CPU Comparison
AMD
AMD Sempron 3200+
CORE STATE
Palermo
CORE SPECS
1 Cores / 1 Threads
CLOCK SPEED
1800 Base
CACHE
โ
MAX TDP
62W
ARCHITECTURE
K8
PROCESS
90 nm
LAUNCH DATE
2005
VS
INTEL
Core i7-620LE
CORE STATE
Arrandale
CORE SPECS
2 Cores / 4 Threads
CLOCK SPEED
2000 Base / 2.8 GHz Turbo
CACHE
4 MB (shared)
MAX TDP
25W
ARCHITECTURE
Westmere
PROCESS
32 nm
LAUNCH DATE
2010
DETAILED SPECIFICATIONS
SPECIFICATION
Sempron 3200+
i7-620LE
Core Specs
Cores
1
2
+100.0%
Threads
1
4
+300.0%
Base Clock (GHz)
1,800
2,000
+11.1%
Boost Clock (GHz)
โ
2.8
Frequency (GHz)
1,800
2,000
+11.1%
Turbo Clock (GHz)
โ
2.8
Multiplier
9
15
+66.7%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
128 KB
64 KB (per core)
L2 Cache
256 KB
256 KB (per core)
L3 Cache
โ
4 MB (shared)
Power
TDP (W)
62
25
-59.7%
Architecture
Architecture
K8
Westmere
Codename
Palermo
Arrandale
Generation
Sempron
(Palermo)
Core i7
(Arrandale)
Process Size
90 nm
32 nm
Transistors
63 million
382 million
Die Size
84 mmยฒ
81 mmยฒ
Foundry
โ
Intel
Memory
Memory Support
DDR1
DDR3
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
6400 MB/s
17.1 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket 939
Intel BGA 1288
Chipsets
NVIDIA nForce 3, nForce 4, ATi Xpress 200, Xpress 200P, Xpress 1100, Xpress 1150, ULi M1689, M1695, M1697, VIA K8N890, K8M890, K8T800, K8T800 Pro, K8T890, K8T900
PM55, HM55, QM57, HM57
PCIe
โ
Gen 2
Graphics
Integrated Graphics
On certain motherboards (Chipset feature)
HD Graphics (Ironlake)
Other
Market
Desktop
Mobile
Production Status
End-of-life
End-of-life
Launch Price
โ
$300
Part Number
SDA3200DIO3BPSDA3200DIO3BW
SLBP9SLBXHQ4ND
Package
ยตPGA
mFCBGA10
Tj Max
โ
105ยฐC