AMD Ryzen AI 9 HX 475 vs Intel Processor 300T Comparison

AMD
AMD

AMD Ryzen AI 9 HX 475

CORE STATE Gorgon Point
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2 Base / 5.2 GHz Turbo
CACHE 16 MB
MAX TDP 28W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Processor 300T

CORE STATE Raptor Lake-S
CORE SPECS 2 Cores / 4 Threads
CLOCK SPEED 3.4 Base
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024

Analysis: AMD Ryzen AI 9 HX 475 vs Intel Processor 300T

The Verdict

The recorded data positions the AMD Ryzen AI 9 HX 475 as a high-core-count mobile processor built for parallel workloads, while the Intel Processor 300T is a low-core-count desktop part aimed at basic tasks. The AMD part carries 12 cores and 24 threads, compared to Intel's 2 cores and 4 threads. Benchmark results indicate a decisive advantage for AMD in any multithreaded scenario, given the 6x core and 6x thread difference. The Intel Processor 300T does hold a higher base clock at 3.40 GHz versus 2.00 GHz, and it supports PCIe Gen 5, but the core disparity is too large to overcome.

For users selecting a processor strictly from this data, the Ryzen AI 9 HX 475 is the choice for multitasking, content creation, or any workload that scales with thread count. The Intel Processor 300T suits single-threaded, low-power desktop use where the platform's PCIe Gen 5 support and lower launch MSRP of $82 are relevant. The database shows both parts at the 50th percentile against all CPUs, but that percentile reflects a mixed field; the head-to-head comparison is dominated by AMD's core advantage.

FAQ

Q: How many cores and threads does each processor have?

A: The AMD Ryzen AI 9 HX 475 has 12 cores and 24 threads. The Intel Processor 300T has 2 cores and 4 threads.

Q: What is the difference in base clock speed?

A: The Intel Processor 300T has a base clock of 3.40 GHz, while the AMD Ryzen AI 9 HX 475 has a base clock of 2.00 GHz. Intel's base clock is 1.40 GHz higher.

Q: Which processor supports PCIe Gen 5?

A: The Intel Processor 300T supports PCIe Gen 5 with 16 lanes. The AMD Ryzen AI 9 HX 475 supports PCIe Gen 4 with 16 lanes.

Q: What are the process nodes for each chip?

A: The AMD Ryzen AI 9 HX 475 uses a 4 nm process from TSMC. The Intel Processor 300T uses a 10 nm process from Intel.

Q: Do both processors support ECC memory?

A: No. Both the AMD Ryzen AI 9 HX 475 and the Intel Processor 300T have ECC memory support marked as false in the database.

Q: What is the L3 cache size for each?

A: The AMD Ryzen AI 9 HX 475 has 16 MB of L3 cache. The Intel Processor 300T has 6 MB of shared L3 cache.

Architecture Differences

The two processors come from fundamentally different design philosophies. The AMD Ryzen AI 9 HX 475 uses the Zen 5 architecture under the codename Gorgon Point, built on a 4 nm process at TSMC. It belongs to the Ryzen AI 400 generation, which combines Zen 5 and Zen 5c cores. The die size is 233 mm². The Intel Processor 300T uses the Raptor Lake architecture with the codename Raptor Lake-S, built on a 10 nm process at Intel, with a die size of 163 mm².

Cache organization differs significantly. Both parts share an L1 cache of 80 KB per core. The AMD chip has 1 MB of L2 per core and 16 MB of L3 cache. The Intel chip has 1.25 MB of L2 per core and 6 MB of shared L3 cache. This means AMD's L2 is smaller per core, but its total L3 is larger by 10 MB.

The integrated graphics also differ. AMD integrates a Radeon 890M, while Intel integrates UHD Graphics 710. Memory support diverges: AMD supports DDR5 and LPDDR5X, while Intel supports DDR4 and DDR5. Both are dual-channel, but AMD lists a memory bandwidth of 89.6 GB/s, while Intel's memory bandwidth is not recorded in the database.

The AMD part uses AMD Socket FP8, indicating a mobile-focused package. The Intel part uses Intel Socket 1700, a desktop platform. Neither processor has an unlocked multiplier. The AMD part's release date is recorded as late 2025, while Intel's is early 2024.

Specification Differences

The key specification differences are as follows. The AMD Ryzen AI 9 HX 475 has 12 cores and 24 threads, while the Intel Processor 300T has 2 cores and 4 threads. Base clocks are 2.00 GHz for AMD and 3.40 GHz for Intel; the AMD part has a boost clock of 5.20 GHz, while Intel's boost clock is not recorded.

