AMD Ryzen AI 9 HX 475 vs Intel Processor U303L Comparison

AMD
AMD

AMD Ryzen AI 9 HX 475

CORE STATE Gorgon Point
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2 Base / 5.2 GHz Turbo
CACHE 16 MB
MAX TDP 28W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Processor U303L

CORE STATE Raptor Lake-PS
CORE SPECS 5 Cores / 6 Threads
CLOCK SPEED 1.2 Base / 2.6 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 15W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024

Analysis: AMD Ryzen AI 9 HX 475 vs Intel Processor U303L

FAQ

Q: What are the core and thread counts for the AMD Ryzen AI 9 HX 475 and the Intel Processor U303L?

A: The AMD Ryzen AI 9 HX 475 has 12 cores and 24 threads, while the Intel Processor U303L has 5 cores and 6 threads.

Q: Which processor has the higher boost clock speed?

A: The AMD Ryzen AI 9 HX 475 boosts up to 5.20 GHz, significantly higher than the Intel Processor U303L's 2.60 GHz boost.

Q: What is the manufacturing process for each chip?

A: The AMD Ryzen AI 9 HX 475 is built on a 4 nm process at TSMC, while the Intel Processor U303L uses a 10 nm process at Intel.

Q: How much L3 cache does each processor have?

A: The AMD Ryzen AI 9 HX 475 has 16 MB of L3 cache, whereas the Intel Processor U303L has 12 MB of shared L3 cache.

Q: What is the TDP rating for these processors?

A: The AMD Ryzen AI 9 HX 475 has a TDP of 28 watts, and the Intel Processor U303L has a TDP of 15 watts.

Q: What integrated graphics are included?

A: The AMD chip features Radeon 890M graphics, while the Intel chip includes UHD Graphics 96EU.

Architecture Differences

The AMD Ryzen AI 9 HX 475 is built on the Zen 5 architecture, using the Gorgon Point codename, and comes from the Ryzen AI 400 generation which combines Zen 5 and Zen 5c cores. It is manufactured on a 4 nm process at TSMC, with a die size of 233 mm². The processor uses an AMD Socket FP8 and supports DDR5 and LPDDR5X memory in a dual-channel configuration, delivering a memory bandwidth of 89.6 GB/s. The cache layout includes 80 KB of L1 per core, 1 MB of L2 per core, and 16 MB of L3 cache.

The Intel Processor U303L is based on the Raptor Lake architecture with the Raptor Lake-PS codename, from the Intel Processor generation. It is manufactured on a 10 nm process at Intel's own foundry. It uses Intel Socket 1700 and supports both DDR4 and DDR5 memory in dual-channel mode, though the database does not record a memory bandwidth figure for it. Its cache structure provides 80 KB of L1 per core, 1.25 MB of L2 per core, and 12 MB of shared L3 cache.

A key structural difference is the PCIe configuration. The AMD chip provides Gen 4 with 16 lanes from the CPU, while the Intel chip provides Gen 4 with only 8 lanes from the CPU. Both processors have locked multipliers and do not support ECC memory. The AMD part uses a larger L2 allocation per core at 1 MB compared to Intel's 1.25 MB per core, but the AMD processor has a larger total L3 pool at 16 MB versus 12 MB. The process node gap is substantial: 4 nm for AMD versus 10 nm for Intel, which typically influences power efficiency and transistor density. The Intel chip's die size is not recorded in the database.

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark scores for these two processors. Both the AMD Ryzen AI 9 HX 475 and the Intel Processor U303L have empty benchmark arrays in the records, and the head-to-head benchmark section is likewise empty. Consequently, no direct performance deltas, percentile comparisons, or rival scores are available from the recorded data.

Without benchmark measurements, the analysis must rely on the structural specifications to infer relative performance potential. The AMD Ryzen AI 9 HX 475 offers 12 cores and 24 threads, which is more than double the thread count of the Intel Processor U303L's 5 cores and 6 threads. The AMD part also has a much higher boost clock at 5.20 GHz versus 2.60 GHz, and a higher base clock at 2.00 GHz versus 1.20 GHz. These figures suggest that for multi-threaded workloads, the AMD processor would have a significant advantage in parallel throughput, and for single-threaded tasks, the higher boost frequency indicates stronger peak performance.

The Intel Processor U303L does have a higher L2 cache per core at 1.25 MB compared to 1 MB, which can help with certain memory access patterns, but the AMD chip counters with more L3 cache and a wider PCIe interface. The absence of measured scores means that the database cannot assign a win count to either processor; both the winsA and winsB fields are set to zero. The percentileVsAllCpus field for both parts is 50, indicating that neither has a recorded benchmark-based standing relative to the broader CPU population.

Specification Differences

The two processors differ across nearly every major specification field recorded in the database.

Cores and Threads: The AMD Ryzen AI 9 HX 475 has 12 cores and 24 threads. The Intel Processor U303L has 5 cores and 6 threads.

Clock Speeds: The AMD chip has a base clock of 2.00 GHz and a boost clock of 5.20 GHz. The Intel chip has a base clock of 1.20 GHz and a boost clock of 2.60 GHz.

