module L2 allocations suggest a design aimed at feeding its higher core count with more local data storage.

Memory support shows a clear split. The Intel part supports both DDR5 and LPDDR5X, while the Qualcomm part supports only LPDDR5X. The Intel's single-channel memory bus limits peak bandwidth to 59.7 GB/s, whereas the Qualcomm's dual-channel bus enables 135.2 GB/s. Neither processor supports ECC memory.

PCIe connectivity also differs. The Intel Core 3 305 provides Gen 4 with 6 CPU-only lanes, while the Qualcomm part provides Gen 4 with 12 CPU-only lanes. The Qualcomm's doubled lane count offers more headroom for peripherals and storage expansion.

Integrated graphics are distinct as well. The Intel part uses Intel Xe3 Graphics with one Xe core. The Qualcomm part uses the Adreno X1-85. Both are mobile-oriented solutions, but their architectures and driver ecosystems are entirely separate.

The Qualcomm part has a TDP of 35 watts, while the Intel part is rated at 15 watts. The Intel's lower thermal envelope suggests suitability for fanless or ultra-thin designs, while the Qualcomm's higher power budget aligns with its larger core count and memory bandwidth. The Intel part was released on April 15, 2026, while the Qualcomm part came earlier on April 23, 2024. The Intel's launch MSRP was $309; the Qualcomm's launch MSRP is not recorded.

Head-to-Head Benchmarks

The head-to-head benchmark array in the database is empty, and the Qualcomm Snapdragon X1E-78-100 has no individual benchmark scores recorded. The Intel Core 3 305, however, has a comprehensive set of results across Cinebench and Passmark tests.

The Intel's Cinebench R23 multi-core score of 13123 and single-core score of 1852 indicate a processor that handles both parallel and single-threaded workloads effectively. Its Cinebench R20 scores are 5511 multi-core and 777 single-core. The older Cinebench R15 test shows 1322 multi-core and 186 single-core. These numbers place the Intel part in the 72nd percentile of all CPUs in the database, with an average benchmark score of 18302.

The nearest rivals in the database provide context for the Intel's positioning. The Intel Core i3-14100 has an average score of 18318, which is 0.1 percent higher than the Core 3 305. The Intel Core 5 330 scores 18345, 0.2 percent higher. The Intel Core 7 360 scores 18374, 0.4 percent higher. The AMD Ryzen 5 2600E scores 18230, which is 0.4 percent lower than the Core 3 305. These deltas are all within a narrow band, indicating that the Core 3 305 sits in a tightly contested performance tier.

Passmark results for the Intel part show varied strengths. The data compression test yields a score of 146857. Data encryption reaches 11019. Extended instructions score 13543. Finding prime numbers scores 115. Floating point math achieves 42284. Integer math scores 32295. The multithread test produces 15439. Physics scores 1233. Random string sorting scores 17623. Single-thread performance is recorded at 3977 in both the single_thread and singlethread test entries, confirming consistency.

Because the Qualcomm part has no benchmark scores, the head-to-head comparison cannot be quantified with measured deltas. The database shows zero wins for each processor in the head-to-head array, reflecting the absence of comparative test data rather than a performance verdict.

The Intel's 72nd percentile ranking versus the Qualcomm's 50th percentile is the only direct percentile comparison available. That gap indicates that the Intel part outperforms a larger fraction of the database's CPU population in aggregate, but this is based solely on the Intel's recorded scores and the Qualcomm's lack thereof.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X1E-78-100 has 12 cores and 12 threads, while the Intel Core 3 305 has 6 cores and 6 threads.

Q: What is the memory bandwidth difference?

A: The Qualcomm part provides 135.2 GB/s over a dual-channel LPDDR5X bus. The Intel part provides 59.7 GB/s over a single-channel bus that supports DDR5 and LPDDR5X.

Q: How do the process nodes compare?

A: The Intel Core 3 305 is built on a 3 nm process at Intel's foundry. The Qualcomm Snapdragon X1E-78-100 is built on a 4 nm process at TSMC.

Q: Which processor has the higher boost clock?

A: The Intel Core 3 305 has a recorded boost clock of 4.30 GHz. The Qualcomm part's boost clock is not recorded in the database.

Q: What are the TDP ratings?

