CPU Comparison

A

AMD

AMD

AMD Ryzen 7 PRO 5845

CORE STATE Vermeer

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.4 Base / 4.6 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 65W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2022

VS

A

AMD

AMD

Ryzen AI Max+ PRO 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,232

4,456

cinebench_cinebench_r15_singlecore

314

629

cinebench_cinebench_r20_multicore

9,300

18,569

cinebench_cinebench_r20_singlecore

1,312

2,621

cinebench_cinebench_r23_multicore

22,145

44,213

cinebench_cinebench_r23_singlecore

3,126

6,241

passmark_data_compression

314,363

641,407

passmark_data_encryption

19,815

33,060

passmark_extended_instructions

21,117

52,214

passmark_find_prime_numbers

115

285

passmark_floating_point_math

52,105

120,557

passmark_integer_math

94,884

191,369

passmark_multithread

26,054

52,005

passmark_physics

1,109

3,311

passmark_random_string_sorting

33,754

71,439

passmark_single_thread

3,442

4,132

passmark_singlethread

3,442

4,132

DETAILED SPECIFICATIONS

SPECIFICATION

7 PRO 5845

AI Max+ PRO 395

Core Specs

Cores

8

16 +100.0%

Threads

16

32 +100.0%

Base Clock (GHz)

3.4

3 -11.8%

Boost Clock (GHz)

4.6

5.1 +10.9%

Frequency (GHz)

3.4

3 -11.8%

Turbo Clock (GHz)

4.6

5.1 +10.9%

Multiplier

34

30 -11.8%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

32 MB (shared)

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

—

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Vermeer

Strix Halo

Generation

Ryzen 7 (Zen 3 (Vermeer))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

4,150 million

—

Die Size

74 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

51.2 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FP11

Chipsets

AMD 300 Series*, AMD 400 Series, AMD 500 Series

—

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000000832

100-000001243

Package

µOPGA-1331

FC-BGA

Tj Max

—

100°C

Bundled Cooler

None

—

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