AMD Ryzen 9 PRO 8945HS vs AMD Ryzen Embedded 9950X3D Comparison

AMD
AMD

AMD Ryzen 9 PRO 8945HS

CORE STATE Hawk Point
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 4 Base / 5.2 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024
VS
AMD
AMD

Ryzen Embedded 9950X3D

CORE STATE Granite Ridge
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 4.3 Base / 5.7 GHz Turbo
CACHE 128 MB
MAX TDP 170W
ARCHITECTURE Granite Ridge
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,536
N/A
cinebench_cinebench_r15_singlecore
357
N/A
cinebench_cinebench_r20_multicore
10,569
N/A
cinebench_cinebench_r20_singlecore
1,491
N/A
cinebench_cinebench_r23_multicore
25,165
N/A
cinebench_cinebench_r23_singlecore
3,552
N/A
passmark_data_compression
368,884
N/A
passmark_data_encryption
21,820
N/A
passmark_extended_instructions
27,714
N/A
passmark_find_prime_numbers
91
N/A
passmark_floating_point_math
63,490
N/A
passmark_integer_math
103,390
N/A
passmark_multithread
30,378
N/A
passmark_physics
1,430
N/A
passmark_random_string_sorting
44,668
N/A
passmark_single_thread
3,920
N/A
passmark_singlethread
3,920
N/A

Analysis: AMD Ryzen 9 PRO 8945HS vs AMD Ryzen Embedded 9950X3D

# AMD Ryzen 9 PRO 8945HS vs AMD Ryzen Embedded 9950X3D

The AMD Ryzen 9 PRO 8945HS and the AMD Ryzen Embedded 9950X3D occupy different positions in the database. The 8945HS is a mobile processor from the 8000 series, built on Zen 4 with a Hawk Point codename, while the Embedded 9950X3D is a desktop-class embedded chip from the 9000 series, built on Zen 5 with a Granite Ridge codename. The recorded data shows that the 8945HS has a substantial benchmark profile, whereas the Embedded 9950X3D currently has no recorded benchmark scores, an average benchmark score of zero, and a 50th percentile ranking versus all CPUs. The 8945HS, by contrast, holds an 88th percentile ranking and an average benchmark score of 41,963. This asymmetry shapes every comparison below.

Where Each One Wins

The 8945HS wins in every measurable category because it is the only product with benchmark data in the database. It delivers a Cinebench R23 multi-core score of 25,165 and a single-core score of 3,552, which places it solidly above the 50th percentile of all CPUs. Its PassMark multi-thread score of 30,378 and single-thread score of 3,920 further confirm its capability. The Embedded 9950X3D, with no recorded scores, cannot claim a single benchmark win in the current dataset. Its 50th percentile is a placeholder value, not a measured result, so the data offers no evidence of advantage in any workload.

The use-case split is therefore one-sided in the recorded metrics. The 8945HS shows strength in multi-threaded productivity tasks, as indicated by its Cinebench R20 multi-core score of 10,569 and Cinebench R15 multi-core score of 2,536. For single-threaded responsiveness, the R23 single-core score of 3,552 and PassMark single-thread score of 3,920 suggest capable performance. The Embedded 9950X3D, despite having 16 cores, 32 threads, and a 5.70 GHz boost clock, has no measured scores to substantiate any workload advantage in this database. The data implies that the 8945HS is the only chip whose performance can be quantified at present.

FAQ

Q: Which processor has more cores?

A: The AMD Ryzen Embedded 9950X3D has 16 cores and 32 threads, while the AMD Ryzen 9 PRO 8945HS has 8 cores and 16 threads.

Q: What is the boost clock difference between the two?

A: The Embedded 9950X3D boosts to 5.70 GHz, whereas the 8945HS boosts to 5.20 GHz. The base clocks are 4.30 GHz and 4.00 GHz, respectively.

Q: Do both processors support ECC memory?

A: Yes, both the 8945HS and the Embedded 9950X3D support ECC memory, and both use dual-channel DDR5 memory with a bandwidth of 89.6 GB/s.

Q: Which processor has a higher benchmark percentile?

A: The 8945HS holds an 88th percentile ranking among all CPUs, while the Embedded 9950X3D holds a 50th percentile ranking. The 8945HS also has an average benchmark score of 41,963, compared to zero for the Embedded 9950X3D.

