AMD Ryzen AI 9 HX 475 vs Intel Processor 300 Comparison
AMD Ryzen AI 9 HX 475
Processor 300
Analysis: AMD Ryzen AI 9 HX 475 vs Intel Processor 300
FAQ
Q: What are the core and thread counts of these two processors?
A: The AMD Ryzen AI 9 HX 475 has 12 cores and 24 threads. The Intel Processor 300 has 2 cores and 4 threads.
Q: Which processor has the higher boost clock?
A: The AMD Ryzen AI 9 HX 475 boosts to 5.20 GHz. The Intel Processor 300 has no boost clock listed, with a base clock of 3.90 GHz.
Q: What process nodes do the two chips use?
A: The AMD Ryzen AI 9 HX 475 is built on a 4 nm node at TSMC. The Intel Processor 300 uses a 10 nm node at Intel.
Q: What integrated graphics do they carry?
A: The AMD chip integrates a Radeon 890M. The Intel chip uses UHD Graphics 710.
Q: What is the TDP of each processor?
A: The AMD Ryzen AI 9 HX 475 has a TDP of 28 watts. The Intel Processor 300 has a TDP of 46 watts.
Q: Which processor supports PCIe Gen 5?
A: The Intel Processor 300 supports PCIe Gen 5 with 16 lanes. The AMD Ryzen AI 9 HX 475 uses PCIe Gen 4 with 16 lanes.
Where Each One Wins
The AMD Ryzen AI 9 HX 475 is positioned for heavily threaded mobile workloads. Its 12 cores and 24 threads dwarf the Intel Processor 300's 2 cores and 4 threads. The AMD part also carries a larger L3 cache of 16 MB versus 6 MB on the Intel. It supports LPDDR5X memory, which the Intel chip does not list, and its Radeon 890M integrated graphics are a far more capable GPU solution than Intel's UHD Graphics 710. The AMD chip is a mobile part on AMD Socket FP8, built for laptops and compact systems.
The Intel Processor 300 wins on single-thread responsiveness in lightly threaded tasks. Its base clock of 3.90 GHz is substantially higher than the AMD chip's 2.00 GHz base. The Intel part uses a 10 nm process, has a smaller die at 163 mm², and supports both DDR4 and DDR5, giving it broader memory compatibility. It also brings PCIe Gen 5 support, which the AMD chip lacks. The Intel Processor 300 is a desktop part on Socket 1700, and its launch MSRP is $82.
Architecture Differences
The AMD Ryzen AI 9 HX 475 uses the Zen 5 architecture under the Gorgon Point codename, part of the Ryzen AI 400 generation that mixes Zen 5 and Zen 5c cores. It is fabricated by TSMC on a 4 nm process with a die size of 233 mm². The Intel Processor 300 uses the older Raptor Lake architecture, specifically Raptor Lake-S, fabricated by Intel on a 10 nm process with a smaller die of 163 mm².
Cache structures differ significantly. Both chips use 80 KB of L1 per core, but the AMD chip has 1 MB of L2 per core while the Intel chip has 1.25 MB per core. The L3 cache is a major split: the AMD processor has 16 MB, while the Intel processor has only 6 MB of shared L3.
Memory architecture also diverges. The AMD chip supports DDR5 and LPDDR5X with dual-channel memory and a recorded bandwidth of 89.6 GB/s. The Intel chip supports DDR4 and DDR5, also dual-channel, but no memory bandwidth figure is recorded. Neither processor supports ECC memory.
PCIe capability differs by generation. The AMD part uses PCIe Gen 4 with 16 CPU lanes. The Intel part uses PCIe Gen 5 with 16 CPU lanes. The AMD chip integrates a Radeon 890M GPU, while the Intel chip integrates UHD Graphics 710.
