CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900X

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.8 Base / 4.6 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

A

AMD

AMD

Ryzen 9 8940HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.4 Base / 5.3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,788

4,584

cinebench_cinebench_r15_singlecore

393

647

cinebench_cinebench_r20_multicore

11,618

19,104

cinebench_cinebench_r20_singlecore

1,640

2,696

cinebench_cinebench_r23_multicore

27,662

45,488

cinebench_cinebench_r23_singlecore

3,905

6,421

geekbench_multicore

9,924

N/A

geekbench_singlecore

1,708

N/A

passmark_data_compression

448,906

738,673

passmark_data_encryption

28,586

44,430

passmark_extended_instructions

29,221

54,674

passmark_find_prime_numbers

214

272

passmark_floating_point_math

58,434

125,981

passmark_integer_math

99,628

205,945

passmark_multithread

32,544

54,675

passmark_physics

1,794

2,115

passmark_random_string_sorting

48,300

85,869

passmark_single_thread

2,703

4,033

passmark_singlethread

2,703

4,033

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900X

9 8940HX

Core Specs

Cores

12

16 +33.3%

Threads

24

32 +33.3%

Base Clock (GHz)

3.8

2.4 -36.8%

Boost Clock (GHz)

4.6

5.3 +15.2%

Frequency (GHz)

3.8

2.4 -36.8%

Turbo Clock (GHz)

4.6

5.3 +15.2%

Multiplier

38

24 -36.8%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

64 MB (shared)

Power

TDP (W)

105

55 -47.6%

PPT

142 W

—

Configurable TDP

—

45-75 W

Architecture

Architecture

Zen 2

Zen 4

Codename

Matisse

Dragon Range

Generation

Ryzen 9 (Zen 2 (Matisse))

Ryzen 9 (Zen 4 (Dragon Range))

Process Size

7 nm

5 nm

Transistors

7,600 million

13,140 million

Die Size

2x 74 mm²

2x 71 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

83.2 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

AMD Socket FL1

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 5, 28 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

6 nm

Graphics

Integrated Graphics

—

Radeon 610M

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$499

—

Part Number

100-000000023100-100000023BOX100-100000023MPK

100-000001849

Package

µOPGA-1331

µFC-BGAFL1

Tj Max

—

100°C

View Ryzen 9 3900X Details View Ryzen 9 8940HX Details