AMD

AMD Sempron 3200+

AMD processor specifications and benchmark scores

1
Cores
1
Threads
โ€”
GHz Boost
62W
TDP
๐Ÿ–ฅ๏ธIntegrated GPU

AMD Sempron 3200+ Specifications

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Sempron 3200+ Core Configuration

Processing cores and threading

The AMD Sempron 3200+ features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1
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Sempron 3200+ Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Sempron 3200+ benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Sempron 3200+ by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1800 GHz
Boost Clock
N/A
Multiplier
9x
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AMD's Sempron 3200+ Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Sempron 3200+ processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Sempron 3200+'s cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB
L2 Cache
256 KB
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K8 Architecture & Process

Manufacturing and design details

The AMD Sempron 3200+ is built on AMD's 90 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Sempron 3200+ incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K8
Codename
Palermo
Process Node
90 nm
Transistors
63 million
Die Size
84 mmยฒ
Generation
Sempron (Palermo)
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K8 Instruction Set Features

Supported CPU instructions and extensions

The Sempron 3200+ by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
AMD64
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Sempron 3200+ Power & Thermal

TDP and power specifications

The AMD Sempron 3200+ has a TDP (Thermal Design Power) of 62W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
62W
๐Ÿ”ง

AMD Socket 939 Platform & Socket

Compatibility information

The Sempron 3200+ uses the AMD Socket 939 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket 939
Chipsets
NVIDIA nForce 3, nForce 4, ATi Xpress 200, Xpress 200P, Xpress 1100, Xpress 1150, ULi M1689, M1695, M1697, VIA K8N890, K8M890, K8T800, K8T800 Pro, K8T890, K8T900
Package
ยตPGA
DDR5

AMD Socket 939 Memory Support

RAM compatibility and speeds

Memory support specifications for the Sempron 3200+ define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Sempron 3200+ determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR1
Memory Bus
Dual-channel
Memory Bandwidth
6400 MB/s
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AMD's Sempron 3200+ Integrated Graphics

Built-in GPU specifications

The AMD Sempron 3200+ includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Sempron 3200+ provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)
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Sempron 3200+ Product Information

Release and pricing details

The AMD Sempron 3200+ is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Sempron 3200+ by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Oct 2005
Market
Desktop
Status
End-of-life
Part Number
SDA3200DIO3BPSDA3200DIO3BW

Sempron 3200+ Benchmark Scores

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No benchmark data available for this CPU.

About AMD Sempron 3200+

The AMD Sempron 3200+ is a single-core, single-thread processor built on the 90 nm Palermo core. This core and thread configuration was standard for entry-level computing during its era, targeting users with basic productivity needs rather than multi-tasking workloads. With only one execution path available, the processor handles instructions sequentially, which can lead to bottlenecks when multiple applications are run concurrently. This architecture means that its performance is entirely dependent on the efficiency of its single core and the speed of its cache subsystem. For its time, this design was a cost-effective solution for building affordable desktop systems. The Sempron 3200+ was positioned as a value-oriented option for everyday computing tasks.

Operating at a base clock speed of 1.8 GHz, the AMD Sempron 3200+ processor utilizes a performance rating system where the "3200+" signifies its intended equivalence to a higher-clocked competitor. The actual frequency of 1.8 GHz was modest even for 2005, relying on the AMD64 architecture's efficiency to deliver adequate performance for its market segment. This clock speed was fixed, as the chip lacked any turbo or dynamic frequency scaling technology, meaning it operated at the same speed under all conditions. The performance was heavily influenced by the system's memory speed, especially given its integrated memory controller on the Socket 939 platform. While not a speed demon, this frequency was sufficient for the light applications it was designed to run.

The thermal design power of 62 watts for the Sempron 3200+ Palermo reflects the power consumption characteristics of the 90 nm process technology. This TDP rating indicated the heat output that the system's cooling solution needed to dissipate, allowing for relatively simple and inexpensive coolers. A 62W TDP was manageable for the small form factor and budget-oriented cases that were common hosts for this CPU. The thermal envelope also contributed to the overall energy efficiency of systems built around this processor, keeping operational costs low. While not as power-frugal as some modern chips, it was a reasonable figure for a desktop processor of its generation.

In terms of cache memory, the AMD Sempron 3200+ featured 128 KB of L1 cache and 128 KB of L2 cache, with no L3 cache present. This limited cache size was a defining characteristic of the value segment, differentiating it from more expensive Athlon 64 models which had larger L2 caches. The small cache amounts meant the processor had to access the system RAM more frequently, which could impact performance in memory-sensitive applications. This made the chip best suited for light-duty applications such as web browsing, office productivity suites, and media playback for the mid-2000s. It was not intended for demanding tasks like video encoding, high-end gaming, or serious multitasking. The AMD AMD Sempron 3200+ found its niche as a reliable engine for basic home and office computers.

The Intel Equivalent of Sempron 3200+

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel โ€ข 4 Cores

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