AMD Ryzen Embedded 9950X3D vs Intel Processor 300 Comparison

AMD
AMD

AMD Ryzen Embedded 9950X3D

CORE STATE Granite Ridge
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 4.3 Base / 5.7 GHz Turbo
CACHE 128 MB
MAX TDP 170W
ARCHITECTURE Granite Ridge
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Processor 300

CORE STATE Raptor Lake-S
CORE SPECS 2 Cores / 4 Threads
CLOCK SPEED 3.9 Base
CACHE 6 MB (shared)
MAX TDP 46W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024

Analysis: AMD Ryzen Embedded 9950X3D vs Intel Processor 300

Head-to-Head Benchmarks

The database records no direct benchmark comparisons between the AMD Ryzen Embedded 9950X3D and the Intel Processor 300. Both processors hold a 50th percentile position among all CPUs tracked in our measurements, and neither has an average benchmark score registered. The head-to-head benchmark table is empty, with zero wins recorded for either side. This absence of comparative data means that any performance differential must be inferred from the architectural specifications recorded in the database rather than from direct measurement results.

The AMD Ryzen Embedded 9950X3D carries 16 cores and 32 threads, while the Intel Processor 300 carries 2 cores and 4 threads. That is an 8x core advantage and an 8x thread advantage for the AMD part. The Ryzen chip has a base clock of 4.30 GHz and a boost clock of 5.70 GHz. The Intel part has a base clock of 3.90 GHz and no boost clock listed in the database. The AMD processor therefore holds a 0.40 GHz base-clock advantage and a substantial boost capability that the Intel part lacks entirely.

Memory bandwidth figures also separate the two. The AMD processor records 89.6 GB/s of memory bandwidth, while the Intel processor has no bandwidth figure recorded. Both support dual-channel memory configurations, but the AMD part supports DDR5 exclusively, while the Intel part supports both DDR4 and DDR5. The AMD processor also supports ECC memory, a feature absent from the Intel processor.

The Verdict

From the recorded specifications alone, the AMD Ryzen Embedded 9950X3D is the dominant part in compute capacity. The 16-core, 32-thread configuration with a 5.70 GHz boost clock positions it for heavily threaded workloads. The Intel Processor 300, with 2 cores and 4 threads, is suited to light desktop tasks. The database shows no benchmark scores to confirm real-world performance, so the verdict rests on core counts, clock speeds, and feature sets.

The AMD part uses a 4 nm process from TSMC, while the Intel part uses a 10 nm process from Intel. The AMD die size is recorded as 2x 70.6 mm², and the Intel die size is 163 mm². The AMD processor integrates 16,630 million transistors, while the Intel processor has no transistor count recorded. The AMD L3 cache is 128 MB, compared to 6 MB shared L3 on the Intel part. The AMD L2 cache is 1 MB per core, and the Intel L2 cache is 1.25 MB per core. Both use 80 KB L1 per core.

The AMD processor targets the desktop market segment with an active production status and an unlocked multiplier. The Intel processor also targets the desktop segment with active production, but its multiplier is locked. The AMD part has a 170 TDP, while the Intel part has a 46 TDP. The AMD processor uses AMD Socket AM5, and the Intel processor uses Intel Socket 1700. The AMD part has 24 PCIe Gen 5 lanes, while the Intel part has 16 PCIe Gen 5 lanes. The AMD integrated graphics are Radeon Graphics, and the Intel integrated graphics are UHD Graphics 710.

The Intel Processor 300 carries a launch MSRP of $82. The AMD Ryzen Embedded 9950X3D has no launch MSRP recorded in the database.

Architecture Differences

The AMD Ryzen Embedded 9950X3D belongs to the 9000 series and uses the Granite Ridge codename. Its generation is listed as Ryzen Embedded, based on Zen 5 architecture. The Intel Processor 300 uses the Raptor Lake architecture with the Raptor Lake-S codename, and its generation is listed as Intel Processor, based on Raptor Lake.

The process nodes differ significantly. The AMD part is fabricated on a 4 nm process at TSMC. The Intel part is fabricated on a 10 nm process at Intel. The AMD die consists of two chiplets, each measuring 70.6 mm², for a combined die area of roughly 141.2 mm². The Intel die is a single monolithic die measuring 163 mm². The AMD processor integrates 16,630 million transistors; no transistor count is recorded for the Intel processor.

Cache hierarchies diverge in capacity and organization. The AMD L3 cache totals 128 MB, while the Intel L3 cache is 6 MB shared. Per-core L2 is 1 MB on the AMD part and 1.25 MB on the Intel part. Both record 80 KB L1 per core. The AMD L3 cache is 21.3x larger than the Intel L3 cache, which suggests a significant advantage for workloads that repeatedly access large data sets.

Memory support also differs. The AMD part supports DDR5 only, with dual-channel configuration and 89.6 GB/s bandwidth. The Intel part supports both DDR4 and DDR5, also dual-channel, but no bandwidth figure is recorded. ECC memory is supported on the AMD part and not on the Intel part. PCIe connectivity favors the AMD part with 24 Gen 5 lanes versus 16 Gen 5 lanes on the Intel part.