Q: What is the process node for each chip?

A: Both processors are manufactured on a 4 nm process by TSMC. The 8945HS has a die size of 178 mm², while the Embedded 9950X3D has a die size of 2x 70.6 mm².

Q: Which chip has more L3 cache?

A: The Embedded 9950X3D has 128 MB of L3 cache, while the 8945HS has 16 MB of shared L3 cache. The 8945HS has 64 KB of L1 cache per core and 1 MB of L2 per core, while the Embedded 9950X3D has 80 KB of L1 per core and 1 MB of L2 per core.

The Verdict

The data dictates a clear verdict: the 8945HS is the only processor with measurable performance, so any user requiring verified benchmark results must choose it. The Embedded 9950X3D, despite its higher core count, higher clocks, and larger cache, has no recorded scores in the database, making its real-world performance indeterminate. The 8945HS delivers a Cinebench R23 multi-core score of 25,165, a PassMark multi-thread score of 30,378, and a PassMark single-thread score of 3,920, all of which place it in the 88th percentile of all CPUs. The Embedded 9950X3D sits at the 50th percentile by default, not by measurement.

For workloads like data compression, the 8945HS shows a PassMark score of 368,884; for encryption, 21,820; for floating-point math, 63,490; and for integer math, 103,390. These are concrete numbers from the database. The Embedded 9950X3D offers no comparable figures. The verdict is not about which chip is theoretically superior, but which one has evidence of performance. The 8945HS has that evidence, the Embedded 9950X3D does not.

Specification Differences

The two processors differ across nearly every major specification. The 8945HS has 8 cores and 16 threads, while the Embedded 9950X3D has 16 cores and 32 threads. Base clocks are 4.00 GHz versus 4.30 GHz, and boost clocks are 5.20 GHz versus 5.70 GHz. Thermal design power differs sharply: the 8945HS draws 45 watts, while the Embedded 9950X3D draws 170 watts. The socket changes from AMD Socket FP7 on the 8945HS to AMD Socket AM5 on the Embedded 9950X3D.

The cache hierarchy diverges. The 8945HS uses 64 KB of L1 per core, 1 MB of L2 per core, and 16 MB of shared L3. The Embedded 9950X3D uses 80 KB of L1 per core, 1 MB of L2 per core, and 128 MB of L3. Transistor counts also differ: the 8945HS integrates 25,000 million transistors on a 178 mm² die, while the Embedded 9950X3D uses 16,630 million transistors across 2x 70.6 mm² dies. PCIe support favors the Embedded chip: Gen 5 with 24 lanes versus Gen 4 with 20 lanes on the 8945HS.

Integrated graphics differ as well. The 8945HS includes a Radeon 780M, while the Embedded 9950X3D includes a generic Radeon Graphics solution. The market segment is mobile for the 8945HS and desktop for the Embedded 9950X3D. The multiplier is unlocked on the Embedded 9950X3D, but locked on the 8945HS. Release dates are also distinct: the 8945HS launched on 2024-04-15, while the Embedded 9950X3D launched on 2025-10-06. The part numbers are "100-000001314(FP7r2),100-000001386(FP7)" for the 8945HS and "100-000000719E" for the Embedded 9950X3D.

Head-to-Head Benchmarks

No head-to-head benchmark data exists in the database. The headToHeadBenchmarks field is empty, and the wins count is zero for both processors. The only comparative numbers available are the average benchmark scores and percentiles. The 8945HS has an average benchmark score of 41,963, while the Embedded 9950X3D has an average benchmark score of zero. The percentile gap is 88 versus 50. These figures suggest that, based on the available data, the 8945HS outperforms the Embedded 9950X3D by a wide margin, but this is a comparison of measured versus unmeasured results.

Looking at the 8945HS's individual scores, the largest margins would likely come from its multi-threaded tests. The Cinebench R23 multi-core score of 25,165 and Cinebench R20 multi-core score of 10,569 are strong indicators of parallel workload performance. The PassMark multi-thread score of 30,378 reinforces this. For single-threaded tasks, the R23 single-core score of 3,552 and the PassMark single-thread score of 3,920 show respectable performance. The Embedded 9950X3D cannot be compared on any of these tests because no scores are recorded.

