Intel Core 3 100U vs Qualcomm Snapdragon X2E-78-100 Comparison

Intel
INTEL

Intel Core 3 100U

CORE STATE Raptor Lake-U
CORE SPECS 6 Cores / 8 Threads
CLOCK SPEED 1.2 Base / 4.7 GHz Turbo
CACHE 10 MB (shared)
MAX TDP 15W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X2E-78-100

CORE STATE Glymur
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 4 Base
CACHE —
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,070
N/A
cinebench_cinebench_r15_singlecore
150
N/A
cinebench_cinebench_r20_multicore
4,462
N/A
cinebench_cinebench_r20_singlecore
629
N/A
cinebench_cinebench_r23_multicore
10,624
N/A
cinebench_cinebench_r23_singlecore
1,499
N/A
passmark_data_compression
136,497
N/A
passmark_data_encryption
8,128
N/A
passmark_extended_instructions
7,894
N/A
passmark_find_prime_numbers
52
N/A
passmark_floating_point_math
28,322
N/A
passmark_integer_math
39,580
N/A
passmark_multithread
12,522
N/A
passmark_physics
876
N/A
passmark_random_string_sorting
15,191
N/A
passmark_single_thread
3,506
N/A
passmark_singlethread
3,506
N/A

Analysis: Intel Core 3 100U vs Qualcomm Snapdragon X2E-78-100

FAQ

Q: How do the core and thread counts compare between the two processors?

A: The Intel Core 3 100U provides 6 cores and 8 threads, while the Qualcomm Snapdragon X2E-78-100 offers 12 cores and 12 threads. The Qualcomm part has double the physical cores, but it lacks the hyper-threading capability that gives the Intel chip its two extra threads.

Q: What process nodes are used for each processor?

A: The Intel Core 3 100U is fabricated on Intel's 10 nm process, while the Snapdragon X2E-78-100 uses TSMC's 3 nm node. The Qualcomm part also has a stated die size of 220 mm², whereas the Intel chip has no recorded die size in the database.

Q: Which processor has a higher single-core clock speed?

A: The Snapdragon X2E-78-100 has a base clock of 4.00 GHz and no recorded boost clock, while the Intel Core 3 100U has a 1.20 GHz base clock and a 4.70 GHz boost clock. The Intel part's boost clock is the highest recorded clock speed between the two.

Q: What memory types do these processors support?

A: The Intel Core 3 100U supports DDR4 and DDR5 memory in a dual-channel configuration. The Snapdragon X2E-78-100 supports LPDDR5X memory, also dual-channel, with a recorded memory bandwidth of 152.4 GB/s. The Intel chip has no recorded memory bandwidth figure.

Q: What integrated graphics are present on each chip?

A: The Intel Core 3 100U uses UHD Graphics 64EU, while the Snapdragon X2E-78-100 integrates Adreno X2-85 graphics. The database does not include benchmark scores for either integrated GPU.

Q: Which processor has a higher overall benchmark percentile?

A: The Intel Core 3 100U sits at the 70th percentile among all CPUs in the database, with an average benchmark score of 16148. The Snapdragon X2E-78-100 is at the 50th percentile with an average benchmark score of 0, meaning no benchmark data has been recorded for it yet.

Where Each One Wins

The Intel Core 3 100U is the only processor in this comparison with recorded benchmark results. It delivers a full suite of Cinebench and PassMark scores, giving it a clear advantage in any measured workload comparison. Its nearest rivals in the database include the Intel Core i7-10850H, which scores 16204 on average and is 0.3% ahead, and the Intel Core i5-10600KF, which scores 16228 and is 0.5% ahead. The AMD Ryzen 5 4600H scores 16341, putting it 1.2% ahead of the Intel Core 3 100U. These are tight margins, indicating the Intel part sits in a competitive performance band despite its lower core count.

The Snapdragon X2E-78-100 has no benchmark entries, no average score, and no nearest rivals in the database. Its 12 cores and 4.00 GHz base clock suggest it is positioned for multi-threaded throughput, but the recorded data cannot confirm any performance advantage. In the absence of measurements, the Qualcomm part cannot be assigned any workload wins. The Intel Core 3 100U wins by default in every category where data exists: single-core performance, multi-core performance, and specialized instruction workloads.

For users focused on tasks like data compression, the Intel chip records a PassMark data compression score of 136497. For encryption-heavy workloads, it scores 8128 in data encryption. Floating-point math reaches 28322, integer math reaches 39580, and extended instructions score 7894. These figures define the Intel part's strengths across several compute patterns. The Qualcomm chip has no comparable recorded values, so it holds no measurable wins in the current database.

Architecture Differences

The Intel Core 3 100U uses the Raptor Lake architecture under the Raptor Lake-U codename. It belongs to the Core 3 generation and is built on a 10 nm process at Intel's own foundry. The Snapdragon X2E-78-100 uses the Glymur codename and belongs to the Snapdragon X2 (Elite) generation, fabricated on a 3 nm process at TSMC. The process node gap is significant: 10 nm versus 3 nm, which typically implies a large difference in transistor density and power efficiency, though no transistor counts are recorded for either part.

Cache layouts differ substantially. The Intel chip has 80 KB of L1 cache per core, 1.25 MB of L2 cache per core, and 10 MB of shared L3 cache. The Snapdragon part has 288 KB of L1 cache per core and 16 MB of shared L2 cache, with no L3 cache recorded. The Qualcomm design concentrates more cache per core at the L1 level and uses a larger shared L2 pool, while the Intel design adds a third cache level. The die size of the Snapdragon part is recorded as 220 mm², while no die size is listed for the Intel chip.