Specification Differences
The two processors differ on nearly every recorded specification. The AMD Ryzen AI 9 HX 475 has 12 cores and 24 threads, while the Intel Processor 300 has 2 cores and 4 threads. Base clocks are 2.00 GHz for the AMD chip and 3.90 GHz for the Intel chip. The AMD chip boosts to 5.20 GHz, while the Intel chip has no boost clock listed.
TDP is 28 watts for the AMD part and 46 watts for the Intel part. Sockets are completely different: AMD Socket FP8 versus Intel Socket 1700. The AMD chip is a mobile segment part; the Intel chip is a desktop segment part. Process nodes are 4 nm for AMD and 10 nm for Intel. Die sizes are 233 mm² for AMD and 163 mm² for Intel.
L2 cache per core is 1 MB on the AMD chip and 1.25 MB on the Intel chip. L3 cache is 16 MB on the AMD chip and 6 MB on the Intel chip. Memory support overlaps on DDR5, but the AMD chip adds LPDDR5X and the Intel chip adds DDR4. The AMD chip records 89.6 GB/s memory bandwidth; the Intel chip records none.
PCIe generation differs: Gen 4 for AMD, Gen 5 for Intel. Integrated graphics differ: Radeon 890M for AMD, UHD Graphics 710 for Intel. The Intel part has a launch MSRP of $82; the AMD part has no launch MSRP recorded. Both are active production parts, both are multiplier-unlocked false, and both have a percentile versus all CPUs of 50.
Head-to-Head Benchmarks
The recorded benchmark data contains no head-to-head benchmark scores and no average benchmark scores for either processor. Both chips show an average benchmark score of 0, and the wins counter for each is 0. The nearest rivals lists are empty for both parts.
Without measured scores, the available comparison relies on specification deltas. The AMD Ryzen AI 9 HX 475 offers 6 times the cores and 6 times the threads of the Intel Processor 300. Its L3 cache is 10 MB larger, and its memory bandwidth is recorded at 89.6 GB/s where the Intel chip has no recorded figure.
The Intel Processor 300 counters with a base clock that is 1.90 GHz higher than the AMD chip's base clock. It also supports DDR4 memory, which the AMD chip does not list, and it carries PCIe Gen 5 support. Its smaller die size of 163 mm² versus 233 mm² suggests a simpler physical layout.
The absence of benchmark scores means the database cannot confirm actual performance margins. What the data does show is a clear division: the AMD chip is designed for multi-threaded throughput with a high boost clock and large cache, while the Intel chip is a low-core-count desktop part with a high base clock and no boost clock listed. The AMD chip's 12-core, 24-thread configuration, 16 MB L3 cache, and 89.6 GB/s memory bandwidth all point to sustained multi-core workloads. The Intel chip's 3.90 GHz base clock and 2-core, 4-thread layout point to single-thread responsiveness at a fixed frequency.
The Verdict
The AMD Ryzen AI 9 HX 475 is the choice for multi-threaded mobile workloads. Its 12 cores, 24 threads, 16 MB L3 cache, and 89.6 GB/s memory bandwidth give it a structural advantage in parallel tasks. The 5.20 GHz boost clock adds headroom for single-thread bursts, and the 28 watt TDP makes it suitable for power-constrained mobile systems. Its Radeon 890M integrated graphics are the stronger iGPU solution between the two.
The Intel Processor 300 is the choice for simple desktop tasks where a high fixed clock matters. Its 3.90 GHz base clock exceeds the AMD chip's base clock by 1.90 GHz, and its support for both DDR4 and DDR5 gives it flexible memory options. The 46 watt TDP and desktop Socket 1700 fit traditional desktop builds. PCIe Gen 5 support is a feature the AMD chip does not have.
The data shows two processors with minimal overlap. The AMD chip is a 12-core mobile part with a modern 4 nm process and a large cache. The Intel chip is a 2-core desktop part on a 10 nm process with a high base clock and broader memory compatibility. Buyers should match the chip to the workload: the AMD part for threaded mobile performance, the Intel part for a low-core desktop processor with high base frequency.