CPU Comparison

A

AMD

AMD

AMD Ryzen 5 7235HS

CORE STATE Rembrandt-R

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.2 Base / 4.2 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 45W

ARCHITECTURE Zen 3+

nm

PROCESS 6 nm

LAUNCH DATE —

VS

A

AMD

AMD

Ryzen 9 3900X

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.8 Base / 4.6 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,050

2,788

cinebench_cinebench_r15_singlecore

148

393

cinebench_cinebench_r20_multicore

4,375

11,618

cinebench_cinebench_r20_singlecore

617

1,640

cinebench_cinebench_r23_multicore

10,418

27,662

cinebench_cinebench_r23_singlecore

1,470

3,905

passmark_data_compression

152,168

448,906

passmark_data_encryption

9,051

28,586

passmark_extended_instructions

10,887

29,221

passmark_find_prime_numbers

31

214

passmark_floating_point_math

23,091

58,434

passmark_integer_math

40,174

99,628

passmark_multithread

12,243

32,544

passmark_physics

574

1,794

passmark_random_string_sorting

15,294

48,300

passmark_single_thread

2,873

2,703

passmark_singlethread

2,873

2,703

geekbench_multicore

N/A

9,924

geekbench_singlecore

N/A

1,708

DETAILED SPECIFICATIONS

SPECIFICATION

5 7235HS

9 3900X

Core Specs

Cores

4

12 +200.0%

Threads

8

24 +200.0%

Base Clock (GHz)

3.2

3.8 +18.7%

Boost Clock (GHz)

4.2

4.6 +9.5%

Frequency (GHz)

3.2

3.8 +18.7%

Turbo Clock (GHz)

4.2

4.6 +9.5%

Multiplier

32

38 +18.8%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

512 KB (per core)

L3 Cache

8 MB (shared)

64 MB

Power

TDP (W)

45

105 +133.3%

PPT

—

142 W

Configurable TDP

35-54 W

—

Architecture

Architecture

Zen 3+

Zen 2

Codename

Rembrandt-R

Matisse

Generation

Ryzen 5 (Zen 3+ (Rembrandt))

Ryzen 9 (Zen 2 (Matisse))

Process Size

6 nm

7 nm

Transistors

—

7,600 million

Die Size

210 mm²

2x 74 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

76.8 GB/s

51.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FP7

AMD Socket AM4

Chipsets

—

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 24 Lanes(CPU only)

AMD Multi-Die

IO Process Size

—

12 nm

Graphics

Integrated Graphics

Radeon 660M

—

Other

Market

Mobile

Desktop

Production Status

Active

Active

Launch Price

—

$499

Part Number

100-000001507

100-000000023100-100000023BOX100-100000023MPK

Package

FP7r2

µOPGA-1331

Tj Max

95°C

—

View Ryzen 5 7235HS Details View Ryzen 9 3900X Details