CPU Comparison

A

AMD

AMD

AMD EPYC 7343

CORE STATE Milan

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3.2 Base / 3.9 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 190W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2021

VS

A

AMD

AMD

Ryzen AI Max+ PRO 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

3,739

4,456

cinebench_cinebench_r15_singlecore

527

629

cinebench_cinebench_r20_multicore

15,580

18,569

cinebench_cinebench_r20_singlecore

2,199

2,621

cinebench_cinebench_r23_multicore

37,097

44,213

cinebench_cinebench_r23_singlecore

5,237

6,241

passmark_data_compression

589,770

641,407

passmark_data_encryption

37,454

33,060

passmark_extended_instructions

35,626

52,214

passmark_find_prime_numbers

382

285

passmark_floating_point_math

86,311

120,557

passmark_integer_math

156,033

191,369

passmark_multithread

43,644

52,005

passmark_physics

4,774

3,311

passmark_random_string_sorting

67,576

71,439

passmark_single_thread

2,740

4,132

passmark_singlethread

2,740

4,132

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 7343

AI Max+ PRO 395

Core Specs

Cores

16

16 0.0%

Threads

32

32 0.0%

Base Clock (GHz)

3.2

3 -6.3%

Boost Clock (GHz)

3.9

5.1 +30.8%

Frequency (GHz)

3.2

3 -6.3%

Turbo Clock (GHz)

3.9

5.1 +30.8%

Multiplier

32

30 -6.3%

SMP CPUs

2

1 -50.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

128 MB (shared)

64 MB (shared)

Power

TDP (W)

190

55 -71.1%

Configurable TDP

165-200 W

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Milan

Strix Halo

Generation

EPYC (Zen 3 (Milan))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

16,600 million

—

Die Size

4x 81 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Eight-channel

Quad-channel

Memory Bandwidth

204.8 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP3

AMD Socket FP11

PCIe

Gen 4, 128 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

CCDs

4

—

Cores per CCD

4

—

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$1565

—

Part Number

100-000000338100-100000338WOF

100-000001243

Package

FCLGA-4094

FC-BGA

Tj Max

—

100°C

View EPYC 7343 Details View Ryzen AI Max+ PRO 395 Details