CPU Comparison

A

AMD

AMD

AMD Ryzen 9 5900XT

CORE STATE Vermeer

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3.3 Base / 4.8 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2024

VS

A

AMD

AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

3dmark_16_threads

10,624

N/A

3dmark_2_threads

1,853

N/A

3dmark_4_threads

3,589

N/A

3dmark_8_threads

6,607

N/A

3dmark_max_threads

11,040

N/A

3dmark_single_thread

942

N/A

cinebench_cinebench_r15_multicore

3,767

4,558

cinebench_cinebench_r15_singlecore

531

643

cinebench_cinebench_r20_multicore

15,696

18,995

cinebench_cinebench_r20_singlecore

2,215

2,681

cinebench_cinebench_r23_multicore

37,373

45,228

cinebench_cinebench_r23_singlecore

5,276

6,385

passmark_data_compression

598,692

656,891

passmark_data_encryption

37,829

34,086

passmark_extended_instructions

39,125

52,958

passmark_find_prime_numbers

209

298

passmark_floating_point_math

99,357

123,833

passmark_integer_math

177,389

195,223

passmark_multithread

43,965

53,137

passmark_physics

1,735

3,448

passmark_random_string_sorting

62,261

72,894

passmark_single_thread

3,455

4,123

passmark_singlethread

3,455

4,123

DETAILED SPECIFICATIONS

SPECIFICATION

9 5900XT

AI Max+ 395

Core Specs

Cores

16

16 0.0%

Threads

32

32 0.0%

Base Clock (GHz)

3.3

3 -9.1%

Boost Clock (GHz)

4.8

5.1 +6.2%

Frequency (GHz)

3.3

3 -9.1%

Turbo Clock (GHz)

4.8

5.1 +6.2%

Multiplier

33

30 -9.1%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

64 MB (shared)

Power

TDP (W)

105

55 -47.6%

PPT

142 W

—

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Vermeer

Strix Halo

Generation

Ryzen 9 (Zen 3 (Vermeer))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

8,300 million

—

Die Size

2x 74 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

51.2 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FP11

Chipsets

AMD 400 Series, AMD 500 Series

—

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$349

—

Part Number

100-000001581

100-000001099

Package

µOPGA-1331

FC-BGA

Tj Max

90°C

100°C

Bundled Cooler

None

—

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