CPU Comparison

A

AMD

AMD

AMD Ryzen 5 7533HS

CORE STATE Rembrandt-R

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 3.3 Base / 4.4 GHz Turbo

CACHE 16 MB (shared)

MAX TDP 35W

ARCHITECTURE Zen 3+

nm

PROCESS 6 nm

LAUNCH DATE —

VS

A

AMD

AMD

Ryzen 9 3900X

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.8 Base / 4.6 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,243

2,788

cinebench_cinebench_r15_singlecore

175

393

cinebench_cinebench_r20_multicore

5,183

11,618

cinebench_cinebench_r20_singlecore

731

1,640

cinebench_cinebench_r23_multicore

12,342

27,662

cinebench_cinebench_r23_singlecore

1,742

3,905

passmark_data_compression

168,692

448,906

passmark_data_encryption

10,718

28,586

passmark_extended_instructions

11,219

29,221

passmark_find_prime_numbers

48

214

passmark_floating_point_math

27,800

58,434

passmark_integer_math

50,800

99,628

passmark_multithread

14,520

32,544

passmark_physics

821

1,794

passmark_random_string_sorting

17,669

48,300

passmark_single_thread

2,740

2,703

passmark_singlethread

2,740

2,703

geekbench_multicore

N/A

9,924

geekbench_singlecore

N/A

1,708

DETAILED SPECIFICATIONS

SPECIFICATION

5 7533HS

9 3900X

Core Specs

Cores

6

12 +100.0%

Threads

12

24 +100.0%

Base Clock (GHz)

3.3

3.8 +15.2%

Boost Clock (GHz)

4.4

4.6 +4.5%

Frequency (GHz)

3.3

3.8 +15.2%

Turbo Clock (GHz)

4.4

4.6 +4.5%

Multiplier

33

38 +15.2%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

512 KB (per core)

L3 Cache

16 MB (shared)

64 MB

Power

TDP (W)

35

105 +200.0%

PPT

—

142 W

Configurable TDP

35-54 W

—

Architecture

Architecture

Zen 3+

Zen 2

Codename

Rembrandt-R

Matisse

Generation

Ryzen 5 (Zen 3+ (Rembrandt))

Ryzen 9 (Zen 2 (Matisse))

Process Size

6 nm

7 nm

Transistors

—

7,600 million

Die Size

208 mm²

2x 74 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

76.8 GB/s

51.2 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket FP7

AMD Socket AM4

Chipsets

—

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 24 Lanes(CPU only)

AMD Multi-Die

IO Process Size

—

12 nm

Graphics

Integrated Graphics

Radeon 660M

—

Other

Market

Mobile

Desktop

Production Status

Active

Active

Launch Price

—

$499

Part Number

100-000001632(FP7)100-000001634(FP7r2)

100-000000023100-100000023BOX100-100000023MPK

Package

FP7, FP7r2

µOPGA-1331

Tj Max

95°C

—

View Ryzen 5 7533HS Details View Ryzen 9 3900X Details