CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

A

AMD

AMD

Ryzen Embedded V2546

CORE STATE Renoir

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 3 Base / 3.95 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 35W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,922

827

cinebench_cinebench_r15_singlecore

694

116

cinebench_cinebench_r20_multicore

20,510

3,446

cinebench_cinebench_r20_singlecore

2,895

486

cinebench_cinebench_r23_multicore

48,834

8,207

cinebench_cinebench_r23_singlecore

6,894

1,158

passmark_data_compression

753,225

136,097

passmark_data_encryption

38,386

8,046

passmark_extended_instructions

59,765

8,799

passmark_find_prime_numbers

296

22

passmark_floating_point_math

140,152

18,534

passmark_integer_math

218,727

30,739

passmark_multithread

57,640

9,656

passmark_physics

2,792

441

passmark_random_string_sorting

79,529

13,926

passmark_single_thread

4,459

1,609

passmark_singlethread

4,459

1,609

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX

Embedded V2546

Core Specs

Cores

16

6 -62.5%

Threads

32

12 -62.5%

Base Clock (GHz)

2.5

3 +20.0%

Boost Clock (GHz)

5.4

3.95 -26.9%

Frequency (GHz)

2.5

3 +20.0%

Turbo Clock (GHz)

5.4

3.95 -26.9%

Multiplier

25

30 +20.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

64 MB (shared)

8 MB (shared)

Power

TDP (W)

55

35 -36.4%

PPT

74-101 W

—

Configurable TDP

75 W

54 W

Architecture

Architecture

Zen 5

Zen 2

Codename

Fire Range

Renoir

Generation

Ryzen 9 (Zen 5 (Fire Range))

Ryzen Embedded (Zen 2 (Renoir))

Process Size

4 nm

7 nm

Transistors

16,630 million

9,800 million

Die Size

2x 70.6 mm²

156 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

89.6 GB/s

51.2 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FL1

AMD Socket FP6

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 3, 20 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

Radeon Graphics 384SP

Other

Market

Mobile

Desktop

Production Status

Active

Active

Part Number

100-000001028

100-000000246

Package

µFC-BGAFL1

FP6

Tj Max

100°C

105°C

Bundled Cooler

None

—

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