CPU Comparison
AMD
AMD Ryzen 9 3900X
CORE STATE
Matisse
CORE SPECS
12 Cores / 24 Threads
CLOCK SPEED
3.8 Base / 4.6 GHz Turbo
CACHE
64 MB
MAX TDP
105W
ARCHITECTURE
Zen 2
PROCESS
7 nm
LAUNCH DATE
2019
VS
AMD
Ryzen 9 8945HS
CORE STATE
Hawk Point
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
4 Base / 5.2 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
45W
ARCHITECTURE
Zen 4
PROCESS
4 nm
LAUNCH DATE
2023
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
DETAILED SPECIFICATIONS
SPECIFICATION
9 3900X
9 8945HS
Core Specs
Cores
12
8
-33.3%
Threads
24
16
-33.3%
Base Clock (GHz)
3.8
4
+5.3%
Boost Clock (GHz)
4.6
5.2
+13.0%
Frequency (GHz)
3.8
4
+5.3%
Turbo Clock (GHz)
4.6
5.2
+13.0%
Multiplier
38
40
+5.3%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
64 MB
16 MB (shared)
Power
TDP (W)
105
45
-57.1%
PPT
142 W
โ
Configurable TDP
โ
35-54 W
Architecture
Architecture
Zen 2
Zen 4
Codename
Matisse
Hawk Point
Generation
Ryzen 9
(Zen 2 (Matisse))
Ryzen 9
(Zen 4 (Hawk Point))
Process Size
7 nm
4 nm
Transistors
7,600 million
25,000 million
Die Size
2x 74 mmยฒ
178 mmยฒ
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
89.6 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
AMD Socket FP8
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
โ
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
โ
AI/NPU
NPU
โ
Yes /
16 TOPS
Graphics
Integrated Graphics
โ
Radeon 780M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$499
โ
Part Number
100-000000023100-100000023BOX100-100000023MPK
100-000001319(FP7r2)100-000001383(FP7)100-000001309(FP8)
Package
ยตOPGA-1331
FP8, FP7, FP7r2
Tj Max
โ
100ยฐC