CPU Comparison

AMD
AMD

AMD Ryzen 9 PRO 5945

CORE STATE Vermeer
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3 Base / 4.7 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2022
VS
AMD
AMD

Ryzen Embedded V2546

CORE STATE Renoir
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 3 Base / 3.95 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 35W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,959
827
cinebench_cinebench_r15_singlecore
417
116
cinebench_cinebench_r20_multicore
12,333
3,446
cinebench_cinebench_r20_singlecore
1,740
486
cinebench_cinebench_r23_multicore
29,366
8,207
cinebench_cinebench_r23_singlecore
4,145
1,158
passmark_data_compression
416,599
136,097
passmark_data_encryption
26,313
8,046
passmark_extended_instructions
27,031
8,799
passmark_find_prime_numbers
228
22
passmark_floating_point_math
70,291
18,534
passmark_integer_math
129,768
30,739
passmark_multithread
34,549
9,656
passmark_physics
1,772
441
passmark_random_string_sorting
43,447
13,926
passmark_single_thread
3,499
1,609
passmark_singlethread
3,499
1,609

DETAILED SPECIFICATIONS

SPECIFICATION
9 PRO 5945
Embedded V2546
Core Specs
Cores
12
6 -50.0%
Threads
24
12 -50.0%
Base Clock (GHz)
3
3 0.0%
Boost Clock (GHz)
4.7
3.95 -16.0%
Frequency (GHz)
3
3 0.0%
Turbo Clock (GHz)
4.7
3.95 -16.0%
Multiplier
30
30 0.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
512 KB (per core)
L3 Cache
64 MB
8 MB (shared)
Power
TDP (W)
65
35 -46.2%
PPT
88 W
—
Configurable TDP
—
54 W
Architecture
Architecture
Zen 3
Zen 2
Codename
Vermeer
Renoir
Generation
Ryzen 9 (Zen 3 (Vermeer))
Ryzen Embedded (Zen 2 (Renoir))
Process Size
7 nm
7 nm
Transistors
8,300 million
9,800 million
Die Size
2x 74 mm²
156 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
51.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM4
AMD Socket FP6
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 3, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
—
Graphics
Integrated Graphics
—
Radeon Graphics 384SP
Other
Market
Desktop
Desktop
Production Status
Active
Active
Part Number
100-000000831
100-000000246
Package
µOPGA-1331
FP6
Tj Max
—
105°C
Bundled Cooler
None
—
View Ryzen 9 PRO 5945 Details View Ryzen Embedded V2546 Details