CPU Comparison

A

AMD

AMD

AMD Ryzen 7 2700X

CORE STATE Zen

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.7 Base / 4.35 GHz Turbo

CACHE 16 MB (shared)

MAX TDP 105W

ARCHITECTURE Zen

nm

PROCESS 12 nm

LAUNCH DATE 2018

VS

A

AMD

AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,496

4,558

cinebench_cinebench_r15_singlecore

211

643

cinebench_cinebench_r20_multicore

6,235

18,995

cinebench_cinebench_r20_singlecore

880

2,681

cinebench_cinebench_r23_multicore

14,846

45,228

cinebench_cinebench_r23_singlecore

2,096

6,385

geekbench_multicore

6,106

N/A

geekbench_singlecore

1,253

N/A

passmark_data_compression

266,134

656,891

passmark_data_encryption

16,929

34,086

passmark_extended_instructions

10,155

52,958

passmark_find_prime_numbers

41

298

passmark_floating_point_math

32,563

123,833

passmark_integer_math

63,485

195,223

passmark_multithread

17,468

53,137

passmark_physics

792

3,448

passmark_random_string_sorting

30,563

72,894

passmark_single_thread

2,417

4,123

passmark_singlethread

2,417

4,123

DETAILED SPECIFICATIONS

SPECIFICATION

7 2700X

AI Max+ 395

Core Specs

Cores

8

16 +100.0%

Threads

16

32 +100.0%

Base Clock (GHz)

3.7

3 -18.9%

Boost Clock (GHz)

4.35

5.1 +17.2%

Frequency (GHz)

3.7

3 -18.9%

Turbo Clock (GHz)

4.35

5.1 +17.2%

Multiplier

37

30 -18.9%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

96 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

16 MB (shared)

64 MB (shared)

Power

TDP (W)

105

55 -47.6%

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen

Zen 5

Codename

Zen

Strix Halo

Generation

Ryzen 7 (Zen+ (Pinnacle Ridge))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

12 nm

4 nm

Transistors

4,800 million

—

Die Size

213 mm²

2x 70.6 mm²

Foundry

GlobalFoundries

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

46.9 GB/s

256.0 GB/s

ECC Memory

No

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FP11

Chipsets

AMD 300 Series, AMD 400 Series, AMD 500 Series

—

PCIe

Gen 3, 16 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$329

—

Part Number

YD270XBGAFBOXYD270XBGM88AF

100-000001099

Package

µOPGA-1331

FC-BGA

Tj Max

85°C

100°C

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