TDP: The AMD processor is rated at 28 watts. The Intel processor is rated at 15 watts.

Socket: The AMD part uses AMD Socket FP8. The Intel part uses Intel Socket 1700.

Process Node and Foundry: The AMD chip is on a 4 nm process at TSMC. The Intel chip is on a 10 nm process at Intel.

Die Size: The AMD chip has a die size of 233 mm². The Intel chip has no recorded die size.

Cache: The AMD L1 is 80 KB per core, L2 is 1 MB per core, and L3 is 16 MB. The Intel L1 is 80 KB per core, L2 is 1.25 MB per core, and L3 is 12 MB shared.

Memory Support: The AMD chip supports DDR5 and LPDDR5X. The Intel chip supports DDR4 and DDR5. Both are dual-channel.

Memory Bandwidth: The AMD chip records 89.6 GB/s. The Intel chip has no recorded memory bandwidth.

PCIe: The AMD chip provides Gen 4 with 16 lanes (CPU only). The Intel chip provides Gen 4 with 8 lanes (CPU only).

Integrated Graphics: The AMD chip uses Radeon 890M. The Intel chip uses UHD Graphics 96EU.

Release Date: The AMD Ryzen AI 9 HX 475 has a release date of 2025-12-31, while the Intel Processor U303L was released on 2024-04-07.

Launch MSRP: The Intel Processor U303L has a launch MSRP of $285. The AMD Ryzen AI 9 HX 475 has no recorded launch MSRP.

Part Number: The AMD part number is 100-000001859. The Intel part number is SRPKEQ5CV.

Market Segment and Production Status: Both are mobile processors with active production status. Both have locked multipliers, and neither supports ECC memory.

Where Each One Wins

Based on the recorded specifications, the AMD Ryzen AI 9 HX 475 appears positioned for workloads that benefit from high core counts and high clock speeds. With 12 cores, 24 threads, and a 5.20 GHz boost, it is suited for heavily parallel tasks such as content creation, video rendering, software compilation, and multi-tasking environments where thread count directly translates into throughput. The larger 16 MB L3 cache and the 89.6 GB/s memory bandwidth support data-intensive applications that need fast access to large working sets. The 16 PCIe Gen 4 lanes also provide more headroom for discrete components that rely on CPU-attached bandwidth.

The Intel Processor U303L, with its 5 cores and 6 threads, is oriented toward lighter workloads where lower power draw is a priority. Its 15-watt TDP is substantially lower than the AMD chip's 28-watt rating, which could make it preferable for fanless or passively cooled designs, or for systems where battery life and thermal output are more important than raw performance. The support for DDR4 memory gives it compatibility with existing memory infrastructure, which can be relevant for certain upgrade paths. The Intel chip's higher L2 cache per core at 1.25 MB might also help in latency-sensitive single-threaded tasks, though its lower boost clock of 2.60 GHz limits peak throughput.

The data does not provide benchmark scores to confirm these inferences. The recorded percentile for both processors is 50, and the average benchmark score is zero for both, so the database does not currently rank either chip above the other in measured performance. The wins fields are both empty, meaning no use-case advantage can be assigned based on actual testing. Therefore, the specification differences suggest the AMD processor is the stronger candidate for performance-oriented mobile systems, while the Intel processor is more aligned with efficiency-focused configurations, but these conclusions rest on architectural data rather than empirical benchmark results.

DETAILED SPECIFICATIONS

SPECIFICATION
AI 9 HX 475
Processor U303L
Core Specs
Cores
12
5 -58.3%
Threads
24
6 -75.0%
Base Clock (GHz)
2
1.2 -40.0%
Boost Clock (GHz)
5.2
2.6 -50.0%
Frequency (GHz)
2
1.2 -40.0%
Turbo Clock (GHz)
5.2
2.6 -50.0%
Multiplier
20
12 -40.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
16 MB
12 MB (shared)
Power
TDP (W)
28
15 -46.4%
PL1
15 W
PL2
55 W
Configurable TDP
15-54 W
Architecture
Architecture
Zen 5
Raptor Lake
Codename
Gorgon Point
Raptor Lake-PS
Generation
Ryzen AI 400 (Zen 5 / Zen 5c)
Intel Processor (Raptor Lake)
Process Size
4 nm
10 nm
Die Size
233 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5, LPDDR5X
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
DDR5 Speed
5200 MT/s
Platform
Socket
AMD Socket FP8
Intel Socket 1700
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 4, 8 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
4 + 8
P-Cores: 1 E-Cores: 4
E-Core Frequency
2000 MHz up to 3.3 GHz
900 MHz up to 2000 MHz
AI/NPU
NPU
Yes / 60 TOPS
Graphics
Integrated Graphics
Radeon 890M
UHD Graphics 96EU
Other
Market
Mobile
Mobile
Production Status
Active
Active
Launch Price
$285
Part Number
100-000001859
SRPKEQ5CV
Package
FP8
FC-LGA16A
Tj Max
100°C
100°C
View Ryzen AI 9 HX 475 Details View Processor U303L Details