Intel Core 3 201E vs Qualcomm Snapdragon X1P-46-100 Comparison

Intel
INTEL

Intel Core 3 201E

CORE STATE Bartlett Lake
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.6 Base / 4.8 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 60W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025
VS
Unknown
CPU

Snapdragon X1P-46-100

CORE STATE Oryon
CORE SPECS 8 Cores / 8 Threads
CLOCK SPEED 3.4 Base / 4 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 30W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,271
N/A
cinebench_cinebench_r15_singlecore
179
N/A
cinebench_cinebench_r20_multicore
5,297
N/A
cinebench_cinebench_r20_singlecore
747
N/A
cinebench_cinebench_r23_multicore
12,613
N/A
cinebench_cinebench_r23_singlecore
1,780
N/A
passmark_data_compression
164,160
N/A
passmark_data_encryption
8,931
N/A
passmark_extended_instructions
11,035
N/A
passmark_find_prime_numbers
57
N/A
passmark_floating_point_math
33,260
N/A
passmark_integer_math
43,894
N/A
passmark_multithread
14,839
N/A
passmark_physics
1,141
N/A
passmark_random_string_sorting
17,783
N/A
passmark_single_thread
3,482
N/A
passmark_singlethread
3,482
N/A

Analysis: Intel Core 3 201E vs Qualcomm Snapdragon X1P-46-100

Head-to-Head Benchmarks

The recorded data shows a direct comparison is not possible for the Qualcomm Snapdragon X1P-46-100, as the database contains no benchmark scores for this processor. Its average benchmark score is recorded as zero, and its percentile ranking against all CPUs sits at 50. The Intel Core 3 201E, by contrast, has a substantial set of 17 benchmark results across Cinebench and Passmark tests, an average benchmark score of 19056, and a percentile rank of 73 against all CPUs.

For the Intel Core 3 201E, the Cinebench results indicate a strong multi-threaded performance profile. The Cinebench R23 multi-core score is 12613, while the single-core score is 1780. In Cinebench R20, the multi-core result is 5297 and the single-core result is 747. The older Cinebench R15 test shows a multi-core score of 1271 and a single-core score of 179. These figures demonstrate a processor that scales well with thread count, as the multi-core scores are substantially higher than the single-core scores across all three Cinebench versions.

Passmark results for the Intel part further characterize its capabilities. The multi-thread Passmark score is 14839, while the single-thread score is 3482. In specific workload tests, the processor delivers a floating point math score of 33260, an integer math score of 43894, and a data encryption score of 8931. Data compression reaches 164160, extended instructions score 11035, and random string sorting achieves 17783. The physics test scores 1141, and the prime number search test scores 57.

When comparing the Intel Core 3 201E to its nearest rivals in the database, the performance deltas are narrow. The AMD Ryzen 5 7535HS has an average score of 19047, which puts it at a 0 percent delta from the Intel part. The Intel Core i5-12400F scores 19039, a 0.1 percent difference. The Intel Core i5-1335U achieves 18982, a 0.4 percent delta, and the AMD EPYC 7773X scores 18979, also a 0.4 percent delta. These figures indicate that the Core 3 201E sits in a tightly contested performance band, with no single rival holding a meaningful advantage in aggregate score.

The absence of any benchmark data for the Snapdragon X1P-46-100 limits the depth of any head-to-head analysis. The database records no wins for either processor in direct comparison tests, and the head-to-head benchmark list is empty. Consequently, the only quantitative comparison available is the percentile ranking, where the Intel part at 73 sits well above the Snapdragon's 50. This difference in percentile suggests that, based on the entire CPU population in the database, the Intel processor outperforms the Qualcomm part in overall capability, though the lack of direct scores for the Snapdragon means this is an inference from the percentile field rather than a direct score comparison.

Architecture Differences

The two processors diverge significantly at the architectural level. The Intel Core 3 201E uses the Bartlett Lake codename and belongs to the Core 3 generation. It is built on a 10 nm process node by Intel's own foundry. The die size is 163 mm². The Qualcomm Snapdragon X1P-46-100 uses the Oryon codename and belongs to the Snapdragon X (Plus) generation. It is fabricated on a 4 nm process node by TSMC. The die size for the Qualcomm part is not recorded in the database.