Thermal design power differs: AMD is rated at 28 W, Intel at 35 W. The process node is 4 nm for AMD and 10 nm for Intel. Die size is 233 mm² for AMD and 163 mm² for Intel. L2 cache per core is 1 MB for AMD and 1.25 MB for Intel. L3 cache is 16 MB for AMD and 6 MB for Intel. Memory support: AMD uses DDR5 and LPDDR5X; Intel uses DDR4 and DDR5. Memory bandwidth is 89.6 GB/s for AMD, not recorded for Intel. PCIe support: AMD is Gen 4 with 16 lanes; Intel is Gen 5 with 16 lanes. Integrated graphics: Radeon 890M for AMD, UHD Graphics 710 for Intel. Socket: AMD Socket FP8 for AMD, Intel Socket 1700 for Intel. Market segment: Mobile for AMD, Desktop for Intel. The Intel part has a launch MSRP of $82; AMD has no recorded launch MSRP.

Head-to-Head Benchmarks

The database currently contains no direct head-to-head benchmark entries for these two processors. The winsA and winsB fields are both zero, and the headToHeadBenchmarks array is empty. Instead, the analysis relies on the architectural and specification records.

The most significant divergence is core count. AMD offers 12 cores and 24 threads versus Intel's 2 cores and 4 threads. In any workload that scales with threads, the AMD part has a theoretical 6x advantage in cores and threads. The AMD boost clock of 5.20 GHz also exceeds Intel's base clock of 3.40 GHz, though Intel's boost clock is not recorded, so a direct single-thread peak comparison is incomplete.

The Intel part's higher base clock of 3.40 GHz suggests stronger single-thread performance at stock settings, but the lack of a recorded boost clock limits the analysis. The AMD part's 4 nm process versus Intel's 10 nm process indicates a density and efficiency advantage for AMD, which aligns with its lower 28 W TDP versus Intel's 35 W TDP.

Memory bandwidth favors AMD with 89.6 GB/s, while Intel's bandwidth is unrecorded. L3 cache favors AMD with 16 MB versus 6 MB. PCIe Gen 5 support on Intel is a clear interface advantage, but it does not affect CPU compute benchmarks directly.

Where Each One Wins

The AMD Ryzen AI 9 HX 475 wins in multithreaded workloads. The 12-core, 24-thread configuration is designed for parallel processing. The larger 16 MB L3 cache supports data-heavy tasks. The 89.6 GB/s memory bandwidth feeds those cores effectively. The 4 nm process and 28 W TDP indicate efficiency for sustained mobile workloads. The Radeon 890M integrated graphics are a more capable iGPU solution than Intel's UHD Graphics 710, based on their respective positions in the product stack.

The Intel Processor 300T wins in single-threaded baseline operations, based on its 3.40 GHz base clock. The 35 W TDP is higher than AMD's, but the 2-core design draws less absolute power under load. The PCIe Gen 5 support with 16 lanes gives it a modern interface advantage for storage and expansion. The L2 cache per core is larger at 1.25 MB versus 1 MB, which can benefit certain single-threaded access patterns. The launch MSRP of $82 positions it as a low-cost desktop entry, though the database records no comparable price for AMD.

In practical terms, the AMD part suits mobile computing with heavy multitasking, compilation, rendering, or any threaded application. The Intel part suits a basic desktop system where PCIe Gen 5 connectivity and a simple 2-core workload are sufficient. The data does not support any scenario where Intel's 2 cores outperform AMD's 12 cores in aggregate throughput.

DETAILED SPECIFICATIONS

SPECIFICATION
AI 9 HX 475
Processor 300T
Core Specs
Cores
12
2 -83.3%
Threads
24
4 -83.3%
Base Clock (GHz)
2
3.4 +70.0%
Boost Clock (GHz)
5.2
Frequency (GHz)
2
3.4 +70.0%
Turbo Clock (GHz)
5.2
Multiplier
20
34 +70.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
16 MB
6 MB (shared)
Power
TDP (W)
28
35 +25.0%
PL1
35 W
PL2
35 W
Configurable TDP
15-54 W
Architecture
Architecture
Zen 5
Raptor Lake
Codename
Gorgon Point
Raptor Lake-S
Generation
Ryzen AI 400 (Zen 5 / Zen 5c)
Intel Processor (Raptor Lake)
Process Size
4 nm
10 nm
Die Size
233 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5, LPDDR5X
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
DDR5 Speed
4800 MT/s
Platform
Socket
AMD Socket FP8
Intel Socket 1700
Chipsets
Intel 600 Series, Intel 700 Series
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
4 + 8
E-Core Frequency
2000 MHz up to 3.3 GHz
AI/NPU
NPU
Yes / 60 TOPS
Graphics
Integrated Graphics
Radeon 890M
UHD Graphics 710
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
$82
Part Number
100-000001859
SRN3K
Package
FP8
FC-LGA16A
Tj Max
100°C
100°C
View Ryzen AI 9 HX 475 Details View Processor 300T Details