AMD

AMD Sempron 3200+ EE SFF

AMD processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
35W
TDP
Integrated GPU

At a Glance

AMD
Cores / Threads 1C / 1T
Base Clock 1800 GHz
TDP 35W
Architecture K8
Socket AMD Socket AM2
nm
Process 90 nm
Released May 2006

AMD Sempron 3200+ EE SFF Specifications

Sempron 3200+ EE SFF Core Configuration

Processing cores and threading

The AMD Sempron 3200+ EE SFF features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1

Sempron 3200+ EE SFF Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Sempron 3200+ EE SFF benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Sempron 3200+ EE SFF by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1800 GHz
Boost Clock
N/A
Multiplier
9x

AMD's Sempron 3200+ EE SFF Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Sempron 3200+ EE SFF processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Sempron 3200+ EE SFF's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB
L2 Cache
128 KB

K8 Architecture & Process

Manufacturing and design details

The AMD Sempron 3200+ EE SFF is built on AMD's 90 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Sempron 3200+ EE SFF incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K8
Codename
Manila
Process Node
90 nm
Transistors
81 million
Die Size
103 mm²
Generation
Sempron (Manilla)

K8 Instruction Set Features

Supported CPU instructions and extensions

The Sempron 3200+ EE SFF by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
AMD64

Sempron 3200+ EE SFF Power & Thermal

TDP and power specifications

The AMD Sempron 3200+ EE SFF has a TDP (Thermal Design Power) of 35W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
35W

AMD Socket AM2 Platform & Socket

Compatibility information

The Sempron 3200+ EE SFF uses the AMD Socket AM2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket AM2
PCIe
Gen 2
Package
µPGA
DDR5

AMD Socket AM2 Memory Support

RAM compatibility and speeds

Memory support specifications for the Sempron 3200+ EE SFF define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Sempron 3200+ EE SFF determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Dual-channel

AMD's Sempron 3200+ EE SFF Integrated Graphics

Built-in GPU specifications

The AMD Sempron 3200+ EE SFF includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Sempron 3200+ EE SFF provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Sempron 3200+ EE SFF Product Information

Release and pricing details

The AMD Sempron 3200+ EE SFF is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Sempron 3200+ EE SFF by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
May 2006
Market
Desktop
Status
End-of-life
Part Number
SDD3200IAA2CN

Sempron 3200+ EE SFF Benchmark Scores

No benchmark data available for this CPU.

About AMD Sempron 3200+ EE SFF

Launched on 2006-05-22, the AMD Sempron 3200+ EE SFF is a single-core desktop processor built on the K8 architecture with the Manila codename. It operates at a fixed 1800.00 MHz base clock with no boost capability, and its 35 W TDP marks it as an energy-efficient part. The data places it at the 50th percentile among all CPUs in the database, with an average benchmark score of 0, indicating a lack of recorded performance metrics.

Who Should Consider It

This processor is built around a single core and a single thread, making it fundamentally a legacy part. For basic office workloads such as word processing, spreadsheet manipulation, and email, the 1800.00 MHz clock and 128 KB L1 and L2 caches provide adequate responsiveness for single-threaded tasks. However, modern gaming and content creation applications rely heavily on multi-threading; with only 1 thread, the Sempron 3200+ EE SFF will be a severe bottleneck. The 50th percentile ranking suggests it sits exactly at the historical midpoint of all CPUs in the database, but given its 2006 release date and end-of-life status, it is not a viable option for current software. The 0 average benchmark score further reinforces that no performance data exists, so any recommendation is based purely on its architectural specifications. This part is best suited for retro computing enthusiasts, basic terminal sessions, or as a low-power controller in small form factor (SFF) systems where the 35 W TDP is a critical asset. The lack of a boost clock means performance is fixed, which can be predictable for deterministic workloads. Its single-threaded nature makes it entirely unsuitable for parallel workloads like video rendering or modern web browsing with many tabs, as those tasks will quickly saturate the lone thread.

