CPU Comparison
AMD
AMD Ryzen 7 5700U
CORE STATE
Lucienne
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
1800 Base / 4.3 GHz Turbo
CACHE
8 MB (shared)
MAX TDP
15W
ARCHITECTURE
Zen 2
PROCESS
7 nm
LAUNCH DATE
2021
VS
AMD
Ryzen 9 3900X
CORE STATE
Matisse
CORE SPECS
12 Cores / 24 Threads
CLOCK SPEED
3.8 Base / 4.6 GHz Turbo
CACHE
64 MB
MAX TDP
105W
ARCHITECTURE
Zen 2
PROCESS
7 nm
LAUNCH DATE
2019
PERFORMANCE BENCHMARKS
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
7 5700U
9 3900X
Core Specs
Cores
8
12
+50.0%
Threads
16
24
+50.0%
Base Clock (GHz)
1,800
3.8
-99.8%
Boost Clock (GHz)
4.3
4.6
+7.0%
Frequency (GHz)
1,800
3.8
-99.8%
Turbo Clock (GHz)
4.3
4.6
+7.0%
Multiplier
18
38
+111.1%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
512 KB (per core)
L3 Cache
8 MB (shared)
64 MB
Power
TDP (W)
15
105
+600.0%
PPT
โ
142 W
Configurable TDP
25W
โ
Architecture
Architecture
Zen 2
Zen 2
Codename
Lucienne
Matisse
Generation
Ryzen 7
(Zen 2 (Lucienne))
Ryzen 9
(Zen 2 (Matisse))
Process Size
7 nm
7 nm
Transistors
9,800 million
7,600 million
Die Size
156 mmยฒ
2x 74 mmยฒ
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
51.2 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket FP6
AMD Socket AM4
Chipsets
โ
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 3, 12 Lanes(CPU only)
Gen 4, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
โ
12 nm
Graphics
Integrated Graphics
Radeon Graphics 512SP
โ
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
โ
$499
Part Number
100-000000371
100-000000023100-100000023BOX100-100000023MPK
Package
FP6
ยตOPGA-1331
Tj Max
105ยฐC
โ