CPU Comparison

A

AMD

AMD

AMD Ryzen 3 7335U

CORE STATE Rembrandt-R

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3 Base / 4.3 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 28W

ARCHITECTURE Zen 3+

nm

PROCESS 6 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI Max+ PRO 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,078

4,456

cinebench_cinebench_r15_singlecore

152

629

cinebench_cinebench_r20_multicore

4,495

18,569

cinebench_cinebench_r20_singlecore

634

2,621

cinebench_cinebench_r23_multicore

10,703

44,213

cinebench_cinebench_r23_singlecore

1,511

6,241

passmark_data_compression

146,309

641,407

passmark_data_encryption

9,335

33,060

passmark_extended_instructions

10,314

52,214

passmark_find_prime_numbers

36

285

passmark_floating_point_math

24,298

120,557

passmark_integer_math

42,493

191,369

passmark_multithread

12,592

52,005

passmark_physics

647

3,311

passmark_random_string_sorting

15,361

71,439

passmark_single_thread

3,053

4,132

passmark_singlethread

3,053

4,132

DETAILED SPECIFICATIONS

SPECIFICATION

3 7335U

AI Max+ PRO 395

Core Specs

Cores

4

16 +300.0%

Threads

8

32 +300.0%

Base Clock (GHz)

3

3 0.0%

Boost Clock (GHz)

4.3

5.1 +18.6%

Frequency (GHz)

3

3 0.0%

Turbo Clock (GHz)

4.3

5.1 +18.6%

Multiplier

30

30 0.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

8 MB (shared)

64 MB (shared)

Power

TDP (W)

28

55 +96.4%

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen 3+

Zen 5

Codename

Rembrandt-R

Strix Halo

Generation

Ryzen 3 (Zen 3+ (Rembrandt))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

6 nm

4 nm

Die Size

208 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

76.8 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FP7

AMD Socket FP11

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

Radeon 660M

Radeon 8060S

Other

Market

Mobile

Mobile

Production Status

Active

Active

Part Number

100-000000537(FP7)100-000000549(FP7r2)

100-000001243

Package

FP7, FP7r2

FC-BGA

Tj Max

95°C

100°C

View Ryzen 3 7335U Details View Ryzen AI Max+ PRO 395 Details