Intel Arc G3 vs Qualcomm Snapdragon X2E-94-100 Comparison

Intel
INTEL

Intel Arc G3

CORE STATE Panther Lake
CORE SPECS 14 Cores / 14 Threads
CLOCK SPEED 1.9 Base / 4.6 GHz Turbo
CACHE 18 MB (shared)
MAX TDP 25W
ARCHITECTURE Panther Lake
nm
PROCESS 3 nm
LAUNCH DATE 2026
VS
Unknown
CPU

Snapdragon X2E-94-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4.45 Base / 4.7 GHz Turbo
CACHE 9 MB (shared)
MAX TDP
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Arc G3 vs Qualcomm Snapdragon X2E-94-100

Intel Arc G3 and Qualcomm Snapdragon X2E-94-100 are two mobile processors aimed at different segments of the laptop market. The Intel part, built on the Panther Lake architecture, is a 14-core, 14-thread chip with a base clock of 1.90 GHz and a boost clock of 4.60 GHz. The Qualcomm Snapdragon X2E-94-100, codenamed Glymur, offers 18 cores and 18 threads, with a base clock of 4.45 GHz and a boost clock of 4.70 GHz. Both chips are fabricated on a 3 nm process, though Intel uses its own foundry while Qualcomm relies on TSMC. The recorded database entries show no benchmark scores for either processor, with zero average benchmark scores and zero head-to-head results. This absence of measured performance data means the comparison must be built entirely from architectural and specification differences, plus the limited contextual fields present in the database. Both processors sit at the 50th percentile against all CPUs, a neutral placement that offers no direct performance differentiation. The following sections analyze what the recorded specifications imply about each chip's behavior, what each design appears optimized for, and which workloads each would likely handle with greater ease based on the available facts.

Head-to-Head Benchmarks

The database currently holds no head-to-head benchmark results between the Intel Arc G3 and the Qualcomm Snapdragon X2E-94-100. The head-to-head benchmark array is empty, and neither processor has any individual benchmark entries. The wins counter for both parts is zero, meaning there are no recorded victories for either chip in any tested workload. Without measured scores, any claim about which processor is faster in a specific application cannot be supported by direct data. The only quantitative comparisons available come from the specification fields, which can be used to infer relative strengths.

Clock speed is the most direct point of comparison. The Qualcomm part boosts to 4.70 GHz, which is 0.10 GHz higher than the Intel chip's 4.60 GHz boost clock. The base clock difference is much larger: Qualcomm runs at 4.45 GHz base, while Intel sits at 1.90 GHz base. That 2.55 GHz gap in base frequency is substantial. A higher base clock suggests the Snapdragon X2E-94-100 can sustain high frequency under continuous load without relying on boost states, which could translate to steadier performance in long-duration workloads. The Intel Arc G3, with a 1.90 GHz base clock, appears designed to conserve power when idle or lightly loaded, ramping up to 4.60 GHz only when needed.

Core count also favors Qualcomm. The Snapdragon X2E-94-100 has 18 cores versus Intel's 14, a difference of 4 cores. Both processors use a 1:1 core-to-thread ratio, so the Qualcomm chip also has 18 threads against Intel's 14. For parallel workloads that scale with core count, such as video encoding, 3D rendering, or compilation tasks, the additional 4 cores give Qualcomm a theoretical advantage. However, core count alone does not determine performance, as IPC, cache hierarchy, and memory bandwidth all play roles.

Cache configuration shows a notable contrast. The Intel Arc G3 has a larger L3 cache at 18 MB shared, while the Snapdragon X2E-94-100 has 9 MB shared L3. Intel's L3 is exactly double that of Qualcomm's. L1 cache per core also differs: Intel provides 192 KB per core, while Qualcomm provides 288 KB per core, which is 96 KB more per core. L2 cache is structured differently: Intel has 2.5 MB per core, while Qualcomm has 16 MB per module. Without knowing the module size in cores, direct L2 comparison is not possible, but the per-module figure suggests Qualcomm's L2 is organized in larger blocks.

Memory bandwidth heavily favors Qualcomm. The Snapdragon X2E-94-100 uses a triple-channel LPDDR5X memory bus and achieves 228.6 GB/s, while the Intel Arc G3 uses dual-channel LPDDR5X and reaches 136.5 GB/s. The difference is 92.1 GB/s, making Qualcomm about 67% faster in theoretical memory bandwidth. This is a major factor for memory-intensive workloads like data processing, large database operations, or integrated graphics tasks that rely on system memory.

PCIe connectivity also differs. Qualcomm offers Gen 5 with 12 lanes, while Intel offers Gen 5 with 4 lanes. That is a difference of 8 lanes. For tasks involving fast NVMe storage or external GPU connections, the Qualcomm part has significantly more available bandwidth for peripheral devices.

