CPU Comparison

A

AMD

AMD

AMD EPYC 7313

CORE STATE Milan

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 3.7 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 155W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2021

VS

A

AMD

AMD

Ryzen AI Max+ PRO 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

3,310

4,456

cinebench_cinebench_r15_singlecore

467

629

cinebench_cinebench_r20_multicore

13,795

18,569

cinebench_cinebench_r20_singlecore

1,947

2,621

cinebench_cinebench_r23_multicore

32,847

44,213

cinebench_cinebench_r23_singlecore

4,637

6,241

passmark_data_compression

525,507

641,407

passmark_data_encryption

31,881

33,060

passmark_extended_instructions

33,430

52,214

passmark_find_prime_numbers

310

285

passmark_floating_point_math

78,748

120,557

passmark_integer_math

143,648

191,369

passmark_multithread

38,644

52,005

passmark_physics

3,899

3,311

passmark_random_string_sorting

57,910

71,439

passmark_single_thread

2,402

4,132

passmark_singlethread

2,402

4,132

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 7313

AI Max+ PRO 395

Core Specs

Cores

16

16 0.0%

Threads

32

32 0.0%

Base Clock (GHz)

3

3 0.0%

Boost Clock (GHz)

3.7

5.1 +37.8%

Frequency (GHz)

3

3 0.0%

Turbo Clock (GHz)

3.7

5.1 +37.8%

Multiplier

30

30 0.0%

SMP CPUs

2

1 -50.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

128 MB (shared)

64 MB (shared)

Power

TDP (W)

155

55 -64.5%

Configurable TDP

180W

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Milan

Strix Halo

Generation

EPYC (Zen 3 (Milan))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

16,600 million

—

Die Size

4x 81 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Eight-channel

Quad-channel

Memory Bandwidth

204.8 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP3

AMD Socket FP11

PCIe

Gen 4, 128 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

CCDs

4

—

Cores per CCD

4

—

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$1083

—

Part Number

100-000000329100-100000329WOF

100-000001243

Package

FCLGA-4094

FC-BGA

Tj Max

—

100°C

View EPYC 7313 Details View Ryzen AI Max+ PRO 395 Details