AMD Ryzen Embedded 8645HS vs Qualcomm Snapdragon X2E-78-100 Comparison

FAQ

Q: What are the core and thread counts for the AMD Ryzen Embedded 8645HS and the Qualcomm Snapdragon X2E-78-100?

A: The AMD Ryzen Embedded 8645HS has 6 cores and 12 threads. The Qualcomm Snapdragon X2E-78-100 has 12 cores and 12 threads.

Q: Which processor uses a more advanced manufacturing process?

A: The Qualcomm Snapdragon X2E-78-100 is built on a 3 nm process, while the AMD Ryzen Embedded 8645HS uses a 4 nm process. Both are fabricated by TSMC.

Q: What is the maximum boost clock of the AMD Ryzen Embedded 8645HS?

A: The AMD Ryzen Embedded 8645HS has a base clock of 4.30 GHz and a boost clock of 5.00 GHz. The Qualcomm Snapdragon X2E-78-100 has a base clock of 4.00 GHz, with no boost clock listed in the database.

Q: How do the cache hierarchies compare between the two processors?

A: The AMD Ryzen Embedded 8645HS has 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Qualcomm Snapdragon X2E-78-100 has 288 KB of L1 cache per core and 16 MB of shared L2 cache, with no L3 cache listed.

Q: Which processor supports ECC memory?

A: The AMD Ryzen Embedded 8645HS supports ECC memory. The Qualcomm Snapdragon X2E-78-100 does not support ECC memory.

Q: What are the memory bandwidth figures for each chip?

A: The AMD Ryzen Embedded 8645HS supports dual-channel DDR5 with a memory bandwidth of 89.6 GB/s. The Qualcomm Snapdragon X2E-78-100 supports dual-channel LPDDR5X with a memory bandwidth of 152.4 GB/s.

The Verdict

The database shows two distinct design philosophies for mobile computing. The AMD Ryzen Embedded 8645HS, a 6-core Zen 4 part from the 8000 series, targets embedded workloads that require high per-core frequency and mature platform features. Its 5.00 GHz boost clock is the highest recorded value among the two, and it remains the only option with ECC memory support, a critical feature for reliability-sensitive embedded applications.

The Qualcomm Snapdragon X2E-78-100, part of the Snapdragon X2 (Elite) generation, uses a 12-core configuration with a 3 nm process. It offers a significantly higher memory bandwidth of 152.4 GB/s, a figure that is 70% higher than the AMD part. The Snapdragon also uses a newer PCIe generation, Gen 5, albeit with fewer lanes (12 versus 20 on the AMD side).

For workloads that are sensitive to memory throughput and parallel thread execution, the Snapdragon X2E-78-100 has the structural advantage. For tasks that depend on maximum single-core boost speed, platform longevity via ECC, or PCIe lane count for peripheral expansion, the AMD Ryzen Embedded 8645HS is the more suitable option. The AMD part's 45 W TDP is recorded in the database, while the Snapdragon's TDP is not listed, making direct power comparisons impossible from the available data.

Head-to-Head Benchmarks

No head-to-head benchmark results are recorded in the database for these two processors. Both parts also have no individual benchmark scores and a percentile rank of 50 against all CPUs. The absence of measured performance data means the analysis must rely entirely on architectural and specification differences.

The most significant numerical gap between the two is in memory bandwidth. The Snapdragon X2E-78-100 delivers 152.4 GB/s, which is 70.1% higher than the AMD Ryzen Embedded 8645HS's 89.6 GB/s. This advantage is substantial for memory-bound workloads such as large data processing or integrated graphics operations that share system memory.

In terms of core count, the Snapdragon doubles the AMD part's 6 cores with 12 cores. However, both have 12 threads, meaning the AMD part uses simultaneous multithreading to reach 12 threads from 6 physical cores, while the Snapdragon relies on 12 physical cores without multithreading. The thread count parity suggests that heavily threaded workloads may not see a linear scaling benefit from the Snapdragon's extra cores, but the physical core count could provide better throughput in certain scheduling scenarios.

The clock speed comparison shows the AMD part with a 4.30 GHz base and 5.00 GHz boost, versus the Snapdragon's 4.00 GHz base and no listed boost clock. The AMD processor's 0.30 GHz base clock advantage and its 5.00 GHz boost figure indicate a clear frequency leadership for the AMD chip, which typically translates to stronger single-threaded performance.