Where Each One Wins

Based strictly on the recorded specifications, the Qualcomm Snapdragon X2E-94-100 appears optimized for sustained throughput and memory-heavy tasks. Its 4.45 GHz base clock is exceptionally high for a mobile processor, suggesting it can maintain high performance without thermal or power throttling under continuous load. The 18 cores and 18 threads provide more parallel execution resources than the Intel chip. The triple-channel memory bus with 228.6 GB/s bandwidth gives it a clear edge in any workload that moves large amounts of data, including video editing, scientific computing, and multi-tasking with many active applications. The 12 PCIe Gen 5 lanes also allow for more direct connectivity to high-speed storage arrays or discrete accelerators, which could benefit professional workflows that rely on external devices.

The Intel Arc G3, meanwhile, shows strengths in cache capacity and power efficiency. Its 18 MB shared L3 cache is double the Qualcomm chip's 9 MB, which can reduce memory latency for frequently accessed data sets. The per-core L1 cache of 192 KB, while smaller than Qualcomm's 288 KB, is paired with a 2.5 MB per-core L2 cache, which is a generous allocation for each core. The 25 W TDP is the only power figure recorded for either chip, and it is low for a 14-core processor, indicating Intel designed this part for thin-and-light laptops where battery life and thermal headroom are priorities. The lower base clock of 1.90 GHz supports this efficiency-oriented design, as the chip can idle at low frequency and only boost when needed.

The integrated graphics differ in name only: Intel uses Arc B370, while Qualcomm uses Adreno X2-90. No benchmark data or specification details are available for either GPU, so no performance comparison can be made. Both processors support LPDDR5X memory, so memory type is not a differentiator.

The Verdict

The data suggests two very different design philosophies. For workloads that rely on raw thread count, sustained frequency, and memory bandwidth, the Qualcomm Snapdragon X2E-94-100 appears better suited. Its 18 cores, 4.45 GHz base clock, and 228.6 GB/s memory bandwidth form a coherent profile for demanding multi-threaded applications. The 12 PCIe Gen 5 lanes also give it more room for high-throughput peripherals.

For workloads that benefit from large shared cache and lower power consumption, the Intel Arc G3 holds the advantage. Its 18 MB L3 cache is twice that of the Qualcomm chip, and its 25 W TDP is the only power figure in the database, indicating a focus on efficiency. The 4.60 GHz boost clock is close to Qualcomm's 4.70 GHz, so in short bursts of single-threaded activity, the Intel chip is likely competitive, though the lower base clock means sustained single-threaded performance may favor Qualcomm.

There is no measured benchmark data to confirm these inferences. Both processors sit at the 50th percentile against all CPUs, and neither has an average benchmark score above zero. The verdict must be conditional: the Qualcomm part appears to target maximum throughput, while the Intel part appears to target efficiency with adequate peak performance. Users who prioritize multi-core throughput and memory bandwidth would likely favor the Snapdragon X2E-94-100 based on its core count and memory subsystem. Users who prioritize cache capacity and low power draw would likely favor the Intel Arc G3 based on its larger L3 and 25 W TDP.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-94-100 has 18 cores and 18 threads, while the Intel Arc G3 has 14 cores and 14 threads.

Q: What is the memory bandwidth difference between the two?

A: The Qualcomm Snapdragon X2E-94-100 has a triple-channel LPDDR5X bus with 228.6 GB/s bandwidth, while the Intel Arc G3 has a dual-channel LPDDR5X bus with 136.5 GB/s bandwidth, a difference of 92.1 GB/s.

Q: Which processor has a higher boost clock?

A: The Qualcomm Snapdragon X2E-94-100 boosts to 4.70 GHz, which is 0.10 GHz higher than the Intel Arc G3's 4.60 GHz boost clock.

Q: How do the cache sizes compare?

A: The Intel Arc G3 has 18 MB shared L3 cache and 192 KB L1 per core, while the Qualcomm Snapdragon X2E-94-100 has 9 MB shared L3 cache and 288 KB L1 per core. The Intel chip's L3 is double the Qualcomm chip's L3.

Q: What is the TDP of the Intel Arc G3?

A: The Intel Arc G3 has a TDP of 25 W. No TDP figure is recorded for the Qualcomm Snapdragon X2E-94-100.

Q: Do both processors use the same manufacturing process?

A: Yes, both are built on a 3 nm process. Intel fabricates the Arc G3 at its own foundry, while Qualcomm uses TSMC for the Snapdragon X2E-94-100.

Architecture Differences

The Intel Arc G3 is based on the Panther Lake codename and is listed as part of the Arc G3 generation. The Qualcomm Snapdragon X2E-94-100 uses the Glymur codename and belongs to the Snapdragon X2 (Elite) generation. Both are mobile processors with active production status.

The core configuration differs in both count and threading. Intel provides 14 cores with 14 threads, meaning no simultaneous multithreading. Qualcomm provides 18 cores with 18 threads, also without SMT. The Intel chip has a base clock of 1.90 GHz and a boost clock of 4.60 GHz. The Qualcomm chip has a base clock of 4.45 GHz and a boost clock of 4.70 GHz. The base clock gap of 2.55 GHz is the largest single clock difference between the two parts.

