AMD Sempron 3400+ EE SFF

The AMD Sempron 3400+ EE SFF is a single-core desktop processor built on the K8 architecture, with the codename Manila and a generation listed as Sempron (Manilla). Released on May 22, 2006, it runs at a fixed 1800 MHz with no boost clock. The processor carries a 35 W TDP, uses AMD Socket AM2, and supports a dual-channel memory bus with PCIe Gen 2. In the benchmark database, this part sits at the 50th percentile among all CPUs, but its average benchmark score is zero, and the nearestRivals list is empty — indicating that no measured comparative scores are available.

Benchmark Performance

The benchmark record for this processor is almost entirely empty. The benchmarks array contains no entries, and the avgBenchmarkScore field is zero. The nearestRivals list is empty, so there are no rival names, scores, or deltaPct values to draw upon. The only quantitative placement is the percentileVsAllCpus value of 50, which places the Sempron 3400+ EE SFF at the exact midpoint of the database's CPU population. A 50th percentile is a neutral position — it implies that half of the tracked processors rank above and half below — but with a zero average score, this percentile is not backed by measured workload data. It may reflect a default or estimated placement rather than a tested result.

Consequently, performance analysis must fall back on the architectural specifications. The processor has one core and one thread, a base clock of 1800 MHz, and a 256 KB L2 cache. These figures describe a part with a very narrow execution width: it can process exactly one instruction stream at a time. The 128 KB L1 cache and 256 KB L2 cache are the only cache levels, as there is no L3. In the absence of benchmark scores, the 50th percentile is the sole comparative metric, and it should be interpreted cautiously. The data does not support any claim of superiority or deficiency relative to specific rivals, because no rival data is recorded. What the data does show is a single-core, single-thread processor with a modest cache footprint, placed at the median of the database's CPU population.

Single-Thread vs Multi-Thread Behavior

With one core and one thread, the Sempron 3400+ EE SFF is a purely single-threaded processor. There is no simultaneous multithreading, no second core, and no boost clock to raise the frequency above 1800 MHz. Every workload — whether it is a web browser tab, a word processor, or a spreadsheet — executes on the same single logical path. This has direct implications for real workloads. Applications that are written to use multiple threads will see no parallel speedup; they will be serialized onto the one available thread. Applications that are inherently single-threaded, such as many legacy office tools, will run at the full 1800 MHz clock.

The cache arrangement is small: 128 KB of L1 and 256 KB of L2, with no L3 cache. A small L2 cache means that workloads with large working sets may spend more time waiting on memory, though the dataset does not quantify the penalty. The dual-channel memory bus is a mitigating factor, as it provides a wider path to feed the single core's requests. The absence of a boost clock is notable: the processor operates at a constant 1800 MHz regardless of load, so there is no transient frequency increase. For single-thread performance, the 1800 MHz clock and the 256 KB L2 are the two relevant numbers. For multi-thread performance, the answer is straightforward: there is none, because the hardware supports only one thread. The 50th percentile placement reflects this single-thread design in the aggregate database, but it does not break down performance by thread count. In practice, users should expect consistent single-thread behavior and no multi-thread scaling.

Platform and Compatibility

The Sempron 3400+ EE SFF is built for AMD Socket AM2. The architecture is K8, with the codename Manila, and the generation is listed as Sempron (Manilla). The memory bus is dual-channel, though the dataset does not specify the memory type or speed. ECC memory is not supported, so error-correcting memory cannot be used. The PCIe interface is Gen 2, which is the expansion bus generation available to the platform. Integrated graphics are not part of the processor die; instead, they are a chipset feature available on certain motherboards. This means display output depends on the motherboard's chipset, not on the CPU itself. The multiplier is locked, so the CPU frequency cannot be changed by adjusting the multiplier. The part number is SDD3400IAA3CN.

The production status is end-of-life, indicating that AMD has discontinued manufacturing. The release date of May 22, 2006 places this processor in the early AM2 platform period. The physical implementation uses a 90 nm process node, with 81 million transistors and a die size of 103 mm². The upgrade path is defined by the socket: any replacement processor must also fit Socket AM2. Because the production status is end-of-life, no new firmware updates or feature additions are expected. The dual-channel memory bus is a notable platform feature for a single-core part, as it allows the memory controller to access multiple channels simultaneously; the dataset does not provide a bandwidth figure, but the dual-channel capability is recorded. The absence of ECC support and the locked multiplier are constraints to consider when planning a system around this processor. The platform is mature and static, with no expansion of features anticipated.

Who Should Consider It

This processor is aimed at the desktop market segment. Its single core and single thread make it appropriate for workloads that do not scale across multiple threads. The 1800 MHz base clock and the 256 KB L2 cache suggest that lightweight office tasks — text editing, spreadsheet work, and basic web browsing — are within its capability. For gaming, the situation is more complex. The processor has no integrated graphics of its own; integrated graphics are a chipset feature on certain motherboards, so a discrete GPU would be required for any graphics-intensive workload. The single-thread performance of the Sempron 3400+ EE SFF is the only compute resource, and the 50th percentile placement among all CPUs indicates a mid-pack position in the aggregate database. However, the zero average benchmark score means there is no measured evidence of real-world gaming performance.

For content creation, the lack of multi-threading is a decisive limitation. Rendering, video encoding, and compilation tasks that use multiple threads will not benefit from parallel execution, because the processor has only one thread. The dual-channel memory bus can help feed the single core, but it cannot compensate for the absence of additional cores. The end-of-life production status further limits its appeal for new builds; the platform is no longer supported. For a system that runs a single-threaded application at a fixed 1800 MHz with a 35 W TDP, this processor is a candidate. For anything requiring multi-thread throughput or modern platform features, it is not. The locked multiplier prevents overclocking, so performance is fixed at the 1800 MHz specification. The 128 KB L1 and 256 KB L2 caches are the only cache resources, and there is no L3. The data does not support a recommendation for gaming or creation workloads, but for a basic, single-threaded desktop role, the specifications are adequate.

Power and Thermals

The TDP is rated at 35 W, which places this processor in a low-power class. The 90 nm process node, 81 million transistors, and 103 mm² die size define the silicon's physical characteristics. A 35 W TDP implies a modest thermal output. The cooling requirement is not specified in the dataset, but the low TDP means that a capable air cooler — a small heatsink with a low-speed fan — is likely sufficient. The single core and the fixed 1800 MHz clock contribute to the low power draw. Because there is no boost clock, the processor does not transiently increase its power consumption under load; it operates at a constant frequency. The locked multiplier prevents voltage and frequency adjustments through multiplier changes, so the thermal profile is stable and predictable.

In a small form factor system — as the 'SFF' designation in the model name suggests — the 35 W TDP is an advantage, because it reduces the cooling burden in a constrained chassis. The end-of-life production status means that AMD no longer provides thermal guidance, but the 35 W rating is a fixed specification. The 90 nm process is a relatively large feature size, but the 35 W TDP is the primary thermal indicator. The 81 million transistors and 103 mm² die size are the physical parameters that influence heat generation. Overall, the data shows a part that is easy to cool, with a thermal design point that aligns with small form factor systems. The absence of a boost clock and the locked multiplier mean that the thermal envelope is constant, with no power spikes. This makes the processor well-suited to environments where cooling is limited and where a stable, low-power operation is desired.