CPU Comparison

A

AMD

AMD

AMD Sempron 3400+ EE SFF

CORE STATE Manila

CORE SPECS 1 Cores / 1 Threads

CLOCK SPEED 1800 Base

CACHE —

MAX TDP 35W

ARCHITECTURE K8

nm

PROCESS 90 nm

LAUNCH DATE 2006

VS

i

Intel

INTEL

Core i7-960

CORE STATE Bloomfield

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.2 Base / 3.47 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 130W

ARCHITECTURE Nehalem

nm

PROCESS 45 nm

LAUNCH DATE 2009

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

N/A

288

cinebench_cinebench_r20_multicore

N/A

1,203

cinebench_cinebench_r20_singlecore

N/A

169

cinebench_cinebench_r23_multicore

N/A

2,865

cinebench_cinebench_r23_singlecore

N/A

404

DETAILED SPECIFICATIONS

SPECIFICATION

Sempron 3400+ EE SFF

i7-960

Core Specs

Cores

1

4 +300.0%

Threads

1

8 +700.0%

Base Clock (GHz)

1,800

3.2 -99.8%

Boost Clock (GHz)

—

3.47

Frequency (GHz)

1,800

3.2 -99.8%

Turbo Clock (GHz)

—

3.47

Multiplier

9

24 +166.7%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

128 KB

64 KB (per core)

L2 Cache

256 KB

256 KB (per core)

L3 Cache

—

8 MB (shared)

Power

TDP (W)

35

130 +271.4%

Architecture

Architecture

K8

Nehalem

Codename

Manila

Bloomfield

Generation

Sempron (Manilla)

Core i7 (Bloomfield)

Process Size

90 nm

45 nm

Transistors

81 million

731 million

Die Size

103 mm²

263 mm²

Foundry

—

Intel

Memory

Memory Support

—

DDR3

Memory Bus

Dual-channel

Triple-channel

ECC Memory

No

No

Platform

Socket

AMD Socket AM2

Intel Socket 1366

PCIe

Gen 2

Gen 2

Graphics

Integrated Graphics

On certain motherboards (Chipset feature)

—

Other

Market

Desktop

Desktop

Production Status

End-of-life

End-of-life

Part Number

SDD3400IAA3CN

SLBEU

Package

µPGA

FC-LGA8

View Sempron 3400+ EE SFF Details View Core i7-960 Details