Core and thread configurations differ substantially. The Intel processor has 4 physical cores and 8 threads, indicating Hyper-Threading support. The Qualcomm processor has 8 physical cores and 8 threads, with no multithreading capability per core. This means the Intel part relies on simultaneous multithreading to reach its thread count, while the Qualcomm part achieves its thread count purely through additional physical cores.

Cache hierarchies present notable structural differences. The Intel Core 3 201E has an L1 cache of 80 KB per core, an L2 cache of 1.25 MB per core, and a shared L3 cache of 12 MB. The Qualcomm Snapdragon X1P-46-100 has a larger L1 cache at 288 KB per core, an L2 cache of 12 MB per module, and a smaller shared L3 cache of 6 MB. The L2 cache organization differs, with Intel using a per-core allocation and Qualcomm using a per-module allocation, reflecting different design philosophies for cache sharing.

Memory support distinguishes the two clearly. The Intel processor supports both DDR4 and DDR5 memory types over a dual-channel bus, with a recorded memory bandwidth of 76.8 GB/s. It also supports ECC memory. The Qualcomm processor supports only LPDDR5X memory over a dual-channel bus, with a higher recorded memory bandwidth of 135.2 GB/s. ECC memory is not supported on the Qualcomm part.

PCI Express connectivity also differs. The Intel Core 3 201E provides Gen 5 with 16 lanes (CPU only). The Qualcomm Snapdragon X1P-46-100 provides Gen 4 with 12 lanes (CPU only). This indicates the Intel part offers both a newer PCIe generation and more available lanes for expansion devices.

Integrated graphics are present on both processors but with different implementations. The Intel part uses UHD Graphics 730, while the Qualcomm part uses Adreno X1-45. The market segments differ as well, with the Intel part targeting Desktop platforms and the Qualcomm part targeting Mobile platforms. The sockets reflect this split, with the Intel part using Intel Socket 1700 and the Qualcomm part using Qualcomm BGA 2073.

Clock speeds show the Intel processor operating at a base clock of 3.60 GHz and a boost clock of 4.80 GHz. The Qualcomm processor has a base clock of 3.40 GHz and a boost clock of 4.00 GHz. The thermal design power differs considerably, with the Intel part rated at 60 watts and the Qualcomm part at 30 watts, reflecting the mobile orientation of the latter.

FAQ

Q: What is the core and thread count difference between the two processors?

A: The Intel Core 3 201E has 4 cores and 8 threads. The Qualcomm Snapdragon X1P-46-100 has 8 cores and 8 threads.

Q: How do the boost clock speeds compare?

A: The Intel Core 3 201E boosts to 4.80 GHz, while the Qualcomm Snapdragon X1P-46-100 boosts to 4.00 GHz.

Q: Which processor supports ECC memory?

A: The Intel Core 3 201E supports ECC memory. The Qualcomm Snapdragon X1P-46-100 does not support ECC memory.

Q: What is the memory bandwidth difference?

A: The Intel Core 3 201E has a memory bandwidth of 76.8 GB/s. The Qualcomm Snapdragon X1P-46-100 has a memory bandwidth of 135.2 GB/s.

Q: Are there any benchmark scores recorded for the Qualcomm Snapdragon X1P-46-100?

A: No. The database records no benchmark scores for the Qualcomm Snapdragon X1P-46-100, and its average benchmark score is zero.

Q: What is the percentile ranking for each processor?

A: The Intel Core 3 201E ranks in the 73rd percentile against all CPUs. The Qualcomm Snapdragon X1P-46-100 ranks in the 50th percentile.

