CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900X

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.8 Base / 4.6 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Xeon Phi 7210

CORE STATE Knights Landing

CORE SPECS 64 Cores / 256 Threads

CLOCK SPEED 1300 Base / 1500 GHz Turbo

CACHE —

MAX TDP 215W

ARCHITECTURE Knights Landing

nm

PROCESS 14 nm

LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,788

625

cinebench_cinebench_r15_singlecore

393

88

cinebench_cinebench_r20_multicore

11,618

2,608

cinebench_cinebench_r20_singlecore

1,640

367

cinebench_cinebench_r23_multicore

27,662

6,210

cinebench_cinebench_r23_singlecore

3,905

876

geekbench_multicore

9,924

N/A

geekbench_singlecore

1,708

N/A

passmark_data_compression

448,906

332,960

passmark_data_encryption

28,586

3,455

passmark_extended_instructions

29,221

18,359

passmark_find_prime_numbers

214

10

passmark_floating_point_math

58,434

29,356

passmark_integer_math

99,628

84,874

passmark_multithread

32,544

7,306

passmark_physics

1,794

198

passmark_random_string_sorting

48,300

8,956

passmark_single_thread

2,703

460

passmark_singlethread

2,703

460

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900X

Phi 7210

Core Specs

Cores

12

64 +433.3%

Threads

24

256 +966.7%

Base Clock (GHz)

3.8

1,300 +34110.5%

Boost Clock (GHz)

4.6

1,500 +32508.7%

Frequency (GHz)

3.8

1,300 +34110.5%

Turbo Clock (GHz)

4.6

1,500 +32508.7%

Multiplier

38

13 -65.8%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

32 KB (per core)

L2 Cache

512 KB (per core)

512 KB (per core)

L3 Cache

64 MB

—

Power

TDP (W)

105

215 +104.8%

PPT

142 W

—

Architecture

Architecture

Zen 2

Knights Landing

Codename

Matisse

Knights Landing

Generation

Ryzen 9 (Zen 2 (Matisse))

Xeon Phi (Knights Landing)

Process Size

7 nm

14 nm

Transistors

7,600 million

8,000 million

Die Size

2x 74 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

51.2 GB/s

—

ECC Memory

No

Yes

Platform

Socket

AMD Socket AM4

Intel Socket 3647

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

—

AMD Multi-Die

IO Process Size

12 nm

—

Other

Market

Desktop

Server/Workstation

Production Status

Active

—

Launch Price

$499

—

Part Number

100-000000023100-100000023BOX100-100000023MPK

SR2MESR2X4

Package

µOPGA-1331

FC-LGA3647

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