AMD Ryzen Embedded 9950X3D vs Intel Core 3 201TE Comparison

AMD
AMD

AMD Ryzen Embedded 9950X3D

CORE STATE Granite Ridge
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 4.3 Base / 5.7 GHz Turbo
CACHE 128 MB
MAX TDP 170W
ARCHITECTURE Granite Ridge
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Core 3 201TE

CORE STATE Bartlett Lake
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.9 Base / 4.6 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

Analysis: AMD Ryzen Embedded 9950X3D vs Intel Core 3 201TE

Head-to-Head Benchmarks

The recorded data for this comparison contains no direct head-to-head benchmark scores. Both processors have an average benchmark score of 0 and zero recorded wins in the head-to-head table. This makes a numerical performance comparison impossible based on the database entries alone.

What the data does show is a substantial difference in core configuration. The AMD Ryzen Embedded 9950X3D carries 16 cores and 32 threads, while the Intel Core 3 201TE offers 4 cores and 8 threads. That is a 4x difference in core count and a 4x difference in thread count. On paper, the AMD part should dominate heavily in any multi-threaded workload, but no measured benchmark confirms this in the current dataset.

Clock speeds also favor AMD. The Ryzen Embedded 9950X3D has a base clock of 4.30 GHz and a boost clock of 5.70 GHz. The Intel Core 3 201TE has a base clock of 2.90 GHz and a boost clock of 4.60 GHz. The AMD processor boosts 1.10 GHz higher and starts 1.40 GHz higher at base. Single-thread performance would likely favor AMD, but again, no benchmark scores exist to validate this.

The percentile ranking for both processors is identical at 50, placing them in the median position among all CPUs in the database. With no benchmarks recorded, this percentile reflects the absence of data rather than measured performance.

The thermal design power differs significantly. AMD lists a TDP of 170 watts, while Intel lists 45 watts. This 125-watt gap indicates AMD targets high-performance desktop workloads, whereas Intel designs for lower power consumption, likely in embedded or compact systems.

Memory bandwidth figures show AMD at 89.6 GB/s and Intel at 76.8 GB/s. The AMD part offers 12.8 GB/s more theoretical bandwidth. Both use dual-channel memory buses, but AMD supports only DDR5 while Intel supports both DDR4 and DDR5.

PCIe lane counts differ as well. AMD provides Gen 5 with 24 lanes (CPU only), while Intel provides Gen 5 with 16 lanes (CPU only). AMD has 8 additional CPU-attached PCIe lanes.

The Verdict

The database contains no benchmark results for either processor, so a performance verdict cannot be derived from measurements. The data only provides specification-level differences.

Based on core count, thread count, clock speeds, and memory bandwidth, the AMD Ryzen Embedded 9950X3D appears positioned for demanding multi-threaded and high-clock workloads. The Intel Core 3 201TE appears positioned for lower-power, space-constrained applications where its 45-watt TDP and smaller core count suffice.

Users requiring maximum parallel processing from the recorded specifications should select the AMD part. Users prioritizing lower power draw and a smaller physical footprint should select the Intel part. The launch MSRP for the Intel Core 3 201TE is $134, stated once here as the only price-related fact available.

The Intel processor uses Intel Socket 1700, while AMD uses AMD Socket AM5. These platforms are not interchangeable, so motherboard compatibility will dictate the practical choice. The AMD part also has an unlocked multiplier, enabling overclocking, while the Intel part has a locked multiplier.

Architecture Differences

The AMD Ryzen Embedded 9950X3D belongs to the 9000 series and uses the Granite Ridge codename. Its generation is listed as Ryzen Embedded (Zen 5 (Granite Ridge)). The manufacturing process is 4 nm at TSMC. The die consists of 2x 70.6 mm² chiplets, totaling 16,630 million transistors.

The Intel Core 3 201TE uses the Bartlett Lake codename. Its generation is listed as Core 3 (Bartlett Lake). The manufacturing process is 10 nm at Intel. The die size is 163 mm², with no transistor count recorded in the database.

Cache structures differ markedly. Both parts have 80 KB of L1 cache per core. The L2 cache is 1 MB per core on AMD and 1.25 MB per core on Intel. The L3 cache is the largest differentiator: AMD provides 128 MB total L3, while Intel provides 12 MB shared L3. That is a 116 MB difference in favor of AMD. The AMD part uses 3D V-Cache technology, though the specific vCache3d field is null in the database.

The process node gap is substantial: 4 nm versus 10 nm. The smaller node typically enables higher transistor density and better power efficiency per transistor, though the AMD part's higher TDP indicates it uses this efficiency for raw performance rather than power savings.

Integrated graphics differ. AMD includes Radeon Graphics, while Intel includes UHD Graphics 730. Neither has detailed specifications in the database beyond the name.

