CPU Comparison

A

AMD

AMD

AMD EPYC 7203P

CORE STATE Milan

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 2.8 Base / 3.4 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 120W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI 9 HX 370

CORE STATE Strix Point

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 2000 Base / 5.1 GHz Turbo

CACHE 16 MB

MAX TDP 28W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE —

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,886

3,010

cinebench_cinebench_r15_singlecore

266

425

cinebench_cinebench_r20_multicore

7,859

12,545

cinebench_cinebench_r20_singlecore

1,109

1,771

cinebench_cinebench_r23_multicore

18,714

29,870

cinebench_cinebench_r23_singlecore

2,642

4,217

passmark_data_compression

254,215

445,719

passmark_data_encryption

17,434

22,252

passmark_extended_instructions

14,466

31,653

passmark_find_prime_numbers

145

126

passmark_floating_point_math

37,049

76,892

passmark_integer_math

67,083

122,933

passmark_multithread

22,017

35,148

passmark_physics

2,077

1,881

passmark_random_string_sorting

33,873

48,723

passmark_single_thread

2,537

3,973

passmark_singlethread

2,537

3,973

3dmark_16_threads

N/A

9,365

3dmark_2_threads

N/A

2,179

3dmark_4_threads

N/A

3,970

3dmark_8_threads

N/A

6,992

3dmark_max_threads

N/A

9,725

3dmark_single_thread

N/A

1,153

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 7203P

AI 9 HX 370

Core Specs

Cores

8

12 +50.0%

Threads

16

24 +50.0%

Base Clock (GHz)

2.8

2,000 +71328.6%

Boost Clock (GHz)

3.4

5.1 +50.0%

Frequency (GHz)

2.8

2,000 +71328.6%

Turbo Clock (GHz)

3.4

5.1 +50.0%

Multiplier

28

20 -28.6%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

16 MB

Power

TDP (W)

120

28 -76.7%

Configurable TDP

120-150 W

15-54 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Milan

Strix Point

Generation

EPYC (Zen 3 (Milan))

Ryzen AI (Zen 5)

Process Size

7 nm

4 nm

Transistors

8,300 million

—

Die Size

2x 81 mm²

233 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5, LPDDR5X

Memory Bus

Eight-channel

Dual-channel

Memory Bandwidth

204.8 GB/s

89.6 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket SP3

AMD Socket FP8

PCIe

Gen 4, 128 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

4 + 8

E-Core Frequency

—

1400 MHz up to 3.3 GHz

AMD Multi-Die

CCDs

2

—

Cores per CCD

4

—

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 890M

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$348

—

Part Number

100-000001287100-100001287WOF

100-000000994

Package

FCLGA-4094

FP8

Tj Max

—

100°C

View EPYC 7203P Details View Ryzen AI 9 HX 370 Details