CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900X

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.8 Base / 4.6 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Xeon Platinum 8260M

CORE STATE Cascade Lake-SP

CORE SPECS 24 Cores / 48 Threads

CLOCK SPEED 2.4 Base / 3.9 GHz Turbo

CACHE 35.75 MB (shared)

MAX TDP 165W

ARCHITECTURE Cascade Lake

nm

PROCESS 14 nm

LAUNCH DATE 2018

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,788

2,963

cinebench_cinebench_r15_singlecore

393

418

cinebench_cinebench_r20_multicore

11,618

12,349

cinebench_cinebench_r20_singlecore

1,640

1,743

cinebench_cinebench_r23_multicore

27,662

29,403

cinebench_cinebench_r23_singlecore

3,905

4,151

geekbench_multicore

9,924

N/A

geekbench_singlecore

1,708

N/A

passmark_data_compression

448,906

573,896

passmark_data_encryption

28,586

17,625

passmark_extended_instructions

29,221

35,529

passmark_find_prime_numbers

214

141

passmark_floating_point_math

58,434

73,514

passmark_integer_math

99,628

129,213

passmark_multithread

32,544

34,592

passmark_physics

1,794

2,080

passmark_random_string_sorting

48,300

69,236

passmark_single_thread

2,703

2,320

passmark_singlethread

2,703

2,320

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900X

Platinum 8260M

Core Specs

Cores

12

24 +100.0%

Threads

24

48 +100.0%

Base Clock (GHz)

3.8

2.4 -36.8%

Boost Clock (GHz)

4.6

3.9 -15.2%

Frequency (GHz)

3.8

2.4 -36.8%

Turbo Clock (GHz)

4.6

3.9 -15.2%

Multiplier

38

24 -36.8%

SMP CPUs

1

8 +700.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

35.75 MB (shared)

Power

TDP (W)

105

165 +57.1%

PPT

142 W

—

Architecture

Architecture

Zen 2

Cascade Lake

Codename

Matisse

Cascade Lake-SP

Generation

Ryzen 9 (Zen 2 (Matisse))

Xeon Platinum (Cascade Lake-SP)

Process Size

7 nm

14 nm

Transistors

7,600 million

8,000 million

Die Size

2x 74 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

51.2 GB/s

—

ECC Memory

No

Yes

Platform

Socket

AMD Socket AM4

Intel Socket 3647

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

—

AMD Multi-Die

IO Process Size

12 nm

—

Other

Market

Desktop

Server/Workstation

Production Status

Active

—

Launch Price

$499

—

Part Number

100-000000023100-100000023BOX100-100000023MPK

SRF9JCD8069504201201

Package

µOPGA-1331

FC-LGA3647

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