CPU Comparison
AMD
AMD Ryzen 7 PRO 1700
CORE STATE
Zen
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3 Base / 3.7 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
65W
ARCHITECTURE
Zen
PROCESS
14 nm
LAUNCH DATE
2017
VS
INTEL
Mobile Pentium III 500 ULV
CORE STATE
Coppermine
CORE SPECS
1 Cores / 1 Threads
CLOCK SPEED
500 Base
CACHE
ā
MAX TDP
5W
ARCHITECTURE
P6
PROCESS
180 nm
LAUNCH DATE
2001
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
7 PRO 1700
Mobile Pentium III 500 ULV
Core Specs
Cores
8
1
-87.5%
Threads
16
1
-93.8%
Base Clock (GHz)
3
500
+16566.7%
Boost Clock (GHz)
3.7
ā
Frequency (GHz)
3
500
+16566.7%
Turbo Clock (GHz)
3.7
ā
Multiplier
30
5
-83.3%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
96 KB (per core)
32 KB
L2 Cache
512 KB (per core)
256 KB
L3 Cache
16 MB (shared)
ā
Power
TDP (W)
65
5
-92.3%
Architecture
Architecture
Zen
P6
Codename
Zen
Coppermine
Generation
Ryzen 7
(Zen (Summit Ridge))
Pentium III
(Coppermine)
Process Size
14 nm
180 nm
Transistors
4,800 million
28 million
Die Size
213 mm²
106 mm²
Foundry
GlobalFoundries
Intel
Memory
Memory Support
DDR4
unknown
Depends on motherboard
Memory Bus
Dual-channel
Single-channel
Memory Bandwidth
42.7 GB/s
ā
ECC Memory
Yes
No
Platform
Socket
AMD Socket AM4
Intel Micro-BGA2
PCIe
Gen 3, 16 Lanes(CPU only)
ā
Graphics
Integrated Graphics
ā
On certain motherboards (Chipset feature)
Other
Market
Desktop
Mobile
Production Status
Active
End-of-life
Launch Price
ā
$208
Part Number
YD170BBBM88AE
SL4ZHSL5P4
Package
µOPGA-1331
H-PBGA495
Tj Max
95°C
100°C