Specification Differences

The following fields differ between the two processors:

  • Cores: AMD 16, Intel 4
  • Threads: AMD 32, Intel 8
  • Base clock: AMD 4.30 GHz, Intel 2.90 GHz
  • Boost clock: AMD 5.70 GHz, Intel 4.60 GHz
  • TDP: AMD 170 W, Intel 45 W
  • Socket: AMD Socket AM5, Intel Socket 1700
  • Codename: Granite Ridge, Bartlett Lake
  • Process node: 4 nm, 10 nm
  • Foundry: TSMC, Intel
  • Die size: 2x 70.6 mm², 163 mm²
  • Transistors: 16,630 million, not recorded
  • L2 cache: 1 MB per core, 1.25 MB per core
  • L3 cache: 128 MB, 12 MB shared
  • Memory support: DDR5 only, DDR4 and DDR5
  • Memory bandwidth: 89.6 GB/s, 76.8 GB/s
  • PCIe lanes: 24, 16
  • Integrated graphics: Radeon Graphics, UHD Graphics 730
  • Release date: 2025-10-06, 2025-01-12
  • Launch MSRP: not recorded, $134
  • Multiplier unlocked: true, false
  • Part number: 100-000000719E, SRPKDQ5CK

Both processors share dual-channel memory buses, ECC memory support, Gen 5 PCIe, 80 KB L1 per core, desktop market segment, active production status, and a 50th percentile ranking.

FAQ

Q: Which processor has more cores?

A: The AMD Ryzen Embedded 9950X3D has 16 cores and 32 threads. The Intel Core 3 201TE has 4 cores and 8 threads.

Q: What is the boost clock difference?

A: The AMD processor boosts to 5.70 GHz, while the Intel processor boosts to 4.60 GHz. The AMD part boosts 1.10 GHz higher.

Q: Which processor supports DDR4 memory?

A: The Intel Core 3 201TE supports both DDR4 and DDR5. The AMD Ryzen Embedded 9950X3D supports DDR5 only.

Q: What is the L3 cache capacity for each?

A: AMD provides 128 MB of L3 cache. Intel provides 12 MB shared L3 cache.

Q: Are both processors overclockable?

A: No. The AMD Ryzen Embedded 9950X3D has an unlocked multiplier. The Intel Core 3 201TE has a locked multiplier.

Q: What are the release dates?

A: The AMD processor was released on 2025-10-06. The Intel processor was released on 2025-01-12.

Where Each One Wins

The AMD Ryzen Embedded 9950X3D wins on raw compute resources. Its 16 cores and 32 threads provide four times the parallel processing capacity of the Intel part. The higher base and boost clocks suggest faster single-thread execution as well. The 128 MB L3 cache, enabled by 3D V-Cache technology, provides a large cache pool for data-intensive workloads. The 89.6 GB/s memory bandwidth exceeds Intel's figure by 12.8 GB/s. The 24 PCIe Gen 5 lanes allow more high-speed device connectivity. The unlocked multiplier permits frequency tuning. The 4 nm process node at TSMC indicates a more modern manufacturing technology.

The Intel Core 3 201TE wins on power efficiency and platform flexibility. Its 45-watt TDP is 125 watts lower than AMD's 170-watt TDP, making it suitable for thermally constrained systems. The dual memory support for DDR4 and DDR5 allows reuse of existing DDR4 modules. The smaller die size of 163 mm² contrasts with AMD's dual-chiplet design. The Intel part also has a launch MSRP of $134, while AMD has no recorded MSRP. The Intel Socket 1700 platform may offer different motherboard options compared to AMD Socket AM5.

Workloads favoring AMD include multi-threaded rendering, compilation, scientific computing, and any task that can utilize 32 threads. The large L3 cache benefits workloads with large working sets that fit within 128 MB. Workloads favoring Intel include single-threaded embedded applications, power-budgeted systems, and environments where DDR4 compatibility is required. The Intel part's lower TDP also simplifies cooling requirements in compact enclosures.

The database records no benchmark wins for either processor, so these conclusions derive entirely from specification differences. Actual performance verification requires benchmark data that is not present in the current dataset.

DETAILED SPECIFICATIONS

SPECIFICATION
Embedded 9950X3D
3 201TE
Core Specs
Cores
16
4 -75.0%
Threads
32
8 -75.0%
Base Clock (GHz)
4.3
2.9 -32.6%
Boost Clock (GHz)
5.7
4.6 -19.3%
Frequency (GHz)
4.3
2.9 -32.6%
Turbo Clock (GHz)
5.7
4.6 -19.3%
Multiplier
43
29 -32.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
128 MB
12 MB (shared)
Power
TDP (W)
170
45 -73.5%
PL1
45 W
PL2
106 W
PPT
230 W
Architecture
Codename
Granite Ridge
Bartlett Lake
Generation
Ryzen Embedded (Zen 5 (Granite Ridge))
Core 3 (Bartlett Lake)
Process Size
4 nm
10 nm
Transistors
16,630 million
Die Size
2x 70.6 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
76.8 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
3200 MT/s
Platform
Socket
AMD Socket AM5
Intel Socket 1700
Chipsets
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620, X600
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 5, 24 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon Graphics
UHD Graphics 730
Other
Market
Desktop
Desktop
Production Status
Active
Active
Launch Price
$134
Part Number
100-000000719E
SRPKDQ5CK
Package
FC-LGA1718
FC-LGA16A
Tj Max
95°C
100°C
Bundled Cooler
None
View Ryzen Embedded 9950X3D Details View Core 3 201TE Details