CPU Comparison
AMD
AMD Ryzen Embedded R1102G
CORE STATE
Zen
CORE SPECS
2 Cores / 2 Threads
CLOCK SPEED
1200 Base / 2.6 GHz Turbo
CACHE
4 MB (shared)
MAX TDP
6W
ARCHITECTURE
Zen
PROCESS
14 nm
LAUNCH DATE
2020
VS
INTEL
Core i7-10700F
CORE STATE
Comet Lake
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
2.9 Base / 4.8 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
65W
ARCHITECTURE
Comet Lake
PROCESS
14 nm
LAUNCH DATE
2020
PERFORMANCE BENCHMARKS
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
Embedded R1102G
i7-10700F
Core Specs
Cores
2
8
+300.0%
Threads
2
16
+700.0%
Base Clock (GHz)
1,200
2.9
-99.8%
Boost Clock (GHz)
2.6
4.8
+84.6%
Frequency (GHz)
1,200
2.9
-99.8%
Turbo Clock (GHz)
2.6
4.8
+84.6%
Multiplier
12
29
+141.7%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
96 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
4 MB (shared)
16 MB (shared)
Power
TDP (W)
6
65
+983.3%
PL1
—
65 W
PL2
—
224 W
Architecture
Architecture
Zen
Comet Lake
Codename
Zen
Comet Lake
Generation
Ryzen Embedded
(Zen (Banded Kestrel))
Core i7
(Comet Lake)
Process Size
14 nm
14 nm
Transistors
3,500 million
—
Die Size
148 mm²
—
Foundry
GlobalFoundries
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Single-channel
Dual-channel
Memory Bandwidth
19.2 GB/s
46.9 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket FP5
Intel Socket 1200
PCIe
Gen 3, 4 Lanes(CPU only)
Gen 3, 16 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon Vega 3
—
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
YE1102C7T2OFG
SRH70
Package
FC-BGA1140
FC-LGA1200
Tj Max
105°C
100°C