A: The Intel Core 3 305 has a TDP of 15 watts. The Qualcomm Snapdragon X1E-78-100 has a TDP of 35 watts.

Q: Do the processors support the same memory types?

A: No. The Intel part supports DDR5 and LPDDR5X. The Qualcomm part supports only LPDDR5X.

Specification Differences

| Specification | Intel Core 3 305 | Qualcomm Snapdragon X1E-78-100 |

|----------------|------------------|--------------------------------|

| Cores | 6 | 12 |

| Threads | 6 | 12 |

| Base Clock | 1.50 GHz | 3.40 GHz |

| Boost Clock | 4.30 GHz | Not recorded |

| TDP | 15 W | 35 W |

| Socket | Intel BGA 1516 | Qualcomm BGA 2073 |

| Codename | Wildcat Lake | Oryon |

| Generation | Core 3 (Wildcat Lake) | Snapdragon X (Elite) |

| Process Node | 3 nm | 4 nm |

| Foundry | Intel | TSMC |

| L1 Cache | 192 KB | 288 KB (per core) |

| L2 Cache | 2.5 MB | 12 MB (per module) |

| L3 Cache | 6 MB (shared) | 6 MB (shared) |

| Memory Support | DDR5, LPDDR5X | LPDDR5X |

| Memory Bus | Single-channel | Dual-channel |

| Memory Bandwidth | 59.7 GB/s | 135.2 GB/s |

| PCIe | Gen 4, 6 Lanes (CPU only) | Gen 4, 12 Lanes (CPU only) |

| Integrated Graphics | Intel Xe3 Graphics (1 Xe) | Adreno X1-85 |

| Release Date | 2026-04-15 | 2024-04-23 |

| Launch MSRP | $309 | Not recorded |

| Part Number | SAE3L | X1E78100 |

| Percentile vs All CPUs | 72 | 50 |

| Average Benchmark Score | 18302 | 0 |

| Benchmark Results | 17 recorded tests | None recorded |

The Intel part's launch MSRP of $309 is the only pricing data available; the Qualcomm part has no recorded launch MSRP. Both processors are active in production status, target the mobile market segment, and have locked multipliers. Neither supports ECC memory. The Intel part was released later, in April 2026, compared to the Qualcomm part's April 2024 release. The Qualcomm's higher TDP, larger core count, and doubled memory bandwidth indicate a design focused on throughput, while the Intel's lower TDP and higher boost clock suggest a more restrained thermal profile with strong single-thread capability.

DETAILED SPECIFICATIONS

SPECIFICATION
3 305
Snapdragon X1E-78-100
Core Specs
Cores
6
12 +100.0%
Threads
6
12 +100.0%
Base Clock (GHz)
1.5
3.4 +126.7%
Boost Clock (GHz)
4.3
—
Frequency (GHz)
1.5
3.4 +126.7%
Turbo Clock (GHz)
4.3
—
Multiplier
15
34 +126.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
192 KB
288 KB (per core)
L2 Cache
2.5 MB
12 MB (per module)
L3 Cache
6 MB (shared)
6 MB (shared)
Power
TDP (W)
15
35 +133.3%
PL2
—
45 W
Architecture
Codename
Wildcat Lake
Oryon
Generation
Core 3 (Wildcat Lake)
Snapdragon X (Elite)
Process Size
3 nm
4 nm
Foundry
Intel
TSMC
Memory
Memory Support
DDR5, LPDDR5X
LPDDR5X
Memory Bus
Single-channel
Dual-channel
Memory Bandwidth
59.7 GB/s
135.2 GB/s
ECC Memory
No
No
DDR5 Speed
6400 MT/s
—
Platform
Socket
Intel BGA 1516
Qualcomm BGA 2073
PCIe
Gen 4, 6 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 4
—
E-Core Frequency
1400 MHz up to 3.3 GHz
—
AI/NPU
NPU
—
Yes / 45 TOPS
Graphics
Integrated Graphics
Intel Xe3 Graphics (1 Xe)
Adreno X1-85
Other
Market
Mobile
Mobile
Production Status
Active
Active
Launch Price
$309
—
Part Number
SAE3L
X1E78100
Package
FC-BGA
FC-BGA
Tj Max
100°C
—
View Core 3 305 Details View Snapdragon X1E-78-100 Details