Specification Differences

| Specification | Intel Core 3 201E | Qualcomm Snapdragon X1P-46-100 |

|---|---|---|

| Cores | 4 | 8 |

| Threads | 8 | 8 |

| Base Clock | 3.60 GHz | 3.40 GHz |

| Boost Clock | 4.80 GHz | 4.00 GHz |

| TDP | 60 W | 30 W |

| Socket | Intel Socket 1700 | Qualcomm BGA 2073 |

| Codename | Bartlett Lake | Oryon |

| Process Node | 10 nm | 4 nm |

| Foundry | Intel | TSMC |

| Die Size | 163 mm² | Not recorded |

| L1 Cache | 80 KB (per core) | 288 KB (per core) |

| L2 Cache | 1.25 MB (per core) | 12 MB (per module) |

| L3 Cache | 12 MB (shared) | 6 MB (shared) |

| Memory Support | DDR4, DDR5 | LPDDR5X |

| Memory Bandwidth | 76.8 GB/s | 135.2 GB/s |

| ECC Memory | Yes | No |

| PCIe | Gen 5, 16 Lanes (CPU only) | Gen 4, 12 Lanes (CPU only) |

| Integrated Graphics | UHD Graphics 730 | Adreno X1-45 |

| Market Segment | Desktop | Mobile |

| Release Date | 2025-01-12T17:00:00.000Z | 2024-09-02T17:00:00.000Z |

| Launch MSRP | $134 | Not recorded |

| Part Number | SRVTR | X1P46100 |

| Percentile vs All CPUs | 73 | 50 |

| Average Benchmark Score | 19056 | 0 |

Where Each One Wins

The Intel Core 3 201E wins on every measurable performance dimension in the database. It has a higher base clock at 3.60 GHz versus 3.40 GHz, a higher boost clock at 4.80 GHz versus 4.00 GHz, and a higher percentile ranking at 73 versus 50. The Intel part also has a recorded average benchmark score of 19056, while the Snapdragon has no recorded scores.

The Intel Core 3 201E offers advantages in platform connectivity. It supports PCIe Gen 5 with 16 lanes, compared to Gen 4 with 12 lanes on the Qualcomm part. It also supports both DDR4 and DDR5 memory, whereas the Qualcomm part is limited to LPDDR5X. ECC memory support is exclusive to the Intel processor.

The Qualcomm Snapdragon X1P-46-100 wins on efficiency-oriented specifications. Its TDP is 30 watts, half the 60 watts of the Intel part. It has a smaller process node at 4 nm versus 10 nm, which typically correlates with lower power consumption. The memory bandwidth is higher at 135.2 GB/s versus 76.8 GB/s, and the L1 and L2 caches are larger per core or per module, at 288 KB and 12 MB respectively, compared to 80 KB and 1.25 MB on the Intel part.

The use-case split follows these specification differences. The Intel Core 3 201E is positioned for desktop workloads where higher clocks, PCIe Gen 5 connectivity, and ECC memory support matter. Its 4-core, 8-thread configuration with a 4.80 GHz boost clock suits applications that benefit from high single-thread performance. The Cinebench R23 single-core score of 1780 and the Passmark single-thread score of 3482 reflect this strength.

The Qualcomm Snapdragon X1P-46-100 is positioned for mobile platforms. Its lower TDP of 30 watts, smaller 4 nm process node, and higher memory bandwidth of 135.2 GB/s indicate a focus on power-constrained environments. The 8-core configuration without multithreading provides parallel throughput potential, though the lack of recorded benchmark data prevents a quantitative assessment of its actual performance.

The Intel part also has the advantage of an established benchmark record. Its nearest rivals, including the AMD Ryzen 5 7535HS and Intel Core i5-12400F, sit within 0.4 percent of its average score, placing it in a competitive performance tier. The Snapdragon has no such data, leaving its real-world capabilities unverified in the database.

DETAILED SPECIFICATIONS

SPECIFICATION
3 201E
Snapdragon X1P-46-100
Core Specs
Cores
4
8 +100.0%
Threads
8
8 0.0%
Base Clock (GHz)
3.6
3.4 -5.6%
Boost Clock (GHz)
4.8
4 -16.7%
Frequency (GHz)
3.6
3.4 -5.6%
Turbo Clock (GHz)
4.8
4 -16.7%
Multiplier
36
34 -5.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
12 MB (per module)
L3 Cache
12 MB (shared)
6 MB (shared)
Power
TDP (W)
60
30 -50.0%
PL1
60 W
PL2
110 W
35 W
Architecture
Codename
Bartlett Lake
Oryon
Generation
Core 3 (Bartlett Lake)
Snapdragon X (Plus)
Process Size
10 nm
4 nm
Die Size
163 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
135.2 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2073
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
AI/NPU
NPU
Yes / 45 TOPS
Graphics
Integrated Graphics
UHD Graphics 730
Adreno X1-45
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$134
Part Number
SRVTR
X1P46100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
View Core 3 201E Details View Snapdragon X1P-46-100 Details