Integrated graphics differ as well. The AMD part uses Radeon Graphics, while the Intel part uses UHD Graphics 710. The AMD part has an unlocked multiplier, allowing overclocking. The Intel part has a locked multiplier. The AMD processor was released on 2025-10-06, and the Intel processor was released on 2024-01-07. The AMD part number is 100-000000719E, and the Intel part number is SRN3J.

FAQ

Q: How many cores and threads does each processor have?

A: The AMD Ryzen Embedded 9950X3D has 16 cores and 32 threads. The Intel Processor 300 has 2 cores and 4 threads.

Q: What are the clock speeds?

A: The AMD part has a base clock of 4.30 GHz and a boost clock of 5.70 GHz. The Intel part has a base clock of 3.90 GHz and no boost clock recorded.

Q: Which processor supports ECC memory?

A: The AMD Ryzen Embedded 9950X3D supports ECC memory. The Intel Processor 300 does not.

Q: What memory types are supported?

A: The AMD part supports DDR5 only. The Intel part supports both DDR4 and DDR5.

Q: What is the TDP of each processor?

A: The AMD part has a TDP of 170. The Intel part has a TDP of 46.

Q: When was each processor released?

A: The AMD Ryzen Embedded 9950X3D was released on 2025-10-06. The Intel Processor 300 was released on 2024-01-07.

Where Each One Wins

The AMD Ryzen Embedded 9950X3D wins on every compute-capacity metric recorded in the database. Its 16 cores and 32 threads provide an 8x advantage over the Intel part in both core count and thread count. The boost clock of 5.70 GHz gives it a frequency headroom that the Intel part cannot match, since no boost clock is listed for the Intel processor. The 128 MB L3 cache is 21.3x larger than the 6 MB L3 on the Intel part, which gives the AMD processor a clear edge in workloads that benefit from large caches, such as database processing, scientific simulations, and content creation.

The AMD part also wins on memory bandwidth, with 89.6 GB/s recorded, while no bandwidth figure exists for the Intel part. ECC memory support on the AMD part makes it suitable for error-sensitive environments, a feature the Intel part lacks. The AMD part has more PCIe lanes (24 vs 16) and supports Gen 5 on both, so it can connect more high-speed devices. The unlocked multiplier on the AMD part allows frequency tuning, while the Intel part is locked.

The AMD processor uses a 4 nm process versus 10 nm on the Intel part, which indicates a denser and more power-efficient transistor implementation. The AMD transistor count of 16,630 million dwarfs the unrecorded Intel count, and the AMD L3 cache capacity is far larger.

The Intel Processor 300 wins on power consumption. Its 46 TDP is 124 lower than the AMD part's 170 TDP. That makes the Intel part suitable for low-power desktop builds where heat and electricity draw are primary concerns. The Intel part also supports both DDR4 and DDR5 memory, giving it flexibility to use older, widely available DDR4 modules, whereas the AMD part requires DDR5. The Intel part has a smaller die at 163 mm² versus the AMD dual-die configuration, which may simplify cooling requirements. The Intel part was released earlier, on 2024-01-07, so it has a longer market presence.

The Intel processor also holds a launch MSRP of $82, which is the only price information recorded in the database. The AMD processor has no launch MSRP listed, so no price comparison is possible from the recorded data.

In summary, the AMD Ryzen Embedded 9950X3D is the choice for multi-threaded, cache-intensive, high-bandwidth workloads where power draw is not the limiting factor. The Intel Processor 300 is the choice for low-power, light-duty desktop tasks where memory flexibility and lower thermal output are priorities. The database records no direct benchmark comparisons, so these conclusions derive entirely from the architectural specifications and feature sets listed above.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded 9950X3D
Processor 300
Core Specs
Cores
16
2 -87.5%
Threads
32
4 -87.5%
Base Clock (GHz)
4.3
3.9 -9.3%
Boost Clock (GHz)
5.7
Frequency (GHz)
4.3
3.9 -9.3%
Turbo Clock (GHz)
5.7
Multiplier
43
39 -9.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
128 MB
6 MB (shared)
Power
TDP (W)
170
46 -72.9%
PL1
46 W
PL2
46 W
PPT
230 W
Architecture
Architecture
Raptor Lake
Codename
Granite Ridge
Raptor Lake-S
Generation
Ryzen Embedded (Zen 5 (Granite Ridge))
Intel Processor (Raptor Lake)
Process Size
4 nm
10 nm
Transistors
16,630 million
Die Size
2x 70.6 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
DDR5 Speed
4800 MT/s
Platform
Socket
AMD Socket AM5
Intel Socket 1700
Chipsets
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620, X600
Intel 600 Series, Intel 700 Series
PCIe
Gen 5, 24 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon Graphics
UHD Graphics 710
Other
Market
Desktop
Desktop
Production Status
Active
Active
Launch Price
$82
Part Number
100-000000719E
SRN3J
Package
FC-LGA1718
FC-LGA16A
Tj Max
95°C
100°C
Bundled Cooler
None
Laminar RM1
View Ryzen Embedded 9950X3D Details View Processor 300 Details