Single-Thread vs Multi-Thread Behavior

With exactly 1 core and 1 thread, the Sempron 3200+ EE SFF is exclusively single-threaded. The base clock of 1800.00 MHz is the sole operating frequency, as the boost clock field is null. The cache configuration includes a 128 KB L1 cache and a 128 KB L2 cache, with no L3 cache present. This small cache footprint, combined with the single thread, means that the processor cannot leverage any parallel execution. The data shows an average benchmark score of 0, which implies that no multi-threaded workload has been recorded, and the processor's performance is entirely dependent on its single-thread speed. In real-world terms, applications that are serial in nature—such as legacy database queries, simple command-line tools, or single-threaded scripting—will run at a consistent pace. However, any modern operating system or browser that spawns multiple threads will see significant contention. The K8 architecture, with the Manila codename, is the underlying design, but the lack of ECC memory support (eccMemory: false) limits its use in error-sensitive environments. The dual-channel memory bus is present, but without memory support specifications, the exact memory type remains undefined. The absence of a boost clock means there is no headroom for transient single-thread bursts, so performance is flat across all loads.

Power and Thermals

The thermal design power (TDP) is 35 W, a notably low figure that places this processor in the energy-efficient segment. Fabricated on a 90 nm process node, the die contains 81 million transistors across a 103 mm² area. This combination of a modest transistor count and a large process node results in low heat generation. The 35 W TDP implies that a simple air cooler or a low-profile heatsink is sufficient; no high-end cooling solution is required. The "EE" suffix in the product name indicates an energy-efficient variant, and the "SFF" suffix points to small form factor compatibility. The data does not specify a launch MSRP, so no pricing information is available. The multiplier is locked (multiplierUnlocked: false), meaning the base clock cannot be adjusted for overclocking. For SFF builds, the 35 W TDP is a critical advantage, allowing for compact cases with minimal airflow. The production status is end-of-life, so thermal performance is only relevant for existing units. The 90 nm process is relatively large by modern standards, but the low transistor count of 81 million keeps power draw minimal, which is why the 35 W TDP is achievable. The die size of 103 mm² is compact, further contributing to thermal efficiency.

Platform and Compatibility

This processor is designed for the AMD Socket AM2. The memory bus is dual-channel, though the specific memory support is not listed in the data. The PCIe interface is Gen 2, which allows for modern expansion cards, but the integrated graphics are not on the CPU die—they are a chipset feature that appears on certain motherboards. This means a discrete graphics card is required for any display output unless the motherboard provides an integrated solution. The processor does not support ECC memory (eccMemory: false). The release date is 2006-05-22, and the production status is end-of-life, indicating that no new units are manufactured. The part number is SDD3200IAA2CN. The lack of a launch MSRP means no price data exists. The multiplier is locked, preventing overclocking. The Socket AM2 platform is a legacy socket, so upgrade paths are limited to other AM2 processors, though the data does not specify which ones. The dual-channel memory bus is a feature, but without memory support details, the maximum capacity and speed are unknown. The PCIe Gen 2 support is a notable inclusion for a 2006 part, as it provides compatibility with a wide range of expansion cards, though the single-threaded CPU will likely bottleneck any high-bandwidth device.

How It Compares

The database lists no nearest rivals for the Sempron 3200+ EE SFF, meaning there are no direct comparison scores or deltaPct values available. Consequently, its position is defined solely by the global percentile and average benchmark score. The 50th percentile places it exactly at the median of all CPUs in the database: half of all recorded processors score higher, and half score lower. The average benchmark score of 0 indicates that no performance data has been recorded, which is unusual and likely reflects the processor's age or lack of testing. Without rival data, the processor cannot be compared to any specific competitor. Its single-core, single-thread configuration, combined with a 1800.00 MHz clock and 128 KB caches, places it at the bottom of modern performance hierarchies. However, its 35 W TDP is a distinguishing feature, making it a candidate for low-power or embedded applications. The absence of nearest rivals means that any performance assessment must rely on the raw specifications: 1 core, 1 thread, 1800.00 MHz, and 128 KB L1/L2. The 50th percentile is a neutral ranking, but the 0 score suggests that the processor's real-world performance is undocumented in this database. This lack of comparative data underscores the processor's niche status, where its value is derived from its energy efficiency and legacy compatibility rather than raw compute power.

The Intel Equivalent of Sempron 3200+ EE SFF

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel • 4 Cores

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