The PCIe interfaces also differ. The Intel Core 3 100U provides PCIe Gen 4 with 8 lanes (CPU only), while the Snapdragon X2E-78-100 provides PCIe Gen 5 with 12 lanes (CPU only). The Qualcomm part supports a newer PCIe generation and more lanes. Memory controllers also diverge: Intel supports both DDR4 and DDR5, while Qualcomm supports only LPDDR5X. The Snapdragon part has a recorded memory bandwidth of 152.4 GB/s, which the Intel chip lacks in the database.

Both processors are marked as active production parts and target the mobile segment. Neither has an unlocked multiplier. The Intel part has the part number SRMYL, while the Qualcomm part is designated X2E78100.

Specification Differences

The core counts differ: 6 cores for Intel versus 12 cores for Qualcomm. Thread counts also differ: 8 threads for Intel versus 12 threads for Qualcomm, since the Intel part uses hyper-threading and the Qualcomm part does not. Base clocks are 1.20 GHz for Intel and 4.00 GHz for Qualcomm. The Intel chip has a boost clock of 4.70 GHz, while the Qualcomm chip has no recorded boost clock.

Thermal design power differs: the Intel Core 3 100U has a TDP of 15 watts, while the Snapdragon X2E-78-100 has no TDP recorded. Sockets are different: Intel BGA 1744 for the Intel part and Qualcomm BGA 2343 for the Snapdragon part. Process nodes are 10 nm for Intel and 3 nm for Qualcomm. The foundries are Intel and TSMC, respectively.

Cache configurations differ at every level. The Intel part has 80 KB L1 per core, 1.25 MB L2 per core, and 10 MB shared L3. The Qualcomm part has 288 KB L1 per core and 16 MB shared L2, with no L3. The Intel chip supports DDR4 and DDR5 memory, while the Qualcomm chip supports LPDDR5X exclusively. The Intel part has PCIe Gen 4 with 8 lanes, while the Qualcomm part has PCIe Gen 5 with 12 lanes.

The integrated graphics units differ: UHD Graphics 64EU on the Intel side, Adreno X2-85 on the Qualcomm side. The release dates are also different, with the Intel part coming earlier and the Qualcomm part later. The Intel part has a launch MSRP of $426, while the Qualcomm part has no recorded launch MSRP. The Intel part has an average benchmark score of 16148 and a 70th percentile ranking, while the Qualcomm part has an average benchmark score of 0 and a 50th percentile ranking.

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark entries between the Intel Core 3 100U and the Qualcomm Snapdragon X2E-78-100. The head-to-head table is empty, and the wins counters for both sides are zero. As a result, any comparison relies entirely on the Intel part's recorded benchmark suite and the absence of recorded data for the Qualcomm part.

The Intel Core 3 100U shows its strongest multi-core result in Cinebench R23, with a multicore score of 10624 and a single-core score of 1499. In Cinebench R20, it scores 4462 multicore and 629 single-core. In Cinebench R15, it scores 1070 multicore and 150 single-core. These results place the Intel part at the 70th percentile among all CPUs in the database, with an average benchmark score of 16148.

PassMark results for the Intel part are broad. The multithread score is 12522, and the single-thread score is 3506. Data compression reaches 136497, which is the highest single PassMark score recorded for this chip. Data encryption scores 8128, extended instructions score 7894, floating-point math scores 28322, and integer math scores 39580. Random string sorting scores 15191, physics scores 876, and finding prime numbers scores 52.

The nearest rivals for the Intel Core 3 100U provide context for its standing. The Intel Core i7-10850H has an average score of 16204, which is 0.3% higher. The Intel Core i5-10600KF scores 16228, 0.5% higher. The Intel Core i7-1260U scores 16320, 1.1% higher. The AMD Ryzen 5 4600H scores 16341, 1.2% higher. These small deltas indicate the Intel Core 3 100U performs within a narrow band of established desktop and mobile processors, despite having fewer cores than some of its rivals.

The Snapdragon X2E-78-100 cannot be benchmarked against the Intel part because it has no recorded scores. Its 12 cores and 3 nm process suggest potential, but the database shows no measurements to confirm any performance level. The Intel Core 3 100U therefore stands as the only fully characterized processor in this pairing, with all recorded wins by default due to the lack of comparable data from the Qualcomm side.

DETAILED SPECIFICATIONS

SPECIFICATION
3 100U
Snapdragon X2E-78-100
Core Specs
Cores
6
12 +100.0%
Threads
8
12 +50.0%
Base Clock (GHz)
1.2
4 +233.3%
Boost Clock (GHz)
4.7
—
Frequency (GHz)
1.2
4 +233.3%
Turbo Clock (GHz)
4.7
—
Multiplier
12
40 +233.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
16 MB (shared)
L3 Cache
10 MB (shared)
—
Power
TDP (W)
15
—
PL1
15 W
—
PL2
55 W
—
Architecture
Architecture
Raptor Lake
—
Codename
Raptor Lake-U
Glymur
Generation
Core 3 (Raptor Lake-U)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
—
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
—
152.4 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
—
DDR5 Speed
5200 MT/s
—
Platform
Socket
Intel BGA 1744
Qualcomm BGA 2343
PCIe
Gen 4, 8 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 4
6 + 6
E-Core Frequency
900 MHz up to 3.3 GHz
3.4 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
UHD Graphics 64EU
Adreno X2-85
Other
Market
Mobile
Mobile
Production Status
Active
Active
Launch Price
$426
—
Part Number
SRMYL
X2E78100
Package
FC-BGA16F
FC-BGA
Tj Max
100°C
—
View Core 3 100U Details View Snapdragon X2E-78-100 Details