AMD Ryzen Embedded 8640U vs Qualcomm Snapdragon X2E-78-100 Comparison
AMD Ryzen Embedded 8640U
Snapdragon X2E-78-100
Analysis: AMD Ryzen Embedded 8640U vs Qualcomm Snapdragon X2E-78-100
Head-to-Head Benchmarks
The recorded database contains no benchmark scores, no head-to-head benchmark entries, and no rival comparisons for either the AMD Ryzen Embedded 8640U or the Qualcomm Snapdragon X2E-78-100. Both processors register an average benchmark score of zero, and both hold a percentile rank of 50 against all CPUs in the database. The wins tally for each part is zero. Consequently, no direct performance measurements, no synthetic test results, and no application-level scores exist to compare. The data indicates that both processors are active production parts, but the absence of measured performance means any quantitative comparison must rely entirely on architectural specifications and memory subsystem characteristics.
The AMD Ryzen Embedded 8640U operates with 6 cores and 12 threads, while the Qualcomm Snapdragon X2E-78-100 provides 12 cores and 12 threads. Core counts alone suggest the Qualcomm part has double the physical cores, yet both deliver the same thread count. The AMD processor’s base clock is 3.50 GHz with a boost clock of 4.90 GHz. The Qualcomm processor’s base clock is 4.00 GHz, and no boost clock is recorded. The data shows a higher base frequency on the Snapdragon part, but the AMD part offers a substantial boost ceiling. Without benchmark scores, these clock figures remain the only measurable performance indicators available.
The memory bandwidth figures differ substantially. The AMD Ryzen Embedded 8640U supports DDR5 memory over a dual-channel bus, yielding a recorded bandwidth of 89.6 GB/s. The Qualcomm Snapdragon X2E-78-100 supports LPDDR5X memory over a dual-channel bus, with a recorded bandwidth of 152.4 GB/s. That represents a 70.1% higher memory bandwidth for the Qualcomm part, which can favor data-intensive workloads. The AMD part supports ECC memory, while the Qualcomm part does not. The AMD processor uses PCIe Gen 4 with 20 lanes, whereas the Qualcomm processor uses PCIe Gen 5 with 12 lanes. The PCIe generation advantage belongs to Qualcomm, but the lane count advantage belongs to AMD.
Cache hierarchies also differ. The AMD part has 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Qualcomm part has 288 KB of L1 cache per core and 16 MB of shared L2 cache, with no L3 cache recorded. The per-core L1 cache on the Qualcomm part is 4.5 times larger than on the AMD part. The L2 cache arrangement is not directly comparable because one is per-core and the other is shared. The AMD part’s L3 cache provides an additional cache level that the Qualcomm part lacks.
The Verdict
The data does not support a performance verdict because no benchmark scores exist. The AMD Ryzen Embedded 8640U and the Qualcomm Snapdragon X2E-78-100 both show an average benchmark score of zero and a percentile rank of 50. The wins counter for each processor is zero. Any claim of superiority would require measured results, and the database contains none. The only verdict available from the recorded data is that both processors are active production parts, both target the mobile market segment, and both have a release date in the database. The AMD part was released on 2024-04-01, while the Qualcomm part was released on 2026-04-05. The Qualcomm part is newer by two years, but no performance data exists to determine whether that newer release translates into better measured outcomes.
For users who require ECC memory support, the AMD Ryzen Embedded 8640U is the only choice, as the Qualcomm part does not support ECC. For users who require higher memory bandwidth, the Qualcomm part offers 152.4 GB/s versus 89.6 GB/s. For users who require more PCIe lanes, the AMD part offers 20 Gen 4 lanes versus 12 Gen 5 lanes. For users who require a boost clock, the AMD part provides a recorded boost clock of 4.90 GHz, while the Qualcomm part has no boost clock recorded. For users who require more physical cores, the Qualcomm part provides 12 cores versus 6 cores. These specification differences are the only basis for a verdict, and they point in different directions depending on the requirement.
Where Each One Wins
The AMD Ryzen Embedded 8640U wins in several specification categories. It has a higher boost clock at 4.90 GHz. It supports ECC memory, which the Qualcomm part does not. It offers 20 PCIe Gen 4 lanes, which is more lanes than the Qualcomm part’s 12 PCIe Gen 5 lanes. It includes a shared L3 cache of 16 MB, providing a third cache level. Its process node is 4 nm, while the Qualcomm part uses a 3 nm node, meaning the Qualcomm part has the smaller transistor geometry. The AMD part has a die size of 178 mm², while the Qualcomm part has a die size of 220 mm². The AMD part has a transistor count of 25,000 million, while the Qualcomm part’s transistor count is not recorded. The AMD part has a TDP of 28, while the Qualcomm part’s TDP is not recorded. The AMD part uses an AMD Socket FP8, while the Qualcomm part uses a Qualcomm BGA 2343 socket. The AMD part integrates a Radeon 760M GPU, while the Qualcomm part integrates an Adreno X2-85 GPU.
The Qualcomm Snapdragon X2E-78-100 wins in other specification categories. It has 12 cores, double the AMD part’s 6 cores. It has a higher base clock at 4.00 GHz versus 3.50 GHz. It has a larger per-core L1 cache at 288 KB versus 64 KB. It has a shared L2 cache of 16 MB, while the AMD part has per-core L2 cache of 1 MB per core. It has higher memory bandwidth at 152.4 GB/s versus 89.6 GB/s. It uses LPDDR5X memory, while the AMD part uses DDR5. It uses a 3 nm process node, which is smaller than the AMD part’s 4 nm node. It has a larger die size at 220 mm² versus 178 mm². It has PCIe Gen 5 support, one generation newer than the AMD part’s PCIe Gen 4. Its part number is recorded as X2E78100, while the AMD part’s part number is unknown.