Cache organization follows different strategies. Intel uses 192 KB L1 per core, 2.5 MB L2 per core, and 18 MB shared L3. Qualcomm uses 288 KB L1 per core, 16 MB L2 per module, and 9 MB shared L3. The L3 difference is exactly 9 MB in Intel's favor. The L2 layout cannot be directly compared because Intel's is per core and Qualcomm's is per module, and no module size is recorded.

Both processors support LPDDR5X memory, but the memory bus differs. Intel uses dual-channel with 136.5 GB/s bandwidth. Qualcomm uses triple-channel with 228.6 GB/s bandwidth. Neither supports ECC memory.

PCIe connectivity also differs. Intel provides Gen 5 with 4 lanes, while Qualcomm provides Gen 5 with 12 lanes. Both are CPU-only lane counts per the database.

The process node is identical at 3 nm, but the foundries differ. Intel uses its own fabrication, while Qualcomm uses TSMC. The Qualcomm die size is recorded as 220 mm², while Intel's die size is not listed. Transistor counts are not recorded for either chip.

Integrated graphics are present on both. Intel uses Arc B370, and Qualcomm uses Adreno X2-90. No specifications or benchmark data are available for either GPU.

Specification Differences

The two processors differ in several recorded specification fields. The Qualcomm Snapdragon X2E-94-100 has 18 cores and 18 threads, while the Intel Arc G3 has 14 cores and 14 threads, a difference of 4 cores and 4 threads.

Base clock: Intel runs at 1.90 GHz, Qualcomm at 4.45 GHz, a 2.55 GHz difference. Boost clock: Intel runs at 4.60 GHz, Qualcomm at 4.70 GHz, a 0.10 GHz difference.

TDP: Intel is recorded at 25 W. Qualcomm has no TDP value listed.

Socket: Intel uses Intel BGA 2540, Qualcomm uses Qualcomm BGA 2343.

Memory bus: Intel is dual-channel, Qualcomm is triple-channel. Memory bandwidth: Intel is 136.5 GB/s, Qualcomm is 228.6 GB/s, a 92.1 GB/s difference.

PCIe: Intel has Gen 5 with 4 lanes, Qualcomm has Gen 5 with 12 lanes, a difference of 8 lanes.

Cache: Intel has 192 KB L1 per core, 2.5 MB L2 per core, and 18 MB shared L3. Qualcomm has 288 KB L1 per core, 16 MB L2 per module, and 9 MB shared L3. L1 per core differs by 96 KB in Qualcomm's favor. L3 differs by 9 MB in Intel's favor.

Process node: both are 3 nm. Foundry: Intel uses Intel, Qualcomm uses TSMC. Die size: Qualcomm is 220 mm², Intel is not recorded.

Codename: Intel is Panther Lake, Qualcomm is Glymur. Generation: Intel is Arc G3 (Panther Lake), Qualcomm is Snapdragon X2 (Elite). Release date: Intel is 2026-05-27, Qualcomm is 2026-04-05. The Qualcomm chip was released earlier by 52 days.

Part number: Intel is SA4QZ, Qualcomm is X2E94100. Neither has a launch MSRP recorded, and neither has an unlocked multiplier. Both are classified as mobile market segment processors with active production status.

DETAILED SPECIFICATIONS

SPECIFICATION
G3
Snapdragon X2E-94-100
Core Specs
Cores
14
18 +28.6%
Threads
14
18 +28.6%
Base Clock (GHz)
1.9
4.45 +134.2%
Boost Clock (GHz)
4.6
4.7 +2.2%
Frequency (GHz)
1.9
4.45 +134.2%
Turbo Clock (GHz)
4.6
4.7 +2.2%
Multiplier
19
44.5 +134.2%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
192 KB (per core)
288 KB (per core)
L2 Cache
2.5 MB (per core)
16 MB (per module)
L3 Cache
18 MB (shared)
9 MB (shared)
Power
TDP (W)
25
Configurable TDP
15-45 W
Architecture
Codename
Panther Lake
Glymur
Generation
Arc G3 (Panther Lake)
Snapdragon X2 (Elite)
Process Size
3 nm
3 nm
Die Size
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
LPDDR5X
LPDDR5X
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
136.5 GB/s
228.6 GB/s
ECC Memory
No
No
Platform
Socket
Intel BGA 2540
Qualcomm BGA 2343
PCIe
Gen 5, 4 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 12
12 + 6
E-Core Frequency
1500 MHz up to 3.3 GHz
3.6 GHz
LP E-Cores
4
AI/NPU
NPU
Yes / 46 TOPS
Yes / 80 TOPS
Graphics
Integrated Graphics
Arc B370
Adreno X2-90
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
SA4QZ
X2E94100
Package
FC-BGA
FC-BGA
Tj Max
100°C
View Arc G3 Details View Snapdragon X2E-94-100 Details