The process node difference is also notable. The Snapdragon uses a 3 nm TSMC process, while the AMD part uses a 4 nm TSMC process. The die size difference, 220 mm² for the Snapdragon versus 178 mm² for the AMD, reflects the larger core count and cache allocation of the Qualcomm part.

Specification Differences

The two processors differ across several core specifications. The AMD Ryzen Embedded 8645HS uses 6 cores with 12 threads, while the Qualcomm Snapdragon X2E-78-100 uses 12 cores with 12 threads. The AMD part has a base clock of 4.30 GHz and a boost clock of 5.00 GHz. The Snapdragon has a base clock of 4.00 GHz with no boost clock recorded.

The AMD processor is rated at a 45 W TDP, a figure not listed for the Qualcomm part. The sockets differ as well: AMD uses AMD Socket FP8, while Qualcomm uses Qualcomm BGA 2343. The AMD chip is identified as part of the 8000 series with the Hawk Point codename and Zen 4 architecture. The Qualcomm chip uses the Glymur codename and belongs to the Snapdragon X2 (Elite) generation, with no architecture listed.

Memory support differs in type: DDR5 for AMD versus LPDDR5X for Qualcomm. Both use dual-channel memory buses, but the bandwidth figures diverge significantly at 89.6 GB/s versus 152.4 GB/s. ECC memory support is present on the AMD part but absent on the Qualcomm part.

PCIe capabilities differ by generation and lane count. The AMD Ryzen Embedded 8645HS supports PCIe Gen 4 with 20 lanes, while the Qualcomm Snapdragon X2E-78-100 supports PCIe Gen 5 with 12 lanes. The integrated graphics differ as well: Radeon 760M on the AMD side versus Adreno X2-85 on the Qualcomm side.

The process node shows a size difference: 4 nm for AMD versus 3 nm for Qualcomm, both fabricated by TSMC. Transistor count is listed only for the AMD part at 25,000 million, with no figure available for the Qualcomm chip. The die sizes are 178 mm² for AMD and 220 mm² for Qualcomm.

Release dates place the AMD Ryzen Embedded 8645HS in April 2024 and the Qualcomm Snapdragon X2E-78-100 in April 2026. Both parts are marked as Active in production status and neither has an unlocked multiplier. The part number for the Qualcomm chip is X2E78100, while the AMD part's part number is listed as unknown.

Architecture Differences

The AMD Ryzen Embedded 8645HS is built on the Zen 4 architecture with the Hawk Point codename. The Qualcomm Snapdragon X2E-78-100 uses the Glymur codename, part of the Snapdragon X2 (Elite) generation, with no specific architecture name listed in the database.

The cache structures reflect fundamentally different design approaches. The AMD part uses a traditional per-core hierarchy: 64 KB of L1 per core, 1 MB of L2 per core, and a shared 16 MB L3 cache. The Qualcomm part uses a different organization: 288 KB of L1 per core and a shared 16 MB L2 cache, with no L3 cache listed. The AMD L2 cache totals 6 MB across all 6 cores, while the Qualcomm L2 cache is a single 16 MB shared pool across 12 cores.

The process technology differs by one node generation: TSMC 4 nm for AMD versus TSMC 3 nm for Qualcomm. The die size of the Qualcomm part is larger at 220 mm² compared to 178 mm² for the AMD part, which is consistent with the higher core count and larger L1 cache allocation. The AMD part has a recorded transistor count of 25,000 million, while no transistor count is available for the Qualcomm chip.

Memory architecture differences extend beyond bandwidth. The AMD part supports DDR5 with ECC, while the Qualcomm part uses LPDDR5X without ECC. Both use dual-channel configurations. The PCIe implementation also reflects different generations: AMD provides 20 lanes of Gen 4, while Qualcomm provides 12 lanes of Gen 5. The newer PCIe generation on the Qualcomm side offers higher per-lane bandwidth, but the AMD part offers more total lanes for expansion.

The integrated graphics differ in brand and model: Radeon 760M for AMD and Adreno X2-85 for Qualcomm. Both parts target the mobile market segment and both are currently in active production. The AMD part carries a 45 W TDP rating, while the Qualcomm part has no TDP recorded. The manufacturing foundry is the same for both, TSMC, but the node difference (4 nm versus 3 nm) represents the most advanced process node among the two, belonging to the Qualcomm part.