CPU Comparison

AMD
AMD

AMD Ryzen 9 3900X

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.8 Base / 4.6 GHz Turbo
CACHE 64 MB
MAX TDP 105W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
AMD
AMD

Ryzen 9 7945HX3D

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.3 Base / 5.4 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,788
4,922
cinebench_cinebench_r15_singlecore
393
694
cinebench_cinebench_r20_multicore
11,618
20,510
cinebench_cinebench_r20_singlecore
1,640
2,895
cinebench_cinebench_r23_multicore
27,662
48,834
cinebench_cinebench_r23_singlecore
3,905
6,894
geekbench_multicore
9,924
16,758
geekbench_singlecore
1,708
2,769
passmark_data_compression
448,906
699,988
passmark_data_encryption
28,586
42,367
passmark_extended_instructions
29,221
52,310
passmark_find_prime_numbers
214
446
passmark_floating_point_math
58,434
121,619
passmark_integer_math
99,628
201,217
passmark_multithread
32,544
57,476
passmark_physics
1,794
4,321
passmark_random_string_sorting
48,300
83,919
passmark_single_thread
2,703
4,050
passmark_singlethread
2,703
4,050
3dmark_16_threads
N/A
12,459
3dmark_2_threads
N/A
2,095
3dmark_4_threads
N/A
3,937
3dmark_8_threads
N/A
7,330
3dmark_max_threads
N/A
12,936
3dmark_single_thread
N/A
1,071

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900X
9 7945HX3D
Core Specs
Cores
12
16 +33.3%
Threads
24
32 +33.3%
Base Clock (GHz)
3.8
2.3 -39.5%
Boost Clock (GHz)
4.6
5.4 +17.4%
Frequency (GHz)
3.8
2.3 -39.5%
Turbo Clock (GHz)
4.6
5.4 +17.4%
Multiplier
38
23 -39.5%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
64 MB
128 MB (shared)
3D V-Cache
1x 64MB Slice
Power
TDP (W)
105
55 -47.6%
PPT
142 W
55-75 W
Architecture
Architecture
Zen 2
Zen 4
Codename
Matisse
Dragon Range
Generation
Ryzen 9 (Zen 2 (Matisse))
Ryzen 9 (Zen 4 (Dragon Range))
Process Size
7 nm
5 nm
Transistors
7,600 million
17,840 million
Die Size
2x 74 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
83.2 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket AM4
AMD Socket FL1
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
6 nm
Graphics
Integrated Graphics
Radeon 610M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$499
Part Number
100-000000023100-100000023BOX100-100000023MPK
100-000001086
Package
µOPGA-1331
µFC-BGAFL1
Tj Max
100°C
View Ryzen 9 3900X Details View Ryzen 9 7945HX3D Details