CPU Comparison

A

AMD

AMD

AMD Sempron 3200+ EE SFF

CORE STATE Manila

CORE SPECS 1 Cores / 1 Threads

CLOCK SPEED 1800 Base

CACHE —

MAX TDP 35W

ARCHITECTURE K8

nm

PROCESS 90 nm

LAUNCH DATE 2006

VS

i

Intel

INTEL

Core i7-620LM

CORE STATE Arrandale

CORE SPECS 2 Cores / 4 Threads

CLOCK SPEED 2000 Base / 2.8 GHz Turbo

CACHE 4 MB (shared)

MAX TDP 25W

ARCHITECTURE Westmere

nm

PROCESS 32 nm

LAUNCH DATE 2010

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

N/A

120

cinebench_cinebench_r20_multicore

N/A

501

cinebench_cinebench_r20_singlecore

N/A

70

cinebench_cinebench_r23_multicore

N/A

1,195

cinebench_cinebench_r23_singlecore

N/A

168

geekbench_multicore

N/A

636

geekbench_singlecore

N/A

379

DETAILED SPECIFICATIONS

SPECIFICATION

Sempron 3200+ EE SFF

i7-620LM

Core Specs

Cores

1

2 +100.0%

Threads

1

4 +300.0%

Base Clock (GHz)

1,800

2,000 +11.1%

Boost Clock (GHz)

—

2.8

Frequency (GHz)

1,800

2,000 +11.1%

Turbo Clock (GHz)

—

2.8

Multiplier

9

15 +66.7%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

128 KB

64 KB (per core)

L2 Cache

128 KB

256 KB (per core)

L3 Cache

—

4 MB (shared)

Power

TDP (W)

35

25 -28.6%

Architecture

Architecture

K8

Westmere

Codename

Manila

Arrandale

Generation

Sempron (Manilla)

Core i7 (Arrandale)

Process Size

90 nm

32 nm

Transistors

81 million

382 million

Die Size

103 mm²

81 mm²

Foundry

—

Intel

Memory

Memory Support

—

DDR3

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

—

17.1 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM2

Intel BGA 1288

Chipsets

—

PM55, HM55, QM57, HM57

PCIe

Gen 2

Gen 2

Graphics

Integrated Graphics

On certain motherboards (Chipset feature)

HD Graphics (Ironlake)

Other

Market

Desktop

Mobile

Production Status

End-of-life

End-of-life

Launch Price

—

$300

Part Number

SDD3200IAA2CN

SLBMLSLBSUQ4B8

Package

µPGA

mFCBGA10

Tj Max

—

105°C

View Sempron 3200+ EE SFF Details View Core i7-620LM Details