The nearest rivals for the 8945HS provide additional context. The Intel Core i7-14700T has an average score of 41,914, which is 0.1% behind the 8945HS. The AMD Ryzen 5 7400 scores 42,055, which is 0.2% ahead. The Intel Core i7-12850HX scores 41,779, 0.4% behind, and the Intel Core 7 251TE scores 41,650, 0.8% behind. These deltas are small, indicating that the 8945HS sits in a tightly contested performance band. The Embedded 9950X3D has no rivals listed, further emphasizing the lack of data.

Architecture Differences

The architectural split is generational and structural. The 8945HS uses Zen 4 architecture with the Hawk Point codename, while the Embedded 9950X3D uses Zen 5 with the Granite Ridge codename. Both are built on a 4 nm TSMC process, but the physical implementation differs. The 8945HS uses a single 178 mm² die with 25,000 million transistors. The Embedded 9950X3D uses a dual-die design with 2x 70.6 mm² dies, totaling 16,630 million transistors. The smaller total die area with fewer transistors is notable given the higher core count and larger L3 cache on the Embedded chip.

The cache architecture reflects the X3D branding. The Embedded 9950X3D carries 128 MB of L3 cache, a significant expansion over the 16 MB shared L3 on the 8945HS. Per-core L1 increases from 64 KB to 80 KB, while L2 remains at 1 MB per core. The memory controllers are identical in bandwidth: both support dual-channel DDR5 at 89.6 GB/s, and both support ECC memory. PCIe connectivity advances from Gen 4 with 20 lanes on the 8945HS to Gen 5 with 24 lanes on the Embedded 9950X3D, which is relevant for high-throughput embedded applications.

The integrated graphics differ in naming and likely capability. The 8945HS uses Radeon 780M, a specific mobile GPU solution, while the Embedded 9950X3D uses a more generic Radeon Graphics. The power envelope is a major architectural differentiator: the 8945HS operates at 45 watts, suited for thin-and-light mobile systems, while the Embedded 9950X3D operates at 170 watts, requiring substantial cooling and power delivery. The unlocked multiplier on the Embedded 9950X3D suggests manual overclocking support, whereas the locked multiplier on the 8945HS restricts such adjustments.

The production status is active for both, and both come from AMD. The 8945HS belongs to the 8000 series, while the Embedded 9950X3D belongs to the 9000 series. The socket difference, FP7 versus AM5, means they are not platform-compatible. The release dates place the 8945HS in April 2024 and the Embedded 9950X3D in October 2025, a gap of roughly 18 months. The data does not include any V-Cache specification for the Embedded 9950X3D, despite its X3D designation, so the 128 MB L3 is the only cache advantage recorded. The transistor count difference, 25,000 million versus 16,630 million, is counterintuitive given the core count, but the dual-die design and different cache layout explain the discrepancy.

DETAILED SPECIFICATIONS

SPECIFICATION
9 PRO 8945HS
Embedded 9950X3D
Core Specs
Cores
8
16 +100.0%
Threads
16
32 +100.0%
Base Clock (GHz)
4
4.3 +7.5%
Boost Clock (GHz)
5.2
5.7 +9.6%
Frequency (GHz)
4
4.3 +7.5%
Turbo Clock (GHz)
5.2
5.7 +9.6%
Multiplier
40
43 +7.5%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
16 MB (shared)
128 MB
Power
TDP (W)
45
170 +277.8%
PPT
—
230 W
Configurable TDP
35-54 W
—
Architecture
Architecture
Zen 4
—
Codename
Hawk Point
Granite Ridge
Generation
Ryzen 9 (Zen 4 (Hawk Point))
Ryzen Embedded (Zen 5 (Granite Ridge))
Process Size
4 nm
4 nm
Transistors
25,000 million
16,630 million
Die Size
178 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP7
AMD Socket AM5
Chipsets
—
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620, X600
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
AI/NPU
NPU
Yes / 16 TOPS
—
Graphics
Integrated Graphics
Radeon 780M
Radeon Graphics
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
100-000001314(FP7r2),100-000001386(FP7)
100-000000719E
Package
FP7, FP7r2
FC-LGA1718
Tj Max
100°C
95°C
Bundled Cooler
—
None
View Ryzen 9 PRO 8945HS Details View Ryzen Embedded 9950X3D Details