CPU Comparison

AMD
AMD

AMD Ryzen 9 3900X

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.8 Base / 4.6 GHz Turbo
CACHE 64 MB
MAX TDP 105W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Core i3-10320

CORE STATE Comet Lake
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.8 Base / 4.6 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 91W
ARCHITECTURE Comet Lake
nm
PROCESS 14 nm
LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,788
855
cinebench_cinebench_r15_singlecore
393
120
cinebench_cinebench_r20_multicore
11,618
3,563
cinebench_cinebench_r20_singlecore
1,640
502
cinebench_cinebench_r23_multicore
27,662
8,484
cinebench_cinebench_r23_singlecore
3,905
1,197
geekbench_multicore
9,924
N/A
geekbench_singlecore
1,708
N/A
passmark_data_compression
448,906
140,255
passmark_data_encryption
28,586
3,458
passmark_extended_instructions
29,221
9,284
passmark_find_prime_numbers
214
32
passmark_floating_point_math
58,434
19,483
passmark_integer_math
99,628
31,071
passmark_multithread
32,544
9,982
passmark_physics
1,794
689
passmark_random_string_sorting
48,300
17,821
passmark_single_thread
2,703
2,841
passmark_singlethread
2,703
2,841

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900X
i3-10320
Core Specs
Cores
12
4 -66.7%
Threads
24
8 -66.7%
Base Clock (GHz)
3.8
3.8 0.0%
Boost Clock (GHz)
4.6
4.6 0.0%
Frequency (GHz)
3.8
3.8 0.0%
Turbo Clock (GHz)
4.6
4.6 0.0%
Multiplier
38
38 0.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
64 MB
8 MB (shared)
Power
TDP (W)
105
91 -13.3%
PL1
โ€”
65 W
PL2
โ€”
90 W
PPT
142 W
โ€”
Architecture
Architecture
Zen 2
Comet Lake
Codename
Matisse
Comet Lake
Generation
Ryzen 9 (Zen 2 (Matisse))
Core i3 (Comet Lake)
Process Size
7 nm
14 nm
Transistors
7,600 million
โ€”
Die Size
2x 74 mmยฒ
โ€”
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
42.7 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
Intel Socket 1200
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
โ€”
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 3, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
โ€”
Graphics
Integrated Graphics
โ€”
UHD Graphics 630
Other
Market
Desktop
Desktop
Production Status
Active
Active
Launch Price
$499
โ€”
Part Number
100-000000023100-100000023BOX100-100000023MPK
SRH3G
Package
ยตOPGA-1331
FC-LGA1200
Tj Max
โ€”
100ยฐC
View Ryzen 9 3900X Details View Core i3-10320 Details