CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900X

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.8 Base / 4.6 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

A

AMD

AMD

Ryzen AI 5 340

CORE STATE Krackan Point

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 2000 Base / 4.8 GHz Turbo

CACHE 8 MB

MAX TDP 28W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,788

1,731

cinebench_cinebench_r15_singlecore

393

244

cinebench_cinebench_r20_multicore

11,618

7,214

cinebench_cinebench_r20_singlecore

1,640

1,018

cinebench_cinebench_r23_multicore

27,662

17,178

cinebench_cinebench_r23_singlecore

3,905

2,425

geekbench_multicore

9,924

N/A

geekbench_singlecore

1,708

N/A

passmark_data_compression

448,906

236,893

passmark_data_encryption

28,586

11,901

passmark_extended_instructions

29,221

16,887

passmark_find_prime_numbers

214

72

passmark_floating_point_math

58,434

41,392

passmark_integer_math

99,628

65,612

passmark_multithread

32,544

20,196

passmark_physics

1,794

1,137

passmark_random_string_sorting

48,300

25,813

passmark_single_thread

2,703

3,873

passmark_singlethread

2,703

3,873

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900X

AI 5 340

Core Specs

Cores

12

6 -50.0%

Threads

24

12 -50.0%

Base Clock (GHz)

3.8

2,000 +52531.6%

Boost Clock (GHz)

4.6

4.8 +4.3%

Frequency (GHz)

3.8

2,000 +52531.6%

Turbo Clock (GHz)

4.6

4.8 +4.3%

Multiplier

38

20 -47.4%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

8 MB

Power

TDP (W)

105

28 -73.3%

PPT

142 W

—

Configurable TDP

—

15-54 W

Architecture

Architecture

Zen 2

Zen 5

Codename

Matisse

Krackan Point

Generation

Ryzen 9 (Zen 2 (Matisse))

Ryzen AI (Zen 5)

Process Size

7 nm

4 nm

Transistors

7,600 million

—

Die Size

2x 74 mm²

195 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5, LPDDR5X

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

89.6 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

AMD Socket FP8

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

3 + 3

E-Core Frequency

—

2000 MHz up to 3.4 GHz

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 840M

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$499

—

Part Number

100-000000023100-100000023BOX100-100000023MPK

100-000001602

Package

µOPGA-1331

FP8

Tj Max

—

100°C

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