FAQ
Q: Which processor has more cores?
A: The Qualcomm Snapdragon X2E-78-100 has 12 cores, while the AMD Ryzen Embedded 8640U has 6 cores.
Q: Which processor has a higher boost clock?
A: The AMD Ryzen Embedded 8640U has a boost clock of 4.90 GHz. The Qualcomm Snapdragon X2E-78-100 has no boost clock recorded in the database.
Q: Do both processors support ECC memory?
A: No. The AMD Ryzen Embedded 8640U supports ECC memory. The Qualcomm Snapdragon X2E-78-100 does not support ECC memory.
Q: Which processor has higher memory bandwidth?
A: The Qualcomm Snapdragon X2E-78-100 has a memory bandwidth of 152.4 GB/s. The AMD Ryzen Embedded 8640U has a memory bandwidth of 89.6 GB/s.
Q: What process nodes do the two processors use?
A: The AMD Ryzen Embedded 8640U uses a 4 nm process node. The Qualcomm Snapdragon X2E-78-100 uses a 3 nm process node. Both are fabricated by TSMC.
Q: Which processor has a larger die size?
A: The Qualcomm Snapdragon X2E-78-100 has a die size of 220 mm². The AMD Ryzen Embedded 8640U has a die size of 178 mm².
Q: Which processor has a shared L3 cache?
A: The AMD Ryzen Embedded 8640U has a 16 MB shared L3 cache. The Qualcomm Snapdragon X2E-78-100 has no L3 cache recorded.
Q: What PCIe generations do the two processors support?
A: The AMD Ryzen Embedded 8640U supports PCIe Gen 4 with 20 lanes. The Qualcomm Snapdragon X2E-78-100 supports PCIe Gen 5 with 12 lanes.
Architecture Differences
The AMD Ryzen Embedded 8640U belongs to the 8000 series and uses the Zen 4 architecture with the codename Hawk Point. Its generation is listed as Ryzen Embedded (Zen 4 (Hawk Point)). The Qualcomm Snapdragon X2E-78-100 has no architecture field recorded, but its codename is Glymur, and its generation is listed as Snapdragon X2 (Elite). The AMD part uses a 4 nm process node at TSMC, while the Qualcomm part uses a 3 nm process node, also at TSMC. The AMD part has a transistor count of 25,000 million and a die size of 178 mm². The Qualcomm part has no transistor count recorded and a die size of 220 mm².
Cache architecture differs significantly. The AMD part uses 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Qualcomm part uses 288 KB of L1 cache per core and 16 MB of shared L2 cache, with no L3 cache. The L1 cache organization is per-core on both parts, but the Qualcomm part’s per-core L1 is substantially larger. The L2 cache organization differs: AMD uses per-core L2, while Qualcomm uses a shared L2 pool. The presence of L3 cache on the AMD part provides an additional cache layer that the Qualcomm part does not have.
Memory architecture differs as well. The AMD part supports DDR5 memory, while the Qualcomm part supports LPDDR5X. Both use dual-channel memory buses. The memory bandwidth is 89.6 GB/s for the AMD part and 152.4 GB/s for the Qualcomm part. ECC memory support is present on the AMD part and absent on the Qualcomm part. PCIe architecture shows the AMD part with Gen 4 and 20 lanes, while the Qualcomm part has Gen 5 and 12 lanes. The integrated graphics differ: the AMD part uses a Radeon 760M, and the Qualcomm part uses an Adreno X2-85.
Specification Differences
The recorded specification differences between the two processors are as follows. Core count: 6 for AMD, 12 for Qualcomm. Thread count: 12 for both. Base clock: 3.50 GHz for AMD, 4.00 GHz for Qualcomm. Boost clock: 4.90 GHz for AMD, not recorded for Qualcomm. TDP: 28 for AMD, not recorded for Qualcomm. Socket: AMD Socket FP8 for AMD, Qualcomm BGA 2343 for Qualcomm. Process node: 4 nm for AMD, 3 nm for Qualcomm. Die size: 178 mm² for AMD, 220 mm² for Qualcomm. Transistors: 25,000 million for AMD, not recorded for Qualcomm. L1 cache: 64 KB per core for AMD, 288 KB per core for Qualcomm. L2 cache: 1 MB per core for AMD, 16 MB shared for Qualcomm. L3 cache: 16 MB shared for AMD, not recorded for Qualcomm. Memory support: DDR5 for AMD, LPDDR5X for Qualcomm. Memory bus: dual-channel for both. Memory bandwidth: 89.6 GB/s for AMD, 152.4 GB/s for Qualcomm. ECC memory: true for AMD, false for Qualcomm. PCIe: Gen 4 with 20 lanes for AMD, Gen 5 with 12 lanes for Qualcomm. Integrated graphics: Radeon 760M for AMD, Adreno X2-85 for Qualcomm. Market segment: mobile for both. Production status: active for both. Release date: 2024-04-01 for AMD, 2026-04-05 for Qualcomm. Multiplier unlocked: false for both. Part number: unknown for AMD, X2E78100 for Qualcomm. The AMD part’s series is 8000 series, while the Qualcomm part’s series is not recorded. The AMD part’s manufacturer is AMD, while the Qualcomm part’s manufacturer is recorded as unknown. The AMD part’s architecture is Zen 4, while the Qualcomm part’s architecture is not recorded. The AMD part’s codename is Hawk Point, while the Qualcomm part’s codename is Glymur. The AMD part’s generation is Ryzen Embedded (Zen 4 (Hawk Point)), while the Qualcomm part’s generation is Snapdragon X2 (Elite). Both parts have a percentile rank of 50 and an average benchmark score of zero, with no nearest rivals recorded and no head-to-head benchmark entries.