CPU Comparison

A

AMD

AMD

AMD Ryzen AI 9 HX 370

CORE STATE Strix Point

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 2000 Base / 5.1 GHz Turbo

CACHE 16 MB

MAX TDP 28W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE —

VS

i

Intel

INTEL

Xeon Phi 7210

CORE STATE Knights Landing

CORE SPECS 64 Cores / 256 Threads

CLOCK SPEED 1300 Base / 1500 GHz Turbo

CACHE —

MAX TDP 215W

ARCHITECTURE Knights Landing

nm

PROCESS 14 nm

LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

3dmark_16_threads

9,365

N/A

3dmark_2_threads

2,179

N/A

3dmark_4_threads

3,970

N/A

3dmark_8_threads

6,992

N/A

3dmark_max_threads

9,725

N/A

3dmark_single_thread

1,153

N/A

cinebench_cinebench_r15_multicore

3,010

625

cinebench_cinebench_r15_singlecore

425

88

cinebench_cinebench_r20_multicore

12,545

2,608

cinebench_cinebench_r20_singlecore

1,771

367

cinebench_cinebench_r23_multicore

29,870

6,210

cinebench_cinebench_r23_singlecore

4,217

876

passmark_data_compression

445,719

332,960

passmark_data_encryption

22,252

3,455

passmark_extended_instructions

31,653

18,359

passmark_find_prime_numbers

126

10

passmark_floating_point_math

76,892

29,356

passmark_integer_math

122,933

84,874

passmark_multithread

35,148

7,306

passmark_physics

1,881

198

passmark_random_string_sorting

48,723

8,956

passmark_single_thread

3,973

460

passmark_singlethread

3,973

460

DETAILED SPECIFICATIONS

SPECIFICATION

AI 9 HX 370

Phi 7210

Core Specs

Cores

12

64 +433.3%

Threads

24

256 +966.7%

Base Clock (GHz)

2,000

1,300 -35.0%

Boost Clock (GHz)

5.1

1,500 +29311.8%

Frequency (GHz)

2,000

1,300 -35.0%

Turbo Clock (GHz)

5.1

1,500 +29311.8%

Multiplier

20

13 -35.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

32 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

16 MB

—

Power

TDP (W)

28

215 +667.9%

Configurable TDP

15-54 W

—

Architecture

Architecture

Zen 5

Knights Landing

Codename

Strix Point

Knights Landing

Generation

Ryzen AI (Zen 5)

Xeon Phi (Knights Landing)

Process Size

4 nm

14 nm

Transistors

—

8,000 million

Die Size

233 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR5, LPDDR5X

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

89.6 GB/s

—

ECC Memory

No

Yes

Platform

Socket

AMD Socket FP8

Intel Socket 3647

PCIe

Gen 4, 16 Lanes(CPU only)

—

Intel Hybrid

Hybrid Cores

4 + 8

—

E-Core Frequency

1400 MHz up to 3.3 GHz

—

AI/NPU

NPU

Yes / 50 TOPS

—

Graphics

Integrated Graphics

Radeon 890M

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

—

Part Number

100-000000994

SR2MESR2X4

Package

FP8

FC-LGA3647

Tj Max

100°C

—

View Ryzen AI 9 HX 370 Details View Xeon Phi 7210 Details